KR102590304B1 - Evaporation source apparatus, vapor deposition apparatus and vapor deposition system - Google Patents

Abstract

[Task] Suppress the temperature rise of the limiting member.
[Solution] An evaporation source device comprising a container for storing evaporation material, a cooling member, and a limiting member for limiting the radiation angle of the evaporation material discharged from the opening of the container to a certain angle or less, wherein the limiting member includes a cooling member and The cooling member is arranged to sandwich at least a portion of the container, and the limiting member has a cross-section that includes the normal direction of the opening surface of the opening and is perpendicular to the opposing surface of the limiting member. An evaporation source device is used, which is disposed so as to sandwich at least a portion of the evaporation source device.

Description

Evaporation source device, deposition device and deposition system {EVAPORATION SOURCE APPARATUS, VAPOR DEPOSITION APPARATUS AND VAPOR DEPOSITION SYSTEM}

The present invention relates to an evaporation source device, a vapor deposition device, and a vapor deposition system.

Recently, an organic EL device equipped with an organic EL element using electroluminescence of organic materials has been attracting attention as a type of display. In the manufacture of organic electronic devices such as organic EL displays, there is a process of forming a film by depositing an evaporation material such as an organic material or a metal electrode material on a substrate using an evaporation source device.

In the vapor deposition device of Patent Document 1, when the vapor of the organic material generated inside the container constituting the evaporation source device is released from the opening of the container, it passes through the discharge port defined by the vapor adjustment member and is released into the inside of the vacuum tank. . Furthermore, on the steam regulating member, a cylindrical deposition prevention plate is disposed with one end of the cylindrical tube facing toward the substrate holder and the other end toward the discharge port. The vapor of the organic material released from the discharge port passes through the inside of the cylindrical deposition prevention plate and is released from the opening at the end of the substrate holder side.

Japanese Patent Publication No. 2005-325391

The deposition prevention plate described in Patent Document 1 functions as a limiting member that limits the radiation angle of the vapor deposition material. Heat from a heater that heats the vessel or container is applied to the deposition shield, either directly by radiation or indirectly through vapor of an organic material. When heat is applied to the deposition prevention plate, there is a possibility that the substrate on which the film is formed may be heated by the heat. If the substrate on which the film is to be formed is heated excessively, the circuit or pixel formed on the substrate may be damaged, which is not preferable.

Accordingly, the present invention aims to suppress the temperature rise of the limiting member in consideration of the above-mentioned problems.

An evaporation source device as one aspect of the present invention is an evaporation source device including a container for storing evaporation material, a cooling member, and a limiting member that limits the radiation angle of the evaporation material discharged from the opening of the container to a certain angle or less, The limiting member has an opposing surface that faces the cooling member, and has a cross-section that includes a normal direction to the opening surface of the opening and is perpendicular to the opposing surface, so that the cooling member sandwiches at least a portion of the container. and the limiting member is disposed to sandwich at least a portion of the cooling member.

An evaporation source device as another aspect of the present invention includes a plurality of containers each containing evaporation materials, a plurality of cooling members, and a radiation angle of the evaporation materials emitted from each opening of the plurality of containers at a certain angle or less. An evaporation source device provided with a plurality of limiting members, wherein each of the plurality of limiting members has an opposing surface facing each of the cooling members, and, with respect to each of the plurality of containers, an opening surface of the opening is In a cross section including a normal direction and perpendicular to the opposing surface, each of the plurality of cooling members is arranged to sandwich at least a portion of each of the plurality of containers, and each of the plurality of limiting members is disposed between the plurality of containers. It is arranged to sandwich at least a portion of each cooling member, the plurality of containers are arranged side by side, and the two limiting members corresponding to each of the two adjacent containers are arranged to face each other.

According to the present invention, the temperature rise of the limiting member can be suppressed.

1 is a schematic cross-sectional view of a vapor deposition apparatus.
Figure 2 is a schematic diagram of the evaporation source device of Example 1.
Figure 3 is a schematic diagram of the evaporation source device of Example 2.
Figure 4 is a schematic diagram of the evaporation source device of Example 3.
Figure 5 is a schematic diagram of the evaporation source device of Example 4.
Figure 6 is a schematic diagram of the evaporation source device of Example 5.
7 is an explanatory diagram of an organic EL display device.

Hereinafter, with reference to the drawings, modes for carrying out the present invention will be described in detail by way of example based on examples. However, the dimensions, materials, shapes, and relative arrangements of the components described in this embodiment may be appropriately changed depending on the configuration of the device to which the invention is applied or various conditions. That is, it is not intended to limit the scope of the present invention to the following embodiments. Additionally, it goes without saying that appropriate combinations of the embodiments described below are also included in the scope of the present invention.

[Example 1]

＜Schematic configuration of vacuum device＞

FIG. 1 is a schematic diagram showing the configuration of a deposition apparatus (film formation apparatus) 100. The deposition apparatus 100 has a vacuum chamber 200. The interior of the vacuum chamber 200 is maintained in a reduced pressure atmosphere. Inside the vacuum chamber 200, a substrate 10 as a processing target held by a processing target installation stand (substrate holder) 210, a mask 220, and an evaporation source device 240 are installed. The object mounting table 210 is provided with supports such as fingers for placing the substrate 10 and pressure tools such as clamps for pressing and holding the substrate, and holds the substrate.

The substrate 10 is transferred into the vacuum chamber 200 by a transfer robot (not shown) disposed on the substrate transfer device, and then held by the object mounting table 210, and is placed on a horizontal plane (XY plane) during film formation. It is fixed so that it is parallel to . A plurality of vapor deposition devices including the vapor deposition device 100 are connected to the substrate transport device to construct a vapor deposition system. The mask 220 is a mask having an opening pattern corresponding to a predetermined thin film pattern formed on the substrate 10, and is, for example, a metal mask. When forming a film, the substrate 10 is placed on the mask 220.

In addition, the vacuum chamber 200 may be provided with a cooling plate (not shown) to suppress the temperature rise of the substrate 10. Additionally, an alignment mechanism (not shown) for aligning at least one of the substrate 10 and the mask 220 may be provided on the vacuum chamber 200. The alignment mechanism is, for example, an actuator that moves at least one of the substrate 10 and the mask 220 in the X direction or the Y direction, or a clamp for holding at least one of the substrate 10 and the mask 220. A driving means such as an actuator for machinery may be provided. Additionally, the alignment mechanism may be provided with a camera that captures images of at least one of the substrate 10 and the mask 220.

The evaporation source device 240 includes a container 400 that accommodates and holds the evaporation material 242, heats the evaporation material 242, and releases vapor of the evaporation material 242 from the opening of the container 400. It is provided with a heating unit 430 that heats the container 400. Each other component will be described in detail later. In addition to the evaporation source device 240, the deposition apparatus 100 may be equipped with a shutter for suppressing the emission of the deposition material 242, a film thickness monitor for measuring the film thickness of the film formed on the substrate 10, etc. ( not all shown). Additionally, the vapor deposition apparatus 100 may be provided with a movement mechanism 250 that moves the evaporation source device 240 in order to uniformly form a film. The moving mechanism 250 is preferably a mechanism that moves the evaporation source device 240 in the 10) may be a mechanism that moves in a direction perpendicular to the substrate surface. The moving mechanism 250 preferably has a configuration capable of mounting the evaporation source device 240. In addition, the shape, positional relationship, and size ratio of each component of the evaporation source device 240 in FIG. 1 are merely examples.

The material of the container 400 may be, for example, ceramic, metal, carbon, etc., but is not limited thereto, and may be selected from the physical properties of the deposition material 242 or the heating temperature by the heating unit 430. use it Among them, the material of the container 400 is preferably a high-melting point metal such as tungsten, rhenium, tantalum, molybdenum, niobium, vanadium, hafnium, zirconium, titanium, or an alloy containing these metals. Here, the high melting point metal refers to a metal having a higher melting point than the melting point of iron.

Examples of the heating unit 430 include, but are not limited to, a resistance heating type heating unit such as a sheath heating unit or a metal wire wire, and the heating unit 430 may be provided as long as it has a heating capability to evaporate the deposition material 242. Additionally, regarding the shape of the heating unit, in addition to the plate shape as shown in FIG. 1, any shape such as a wire shape or a mesh shape can be adopted. During vapor deposition, the temperature of the heating unit 430 is preferably controlled to the same temperature at which the vapor deposition material 242 is in a gaseous state, and is preferably controlled to be 250°C or higher and 1400°C or lower. During vapor deposition, the temperature of the heating unit 430 is preferably controlled to be 250°C or higher and 450°C or lower when the deposition material 242 is an organic material, and when the deposition material 242 is a metal material, It is desirable to control the temperature to be 650°C or higher and 1400°C or lower.

The deposition apparatus 100 has a control unit 270 . The control unit 270 controls the evaporation source device 240, for example, timing control of the start and end of heating, temperature control, opening and closing timing when installing a shutter, and controlling the timing of opening and closing when installing the moving mechanism 250. performs movement control, etc. Additionally, the control unit 270 may be configured by combining a plurality of control means. The plurality of control means include, for example, a heating control means, a shutter control means, a movement control means of an evaporation source movement mechanism, etc. The control unit 270 may also serve as a control means for mechanisms other than the evaporation source device 240, such as a transport and alignment control means for the substrate 10.

The control unit 270 can be configured by, for example, a computer having a processor, memory, storage, I/O, UI, etc. In this case, the function of the control unit 270 is realized by the processor executing a program stored in memory or storage. As a computer, a general-purpose computer may be used, an embedded computer, or a PLC (programmable logic controller) may be used. Alternatively, part or all of the functions of the control unit 270 may be configured with a circuit such as ASIC or FPGA. Additionally, a control unit 270 may be installed for each deposition apparatus, or one control unit 270 may control a plurality of deposition apparatuses.

When the deposition material 242 is accommodated inside the container 400 and preparations such as placement of the substrate 10 on the mask 220 (or placement of the mask 220 on the substrate 10) and alignment are completed, Under the control of the control unit 270, the heating unit 430 starts operating, and the deposition material 242 is heated. When the temperature becomes sufficiently high, the deposition material 242 evaporates, and the gaseous deposition material 242 is released from the opening 401 of the container 400 and adheres to the surface of the substrate 10 to form a film. The deposition material 242 discharged from the container 400 is a gas (vapor) of the deposition material 242, and this vapor is heated by the heating unit 430. It is also possible to perform co-evaporation by storing separate types of deposition materials in a plurality of containers.

By controlling the film thickness of the formed film by measuring it using a film thickness monitor (not shown) or the like, a film having a desired thickness is formed on the substrate. In order to form a film with a uniform thickness, for example, deposition may be performed while rotating the substrate 10 or moving the evaporation source device 240 using the moving mechanism 250. Additionally, depending on the size of the substrate 10, it is also preferable to heat a plurality of containers 400 in parallel.

The shape of the container 400 is arbitrary. The evaporation source device 240 may be a point-shaped evaporation source device having one opening for discharging the deposition material 242, and may be provided with a plurality of openings for discharging the deposition material 242, and may be a line in which the plurality of openings are arranged in a line. It may be an evaporation source device of any shape. Alternatively, it may be a planar evaporation source device provided with a plurality of openings for discharging the evaporation material 242, and the plurality of openings are two-dimensionally arranged in a planar shape. In the case where a plurality of point-shaped evaporation source devices are prepared and the material runs out, A revolver-type evaporation source device that replaces the evaporation source device used may also be used.

As will be described later, a multi-layer structure can be formed by depositing a different type of deposition material on a substrate on which a certain type of deposition material has been deposited. In that case, the evaporation material in the container may be replaced, or the container itself may be replaced with one containing a different type of evaporation material. Additionally, a plurality of evaporation source devices may be installed and exchanged in a vacuum chamber, and the substrate 10 may be removed from the current evaporation device and transferred to another evaporation device equipped with an evaporation source device containing different types of evaporation materials. You can do it.

＜Detailed configuration of the evaporation source device＞

FIG. 2(a) is a schematic cross-sectional view for explaining the configuration of the evaporation source device 240 of this embodiment. FIG. 2(b) is a schematic top view of the linear evaporation source device 240, and FIG. 2(c) is a schematic top view of the point-shaped evaporation source device 240. The A-A cross section of FIGS. 2(b) and (c) is shown in FIG. 2(a). In addition, the A-A cross section includes the normal direction of the opening surface of the opening 401 of the container 400, which will be described later, and is a cross section perpendicular to the opposing surface facing the cooling member 420 of the limiting member 410. . Configurations in FIG. 2(a) to (c) that are common to FIG. 1 are given the same reference numerals, and the description is simplified.

The evaporation source device 240 includes a container 400, a limiting member 410, a cooling member 420, a heating unit 430, and a reflecting member 440. Container 400 holds deposition material. In this embodiment, container 400 is made of tantalum. By constructing the container 400 from tantalum, deformation of the container 400 can be suppressed even if the heating temperature by the heating unit 430 is raised to 1400°C. A heating unit 430 is installed on the side of the container 400 to heat the deposition material held in the container 400 and discharges the deposition material in a gaseous state from the opening 401 provided in the container 400. The heating unit 430 in this embodiment is disposed only on the side of the container 400, but may also be installed on the top or bottom of the container 400.

The cooling member 420 is disposed to cover at least a portion of the container 400 in which the deposition material is held in order to prevent the temperature of the entire vacuum chamber from increasing due to heat heating the deposition material. In this embodiment, the cooling member 420 is installed to surround the container 400 and the heating unit 430. A flow path (not shown) for flowing cooling liquid is installed inside the cooling member 420 to cool the cooling member 420. In this embodiment, the cooling member 420 is made of stainless steel.

The reflection member 440 is disposed between the heating unit 430 and the cooling member 420. The reflection member 440 is cooled by the cooling member 420 and, like the cooling member 420, prevents the overall temperature within the vacuum chamber from increasing due to the heat that heats the deposition material. In this embodiment, the reflective member 440 is made of molybdenum, but may be made of a material such as tungsten, iridium, or ruthenium. Additionally, the reflective member 440 may be composed of a plurality of reflective members, and a space may be provided between each reflective member.

The limiting member 410 has a function of limiting the radiation angle of the gaseous deposition material discharged from the opening 401 of the container 400 to a certain angle or less. The limiting member 410 is arranged to sandwich the container 400 in the cross section A-A of FIG. 2 and is configured to extend from the opening end of the container 400 in the direction in which the deposition material is discharged. The radiation angle of the deposition material discharged from the container 400 is limited to a certain angle or less by the limiting member 410 . As a result, the angle of incidence of the deposition material onto the substrate 10 when performing deposition in the deposition apparatus can be limited to a certain angle or less, and the patterning precision in film formation through the mask 220 can be improved. . Additionally, it is possible to prevent the deposition material from adhering to parts other than the substrate 10 and the mask 220, such as the wall of the vacuum chamber 200. In addition, in this specification, the radiation angle refers to the angle formed between the radiation direction of the deposition material radiated from the opening of the container and the normal line of the opening of the container. In addition, in this specification, the incident angle refers to the angle formed between the incident direction of the deposition material incident on the substrate and the normal line of the substrate surface of the substrate.

In this embodiment, the limiting member 410 is arranged to sandwich the cooling member 420 in the A-A cross section of FIG. 2 . The limiting member 410 is arranged to cover at least a portion of the cooling member 420 and has an opposing surface facing the cooling member 420 . With this configuration, the cooling member 420 that cools the container 400 can cool not only the container 400 but also the limiting member 410. Since the limiting member 410 limits the radiation angle of the deposition material by physically shielding a portion of the gaseous deposition material discharged from the opening 401 of the container 400, the limiting member 410 blocks the heat of the deposition material. The temperature is likely to rise due to As in the present embodiment, the limiting member 410 is disposed so as to sandwich at least a portion of the cooling member 420, so that the limiting member 410 is cooled by the cooling member 420, so that the limiting member 410 is maintained even during deposition. ) can suppress the temperature rise.

In this embodiment, the limiting member 410 is fixed to the cooling member 420 by a fixing member (not shown). The fixing member is not particularly limited, but bolts or the like can be used. By fixing the limiting member 410 to the cooling member 420 with a fixing member made of a material with high thermal conductivity, such as metal, the limiting member 410 and the cooling member 420 can be thermally connected. As a result, the cooling efficiency of the limiting member 410 by the cooling member 420 can be increased. Meanwhile, it is preferable that a space is provided between the limiting member 410 and the cooling member 420. As a result, excessive cooling of the limiting member 410 by the cooling member 420 can be prevented.

Additionally, the method of fixing the limiting member 410 to the cooling member 420 or the container 400 is not particularly limited. For example, the cooling member 420 is extended downward in the direction of gravity of the limiting member 410 to form a striking portion (not shown) that supports the limiting member 410 by striking it, thereby forming a limiting member ( 410) may be supported by striking it. According to this, the positioning of the limiting member 410 can be easily determined, and as a result, the radiation angle of the deposition material can be easily set. Additionally, collision support by the collision portion and fixation by the above-described fixing member may be combined.

In this embodiment, since the limiting member 410, the cooling member 420, and the reflecting member 440 are each plate-shaped members, the limiting member 410 is a limiting plate, and the cooling member 420 is a cooling plate. Each of the reflective members 440 may also be called a reflector. The limiting member 410 is formed of a material such as stainless steel, aluminum, titanium, or carbon, but is not limited thereto. Additionally, the limiting member 410 is not limited to being made of a single material, and may be made of multiple materials. In addition, the limiting member 410 is not limited to being composed of a single part, and may be formed by combining a plurality of parts by welding, screwing, etc. The plurality of parts constituting the limiting member 410 includes a part constituting a part of the limiting member 410 that restricts steam (restricting part), and a part of the limiting member 410 that is cooled by the cooling member 420. It may include parts constituting (base, cooling unit). A plurality of these parts need only be thermally connected so that the limiting portion is cooled by the cooling member 420 via the base.

Since the deposition material adheres to the limiting member 410 when deposition is performed, maintenance such as replacing or cleaning the limiting member 410 is required after the deposition process has been performed for a certain period of time. In this embodiment, the limiting member 410 can be detached by removing the fixing member for fixing the limiting member 410 to the cooling member 420 to release the fixation. That is, the limiting member 410 is installed to be detachable from the cooling member 420. Thereby, the above-described maintenance work can be easily performed.

More specifically, by making the limiting member 410 a cylindrical member that is one step larger than the cooling member 420, the cooling member 420 can be configured to be removable from the cylindrical limiting member 410. . According to this, by pulling out the limiting member 410 in a state in which the limiting member 410 is released from being fixed to the cooling member 420, the limiting member 410 can be moved and detached along the surface of the cooling member 420. there is. As a result, maintenance work can be performed much more easily. Alternatively, without making the limiting member 410 a cylindrical member, at least one of the limiting member 410 and the cooling member 420 is a guide that guides the relative movement of the cooling member 420 with respect to the limiting member 410. You can install the unit and leave it there. In this way, the limiting member 410 can be moved along the surface of the cooling member 420 and made detachable.

In this embodiment, the limiting member 410 is installed to surround the side surface of the cooling member 420, but it may be configured not to be disposed on a portion of the side surface of the cooling member 420.

[Example 2]

The evaporation source device 240 of this embodiment shown in FIG. 3 represents an example in which the configuration of the limiting member in the height direction of the container 400 is different from that of Example 1. Configurations that are common to other embodiments are given the same symbols and explanations are simplified. As shown in FIG. 3, the container 400 is divided and explained as follows. The nozzle portion 400(a) forms an opening 401 and is an area installed to protrude from the surface (first surface) of the container 400. The receiving portion 400(c) is an area that accommodates deposition material in a solid state or a liquid state. The evaporation portion 400(b) is located between the nozzle portion 400(a) and the receiving portion 400(c) and is an area that accommodates the vapor deposition material. The evaporation portion 400(b) is in communication with the accommodating portion 400(c), and is configured so that the gaseous deposition material generated in the accommodating portion 400(c) can move. In addition, Figure 3 includes the normal direction of the opening surface of the opening 401 of the container 400, similar to Figure 2(a), and is perpendicular to the opposing surface facing the cooling member 420 of the limiting member 412. A cross section (A-A cross section) is shown.

Additionally, in this embodiment, the vessel 400 has a crucible member 450 for accommodating the deposition material inside the container 400, and a partition member 460 disposed on the upper part of the crucible member 450. The crucible member 450 and the partition member 460 are arranged at a position opposite to the housing portion 400(c). By installing the crucible member 450, the deposition material can be easily replaced. The partition member 460 has an opening through which gaseous deposition material passes, and can prevent the deposition material from scattering due to splashing. There are no particular limitations on the shape or number of openings of the partition member 460, but it is preferable that the openings of the partition member 460 are provided at a position other than the position opposite the nozzle portion 400(a). do. As a result, scattering due to scattering of the deposition material can be further prevented.

The heating unit 430 includes a first heating unit 430(a) facing the evaporation unit 400(b), and a second heating unit 430(b) facing the receiving unit 400(c). ) is divided into two parts. With this configuration, it becomes possible to separately adjust the heating temperature of the evaporation section 400(b) and the heating temperature of the receiving section 400(c).

In general, with respect to the deposition material in a solid state or liquid state accommodated in the receiving portion 400(c), there is concern about material deterioration due to high-temperature heat. Therefore, the second heating unit 430(b) is preferably controlled to a temperature that changes the solid or liquid deposition material into a gaseous state. Specifically, it is preferable that the temperature is controlled to be around the sublimation temperature or boiling point of the deposition material. In contrast, the gaseous deposition material contained in the evaporation portion 400(b) needs to be maintained in a gaseous state so as to prevent the deposition material from solidifying in the nozzle portion 400(a). For this reason, the first heating unit 430(a) is controlled to a higher temperature than the second heating unit 430(b).

In this embodiment, the cooling member 420 includes a direction normal to the opening surface of the opening 401 of the container 400 and is perpendicular to the opposing surface facing the cooling member 420 of the limiting member 412. In cross section, it is arranged so as to sandwich the evaporation part 400(b) and the receiving part 400(c).

The limiting member 412 includes a direction normal to the opening surface of the opening 401 of the container 400, and has a cross section perpendicular to the opposing surface of the limiting member 412 facing the cooling member 420, wherein the limiting member 412 cools the container 400. It is arranged so as to sandwich the member 420 and the evaporation portion 400(b). The method of fixing the limiting member 412 to the cooling member 420 is the same as in Example 1. The limiting member 412 is arranged to cover at least a portion of the evaporation portion 400(b) and at least a portion of the cooling member 420. In this embodiment, the limiting member 412 is configured to face the first heating unit 430(a) and not to the second heating unit 430(b). However, the configuration is not limited to this, and the limiting member 412 may be configured to face a portion of the second heating unit 430(b).

[Example 3]

The evaporation source device 240 of this embodiment shown in FIG. 4 represents an example in which the configuration of the limiting member around the nozzle portion 400(a) of the container 400 is different from Examples 1 and 2. Configurations that are common to other embodiments are given the same symbols and explanations are simplified. The cooling member 420 is divided and explained as follows. The opposing portion 420(a) is an area disposed opposite to the upper surface (first surface) of the container 400 on which the nozzle portion 400(a) is disposed. The side portion 420(b) is an area disposed opposite to the side surface of the container 400. The bottom portion 420(c) is an area disposed opposite to the bottom of the container 400. In addition, Figure 4, like Figure 2(a), includes the normal direction of the opening surface of the opening 401 of the container 400, and is perpendicular to the opposing surface facing the cooling member 420 of the limiting member 414. A cross section (A-A cross section) is shown.

The limiting member 414 includes a base 414(c) facing the side of the container 400 and a limiting portion 414( b)), comprising an extension portion 414(a) extending opposite to the opposing portion 420(a) of the cooling member 420. The method of fixing the limiting member 414 to the cooling member 420 is the same as in Example 1. With this configuration, compared to Examples 1 and 2, the area where the limiting member 414 faces the cooling member 420 can be increased, and the cooling efficiency of the limiting member 414 can be improved.

[Example 4]

The evaporation source device 240 of this embodiment shown in FIG. 5 shows an example in which an intermediate portion 400(d) connecting the evaporation portion 400(b) and the receiving portion 400(c) is provided. Configurations that are common to other embodiments are given the same symbols and explanations are simplified. In addition, Figure 5, like Figure 2(a), includes the normal direction of the opening surface of the opening 401 of the container 400, and is perpendicular to the opposing surface facing the cooling member 420 of the limiting member 416. A cross section (A-A cross section) is shown.

The middle portion 400(d) communicates with each of the evaporation portion 400(b) and the receiving portion 400(c). The middle portion 400(d) has a smaller volume of a region for accommodating the deposition material than the evaporation portion 400(b) and the receiving portion 400(c). In the A-A cross section, the width 502 in the direction perpendicular to the opposing surface facing the cooling member 420 of the limiting member 416 of the middle portion 400(d) is the evaporation portion 400 ( b)) and the widths 501 and 503 of the limiting member 416 of the receiving portion 400(c) in the direction perpendicular to the opposing surface facing the cooling member 420. Furthermore, the evaporation section 400(b) has a smaller volume of a region for accommodating the evaporation material than the receiving section 400(c). In the A-A cross section, the width 501 in the direction perpendicular to the opposing surface facing the cooling member 420 of the limiting member 416 of the evaporation portion 400(b) is equal to the width 501 of the receiving portion 400(b). It is smaller than the width 503 of the limiting member 416 of c)) in the direction perpendicular to the opposing surface facing the cooling member 420. In addition, in the case of this embodiment, each of the above widths can be rephrased as “width in the direction in which it is inserted into the limiting member.”

The reflecting member 440 includes a first reflecting member 440 (a) facing the evaporation part 400 (b), and a second reflecting member 440 (b) facing the receiving part 400 (c). ) is divided into two parts. In addition, in this embodiment, the first reflection member 440 (a) faces only the evaporation part 400 (b), but it may also face the middle part 400 (d), and the middle part 400 ( A reflective member opposing d)) may be installed separately.

The cooling member 420 has a first cooling portion surrounding at least a portion of the evaporation portion 400(b) and a second cooling portion surrounding at least a portion of the receiving portion 400(c). In this embodiment, the first cooling portion also surrounds at least a portion of the middle portion 400(d). In the A-A cross section, the width 504 in the direction perpendicular to the opposing surface of the limiting member 416 of the first cooling part facing the cooling member 420 is that of the limiting member 416 of the second cooling part. It is smaller than the width 505 in the direction perpendicular to the opposing surface facing the cooling member 420. The limiting member 416 is arranged to sandwich the area opposite the evaporation portion 400(b) and the middle portion 400(d) of the cooling member 420, and the receiving portion of the cooling member 420 ( The area facing 400(c)) is configured not to face. The gap 506 in the direction between the evaporation portion 400(b) of the limiting member 416 and the cooling member 420 is defined by the receiving portion 400(c) of the cooling member 420. It is smaller than the width 505 in the direction in which it is placed. As a result, the evaporation source device 240 can be configured by utilizing space.

[Example 5]

The evaporation source device 240 of this embodiment shows an example in which a plurality of containers 400 are installed. As shown in FIG. 6, the evaporation source device 240 has a configuration in which two evaporation source devices in Example 4 are arranged. In addition, Figure 6, like Figure 2(a), includes the normal direction of the opening surface of the opening 401 of the container 400, and is perpendicular to the opposing surface facing the cooling member 420 of the limiting member 416. A cross section (A-A cross section) is shown.

The limiting member 416 is fixed to the cooling member 420 by a bolt 600, which is a fixing member. A space is provided between the limiting member 416 and the cooling member 420. In this way, by providing a space between the limiting member 416 and the cooling member 420 and cooling the limiting member 416 by radiation, excessive cooling of the limiting member 416 can be suppressed. When the fixation is released by loosening the bolt 600, the limiting member 416 can be moved along the side of the cooling member 420, and the limiting member 416 can be detached from the cooling member 420. . The container 400 is disposed on a bolt-shaped protrusion 610 provided on the cooling member 420. The heating unit 430 and the reflecting member 440 are fixed to the cooling member 420 with bolts (not shown) different from the bolts 600.

The evaporation source device 240 is installed on the moving mechanism 250 . The inside of the moving mechanism 250 is an atmospheric space shielded from the vacuum chamber 200, and can accommodate wiring, etc. (not shown) connected to the evaporation source device 240. By moving this moving mechanism 250, it becomes possible to deposit vapor while moving the evaporation source device 240.

[Example 6]

<Specific examples of methods for manufacturing organic electronic devices>

In this embodiment, an example of a method for manufacturing an organic electronic device using a vapor deposition apparatus (evaporation apparatus) equipped with an evaporation source device will be described. Hereinafter, the configuration and manufacturing method of an organic EL display device will be illustrated as an example of an organic electronic device. First, the organic EL display device to be manufactured will be described. FIG. 7(a) shows the overall view of the organic EL display device 60, and FIG. 7(b) shows the cross-sectional structure of one pixel. As the evaporation source device 240 provided in the vapor deposition apparatus of this embodiment, any one of the above-described embodiments is used.

As shown in FIG. 7(a), in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light-emitting elements are arranged in a matrix shape. As will be described in detail later, each light emitting element has a structure including an organic layer sandwiched between a pair of electrodes. In addition, the pixel referred to here refers to the minimum unit that enables display of a desired color in the display area 61. In the case of the organic EL display device in this figure, the pixel 62 is composed of a combination of a first light-emitting element 62R, a second light-emitting element 62G, and a third light-emitting element 62B that emit different light. . The pixel 62 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is particularly limited as long as it is of at least one color. no.

FIG. 7(b) is a partial cross-sectional schematic diagram taken along line A-B in FIG. 7(a). The pixel 62 is formed on a substrate 63, which is a vapor deposition target, with a first electrode (anode) 64, a hole transport layer 65, any of the light emitting layers 66R, 66G, and 66B, and an electron transport layer 67. ) and an organic EL element including a second electrode (cathode) 68. Among these, the hole transport layer 65, the light-emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. Additionally, in this embodiment, the light-emitting layer 66R is an organic EL layer that emits red, the light-emitting layer 66G is an organic EL layer that emits green, and the light-emitting layer 66B is an organic EL layer that emits blue. The light-emitting layers 66R, 66G, and 66B are formed in a pattern corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue colors, respectively. Additionally, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be commonly formed in the plurality of light-emitting elements 62R, 62G, and 62B, or may be formed for each light-emitting element. Additionally, in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign substances, an insulating layer 69 is provided between the first electrode 64. Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 70 is provided to protect the organic EL element from moisture and oxygen.

Next, an example of a manufacturing method for an organic EL display device will be described in detail.

First, a circuit for driving an organic EL display device (not shown) and a substrate 63 on which the first electrode 64 is formed are prepared.

An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by lithography to form an opening in the area where the first electrode 64 is formed to form an insulating layer 69. ) is formed. This opening corresponds to the light emitting area where the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 has been patterned is brought into the first deposition apparatus, the substrate is held by the object mounting table 210, and the hole transport layer 65 is placed on the first electrode 64 in the display area. A film is formed as a common layer on the image. The hole transport layer 65 is formed by vacuum deposition. In reality, since the hole transport layer 65 is formed in a larger size than the display area 61, a high-precision mask is not necessary. Here, the vapor deposition apparatus used in the film formation in this step and the film formation of each layer below is equipped with the evaporation source device described in any one of the above-described embodiments.

Next, the substrate 63 formed up to the hole transport layer 65 is brought into the second deposition apparatus and held on the object mounting table 210. The substrate and the mask are aligned, the substrate is placed on the mask, and a red-emitting light-emitting layer 66R is formed on the portion of the substrate 63 where the red-emitting element is placed. According to this example, the mask and the substrate can be overlapped well and high-precision film formation can be performed.

As with the deposition of the light-emitting layer 66R, the light-emitting layer 66G, which emits green color, is formed into a film using the third deposition apparatus, and the light-emitting layer 66B, which emits blue color, is further formed into a film using the fourth deposition apparatus. After the formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display area 61 using the fifth deposition apparatus. The electron transport layer 67 is formed as a common layer for the three color light emitting layers 66R, 66G, and 66B.

The substrate formed up to the electron transport layer 67 is moved to a sputtering device to form a second electrode 68, and then moved to a plasma CVD device to form a protective layer 70, thereby forming the organic EL display device 60. It is completed.

If the substrate 63 on which the insulating layer 69 is patterned is brought into the vapor deposition apparatus and exposed to an atmosphere containing moisture or oxygen until the formation of the protective layer 70 is completed, the light-emitting layer made of organic EL material There is a risk of deterioration due to moisture or oxygen. Therefore, in this example, the loading and unloading of substrates between vapor deposition apparatuses is performed under a vacuum atmosphere or an inert gas atmosphere.

In the organic EL display device obtained in this way, the light-emitting layer is formed with high precision for each light-emitting element. Using the above manufacturing method, it is possible to suppress the occurrence of defects in the organic EL display device due to damage to the substrate or the circuit for driving the organic EL display device. According to the vapor deposition device according to the present embodiment, the temperature rise of the limiting member of the evaporation source device can be suppressed, so heating of the substrate to be film formed can be suppressed, and satisfactory vapor deposition is possible.

240: Evaporation source device
400: Courage
420: Cooling member
410: limiting member

Claims (25)

a container for storing the deposition material;
Absence of cooling,
An evaporation source device having a limiting member that limits the radiation angle of the evaporation material discharged from the opening of the container,
The limiting member has an opposing surface facing the cooling member,
The container includes an accommodating portion that accommodates the deposition material in a solid state or a liquid state, and an evaporation portion that communicates with the accommodating portion and has the opening,
The cooling member has a first cooling part arranged to sandwich at least a part of the evaporation part, and a second cooling part arranged to sandwich at least a part of the receiving part,
In the cross section including the normal direction of the opening surface of the opening, the cooling member is arranged to sandwich at least a portion of the container,
In the cross section, the limiting member is arranged to sandwich at least a portion of the evaporation portion and at least a portion of the cooling member,
In the cross section, the width of the evaporation portion in a direction perpendicular to the opposing surface is smaller than the width of the receiving portion in a direction perpendicular to the opposing surface,
In the cross section, the width of the first cooling section in a direction perpendicular to the opposing surface is smaller than the width of the second cooling section in the direction perpendicular to the opposing surface. According to paragraph 1,
The evaporation source device is characterized in that the limiting member is cooled by the cooling member. According to paragraph 1,
The evaporation source device is characterized in that the limiting member is thermally connected to the cooling member. According to paragraph 1,
The evaporation source device is characterized in that the limiting member is thermally connected to the cooling member via a fixing member that secures the limiting member to the cooling member. According to paragraph 1,
An evaporation source device characterized in that, in a horizontal cross section intersecting the normal direction, the cooling member is arranged to surround at least a portion of the container. delete According to paragraph 1,
The container further includes an intermediate portion disposed between the accommodating portion and the evaporation portion and communicating with each of the accommodating portion and the evaporation portion,
In the cross-section, the width of the middle portion is smaller than each of the width of the accommodation portion and the width of the evaporation portion. delete delete According to paragraph 1,
An evaporation source device characterized in that, in the cross section, the gap in the direction perpendicular to the opposing surface of the portion of the limiting member sandwiching at least a portion of the evaporation section is smaller than the width of the second cooling section. delete According to paragraph 1,
Further comprising a heating unit that heats the container,
The evaporation source device is characterized in that the heating unit is disposed between the container and the cooling member. According to paragraph 1,
Further comprising a heating unit that heats the container,
The heating unit includes a first heating unit and a second heating unit,
The first heating unit is disposed to face the evaporation unit,
The second heating unit is disposed to face the receiving unit,
The evaporation source device is characterized in that the first heating unit and the second heating unit are disposed between the container and the cooling member. According to clause 13,
The first heating unit is controlled to a higher temperature than the second heating unit. According to clause 12,
An evaporation source device, characterized in that the temperature of the heating unit is controlled to be 250°C or higher and 1400°C or lower. According to clause 12,
The evaporation source device is disposed between the heating unit and the cooling member and further includes a reflective member that reflects heat from the heating unit. According to clause 16,
An evaporation source device, wherein the reflecting member is made of molybdenum, the container is made of tantalum, and the limiting member is made of stainless steel. According to paragraph 1,
The evaporation source device is characterized in that the limiting member is detachably installed along the surface of the cooling member. According to paragraph 1,
The container includes a nozzle portion forming the opening,
The nozzle portion is installed to protrude with respect to the first surface of the container,
The cooling member includes an opposing portion disposed opposite to the first surface of the container,
The limiting member is an evaporation source device characterized in that it includes an extension part extending to face the opposing part. According to paragraph 1,
The cooling member is an evaporation source device characterized in that a flow path for flowing a cooling liquid is provided inside the cooling member. According to paragraph 1,
The evaporation source device is characterized in that the container has a plurality of the openings. delete As a deposition device,
An evaporation source device according to any one of claims 1 to 5, 7, 10, and 12 to 21,
A deposition apparatus comprising a vacuum chamber in which the evaporation source device is placed and deposition is performed. According to clause 23,
The evaporation device has a moving mechanism on which the evaporation source device is mounted,
A vapor deposition apparatus characterized in that vapor deposition is performed by moving the moving mechanism. As a deposition system,
A plurality of vapor deposition devices each including the evaporation source device according to any one of claims 1 to 5, 7, 10, and 12 to 21;
A deposition system comprising a substrate transport device to which the plurality of deposition devices are connected.

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