JP6641226B2 - Vacuum evaporation apparatus and method for cooling evaporation source - Google Patents

Description

  The present invention relates to a vacuum evaporation apparatus and a method for cooling an evaporation source.

  In a vacuum evaporation apparatus in which an evaporation source is installed in a film formation chamber so as to face a substrate, replenishment work of the film formation material after evaporation and maintenance work of equipment are performed by cooling the heated evaporation source to, for example, about 100 ° C. It must be performed after the vacuum chamber is opened to the atmosphere.

  However, simply cooling the evaporation source and leaving it in a vacuum atmosphere by simply stopping the heating of the evaporation source may require several to ten and several hours to cool the evaporation source to about 100 ° C. Therefore, as disclosed in Patent Document 1, for example, a refrigerant pipe or the like is provided in a reflector (reflection plate) provided around a heating unit that heats an evaporation source, and refrigerant gas or the like is circulated. Various efforts have been made to shorten the cooling time, for example, by improving the cooling efficiency of the evaporation source or by providing a refrigerant pipe for cooling the heating section itself in the heating section.

  Patent Document 1 discloses that an inert gas is introduced into a film forming chamber during cooling of an evaporation source to promote cooling, but specifically, where and how the inert gas is introduced. Nothing is suggested.

JP 2012-207238 A

  The present invention has been made in view of the above situation, and has been made to further reduce the cooling time of the evaporation source.The evaporation source can be cooled for a short time by directly cooling the evaporation source with a refrigerant gas. The present invention provides a vacuum vapor deposition apparatus and a method for cooling an evaporation source, which can reduce the fall time of the apparatus and improve the production efficiency by making it possible to make the temperature open to the atmosphere.

In the vacuum chamber, an evaporation source for evaporating the stored film-forming material is provided, and the film-forming material evaporated from the evaporation port provided in the evaporation source is provided at a position opposed to the evaporation source. A vacuum deposition apparatus for forming a vapor deposition film on the substrate, comprising a heat shield for housing the evaporation source and a heating unit for heating the evaporation source, and shielding heat from the evaporation source and the heating unit. A refrigerant gas introduction mechanism for introducing a refrigerant gas into a space between the heat shield container and the evaporation source is provided, and the refrigerant gas introduction mechanism includes a refrigerant gas introduction hole provided in the heat shield container. A refrigerant gas pipe connected to the inlet side of the refrigerant gas introduction hole for sending the refrigerant gas from outside the vacuum chamber to the refrigerant gas introduction hole, and the heat shield container is provided with the evaporating port. Having an opening for exposing the portion, The evaporation source is directly cooled by the refrigerant gas introduced from the medium gas introduction hole into the space between the heat shielding container and the evaporation source, and the refrigerant gas is supplied to the evaporation port of the opening. in which according to vacuum vapor deposition apparatus characterized that you have been composed around as flow out of the heat insulating condition.

  Since the present invention is configured as described above, the evaporation source can be cooled to a temperature at which the evaporation source can be opened to the atmosphere in a short time by directly cooling the evaporation source with a refrigerant gas, and the fall time of the apparatus is reduced. Thus, a vacuum evaporation apparatus and a method for cooling an evaporation source, which can improve production efficiency.

Moreover, the present invention can reliably introduce the refrigerant gas into the space between the heat shield container and the evaporation source from the refrigerant gas introduction hole provided in the heat shield container, and change the evaporation source to be cooled to the refrigerant gas. It is possible to cool directly, and furthermore, the refrigerant gas introduced into the space between the heat shield container and the evaporation source flows from around the evaporator opening of the opening for exposing the evaporator opening of the heat shield container. By being configured to flow out, the refrigerant gas introduced into the space creates a refrigerant gas flow flowing from the refrigerant gas introduction hole toward the opening, and the refrigerant gas introduced from the refrigerant gas introduction hole The vacuum evaporation apparatus and the cooling method of the evaporation source are excellent in that the cooling by the evaporation is performed more excellently.

It is a schematic explanatory sectional view of a present Example. It is a graph which shows the cooling curve of a present Example. It is a schematic explanatory sectional view showing an example of an evaporation source unit. It is a schematic explanatory sectional view showing an example of an evaporation source unit. It is a schematic explanatory sectional view showing an example of an evaporation source unit. 4 is a graph showing a cooling curve in the example of FIG. It is a schematic explanatory sectional view showing an example of an evaporation source unit. It is a schematic explanatory sectional view showing an example of an evaporation source unit. It is a schematic explanatory sectional view showing an example of an evaporation source unit. It is a schematic explanatory sectional view showing an example of an evaporation source unit. It is a schematic explanatory sectional view showing an example of an evaporation source unit. It is a schematic explanatory sectional view of another example. It is a graph which shows the cooling curve of another example.

  Preferred embodiments of the present invention will be briefly described with reference to the drawings, showing the operation of the present invention.

  The film-forming material 20 stored in the evaporation source 4 is heated and evaporated, and the evaporated film-forming material 20 is emitted from the evaporation port 5 to form a vapor-deposited film on the substrate 6.

  Here, when the vacuum chamber 1 is opened to the atmosphere after the film formation, a refrigerant gas is introduced into the space 9 between the heat shield container 8 and the evaporation source 4, and the evaporation source 4 is directly cooled by the refrigerant gas. It is possible to cool the evaporation source 4 to a temperature that can be opened to the atmosphere in a short time. That is, the refrigerant gas can be reliably introduced into the space 9 between the heat shield container 8 and the evaporation source 4 from the refrigerant gas introduction hole 10 provided in the heat shield container 8, and the evaporation source 4 to be cooled is cooled. It is possible to directly cool by the refrigerant gas.

  Specifically, after the film formation, the power of the heating unit 7 is turned off, and instead of immediately introducing the refrigerant gas into the space 9, the evaporation source 4 is evaporated with the refrigerant gas by cooling by radiation such as natural cooling. After the temperature is lowered to such a level that the compound with the source 4 is not generated, the refrigerant gas is introduced into the space 9.

  In addition, for example, the refrigerant gas introduced into the space 9 between the heat shield container 8 and the evaporation source 4 circulates around the evaporation port 5 of the opening 12 for exposing the evaporation port 5 of the heat shield container 8. The refrigerant gas introduced into the space 9 is generated from the refrigerant gas introduction hole 10, and a refrigerant gas flow flowing toward the opening 12 is created. Cooling by the introduced refrigerant gas is performed more favorably.

  Therefore, the present invention not only cools by radiation, but also introduces a refrigerant gas into the space 9 between the heat shielding container 8 and the evaporation source 4 to surely cool the evaporation source 4 directly by the refrigerant gas (convection). And cooling with the refrigerant gas can be performed very efficiently.

  Further, for example, by providing the heat absorbing surface portion 13 on the inner surface side of the heat shield container 8, the surface facing the evaporation source 4 is easily cooled, and the cooling by the radiation of the evaporation source 4 is promoted accordingly. . Therefore, for example, immediately after the power of the heating unit 7 is turned off after vapor deposition, cooling by radiation using the heat absorbing surface unit 13 is performed, and after reaching a predetermined temperature, the refrigerant gas is cooled by the heat shielding container 8 and the evaporation source 4. By performing cooling by introducing into the space 9 between the spaces, the cooling time of the evaporation source 4 can be further reduced.

  Further, for example, by providing the refrigerant gas introduction hole 10 at a position where the outlet faces the storage section 2 of the evaporation source 4 where the film formation material 20 is stored, the film formation material 20 such as an organic material having a large heat capacity is stored. Thus, the vicinity of the storage section 2 to be cooled can be satisfactorily cooled, and the cooling time can be shortened accordingly.

  A specific embodiment of the present invention will be described with reference to the drawings.

  In this embodiment, an evaporation source 4, a heating unit 7 for heating the evaporation source 4, and a heat shielding container 8 for accommodating the evaporation source 4 and the heating unit 7 are provided in the vacuum chamber 1 and face the evaporation source 4. This is a vacuum evaporation apparatus for forming an evaporation film on the substrate 6.

  Specifically, as shown in FIG. 1, a refrigerant gas introduction mechanism for introducing a refrigerant gas (nitrogen gas) into a space 9 between the evaporation source 4 and the heat shield container 8 is provided. A refrigerant gas introduction hole 10 provided in the heat shielding container 8 and a refrigerant gas introduction hole 10 connected to the inlet side of the refrigerant gas introduction hole 10 for sending the refrigerant gas from outside the vacuum chamber 1 to the gas introduction hole. And a refrigerant gas pipe 11. In FIG. 1, reference numeral 25 denotes a refrigerant gas supply unit for supplying a refrigerant gas, and reference numeral 26 denotes a vacuum pump for exhaust.

  In the evaporation source 4 of the present embodiment, a material storage container 21 is provided inside, and the film storage material 20 is stored in the material storage container 21. The material storage container 21 has a box shape, and is provided with a lid 22 provided with a hole for discharging material. Therefore, at the time of maintenance, by taking out the material storage container 21 from the evaporation source 4, filling the film forming material 20, and then setting the material into the evaporation source 4, the work of removing the evaporation source 4 itself becomes unnecessary, and the film forming material can be easily prepared. 20 can be filled.

  The film forming material 20 is stored in the lower part of the material storage container 21, and the space between the surface of the film forming material 20 and the lid 22 is a diffusion region where the evaporated film forming material 20 is diffused. That is, in the evaporation source 4 of FIG. 1, the portion facing the material storage region of the material storage container 21 in which the film forming material 20 is stored serves as the storage portion 2, and the portion facing the diffusion region serves as the diffusion portion 3. Note that a space outside the material storage container 21 can also be a diffusion region.

  Around the evaporation source 4, there is provided a plate-shaped heating unit 7 constituted by a sheath heater having a circular cross section. The heating unit 7 may have another configuration such as a plate-like carbon heater.

  The diffusion unit 3 of the evaporation source 4 is provided with a nozzle-shaped evaporation port 5, and a heat shield container 8 that accommodates the evaporation source 4 and the heating unit 7 with the evaporation port 5 exposed.

  The heat shield container 8 has an opening 12 for exposing the evaporating port 5, and the refrigerant gas introduced into the space 9 between the heat shield container 8 and the evaporation source 4 from the refrigerant gas introducing hole 10 is used for the heat shield container 8. From the periphery of the evaporating port 5 of the opening 12, the inside of the vacuum chamber 1 is discharged to the outside of the heat shield container 8. That is, the opening 12 has a diameter larger than the outer diameter of the evaporating port 5, and is configured such that a gap is formed between the outer peripheral surface of the evaporating port 5 and the end face of the opening 12.

  A refrigerant circulation path 23 is formed inside the heat shielding container 8 surrounding the evaporation source 4. By circulating a coolant such as water in the coolant circulation path 23, the temperature of the heat shield container 8 is maintained, and the radiant heat from the evaporation source 4 and the heating unit 7 affects the substrate 6 and other parts in the vacuum chamber 1. I try not to. In addition, the heat shield container 8 of the present embodiment is formed by combining a panel body having a refrigerant circulation path 23 therein. The refrigerant circulation section 23 is provided in a meandering shape on each panel body, and is connected to the refrigerant circulation path 23 of another panel body to constitute one circulation path as a whole. In FIG. 1, reference numeral 24 denotes a refrigerant circulating unit that circulates the refrigerant through the refrigerant circulating path 23.

  The outlet side of the refrigerant gas introduction hole 10 of the present embodiment is provided at a position facing the storage section 2. Specifically, the refrigerant gas introduction hole 10 is provided on the lower end side opposite to the opening 12 on the upper end side. The storage part 2 is a part in which the film forming material 20 is stored and a large amount of energy is required for cooling. Therefore, the storage section 2 can be cooled well, and the cooling time can be shortened accordingly. In particular, when the organic material having a large heat capacity is the film forming material 20, the effect is more remarkable.

  In the vacuum evaporation apparatus having the above configuration, the evaporation source 4 is cooled in the following steps after film formation.

  When the temperature after film formation is about 400 ° C., first, the heating by the heating unit 7 is stopped, and the evaporation source 4 is cooled by heat radiation (first cooling step).

  Subsequently, after the evaporation source 4 is cooled to about 250 ° C., the evaporation source 4 is cooled by introducing a refrigerant gas into the space 9 between the heat shielding container 8 and the evaporation source 4 (second cooling step). ).

  As shown in FIG. 2, the time required for cooling the evaporation source 4 to about 100 ° C. in the above process is 6 hours in the conventional example (C) having no cooling countermeasure. The conventional example (B) takes 3.5 hours, while the present example (A) takes about 2.5 hours.

  Therefore, according to the present embodiment, the cooling rate is improved, and it is possible to shorten the fall time of the apparatus accordingly.

  Further, in the present embodiment, by performing the first cooling step and the second cooling step, it is possible to prevent the thermal deformation of each component due to the rapid cooling. Reaction can be prevented.

  In addition, by providing the refrigerant gas introduction hole 10 at the lower end position facing the storage section 2, the evaporation port section 5 is cooled slightly later than the storage section 2, so that the power of the heating section 7 is kept high at a high deposition rate. Is turned off, it is possible to prevent the material from being deposited in the vicinity of the evaporation port 5.

  Further, by configuring the evaporation source unit surrounded by a broken line in FIG. 1 as follows, the cooling efficiency can be further improved.

  For example, FIGS. 3 to 5 show that the evaporation source 4 is formed by a storage chamber for forming the storage unit 2 for storing the film forming material 20 and a diffusion unit 3 for forming the diffusion unit 3 for diffusing the evaporated film forming material 20 to make the pressure uniform. The chamber and the diffusion chamber are connected to each other by a connection pipe 17 having a smaller diameter than the storage section and the diffusion chamber.

  3 to 5, a storage chamber for disposing the material storage container 21 is provided, and a diffusion chamber for satisfactorily diffusing the evaporated film-forming material is provided separately from the storage chamber. It is set to 3.

  Further, the heat shield container 8 is provided with a partition 19 for partitioning between the storage section 2 and the diffusion section 3. By making the storage part 2 and the diffusion part 3 thermally independent by the partition part 19, the temperature control of the storage part 2 and the diffusion part 3 can be performed independently, and the film can be more excellently formed. Can be performed.

  Specifically, the partition part 19 has a configuration in which an insertion hole 18 through which the connection pipe 17 is inserted is provided in one panel body constituting the heat shield container 8. The insertion hole 18 has a diameter larger than the outer diameter of the connection pipe 17 and is configured such that a gap is formed between the outer peripheral surface of the connection pipe 17 and the end face of the insertion hole 18.

  3 to 5, a heat absorbing surface portion 13 for increasing the emissivity in the infrared region is provided on the inner surface side of the heat shield container 8. If the emissivity in the infrared region of the heat absorbing surface portion 13 is higher than the emissivity in the infrared region of the heat shielding container 8 when the heat absorbing surface portion 13 is not provided, an effect of improving the cooling efficiency by improving the emissivity can be obtained. In FIGS. 3 to 5, a plate having a heat absorbing surface 13 is attached to the inner surface of the heat shield container 8. Thereby, the heat from the heating unit 7 and the evaporation source 4 is absorbed by the heat absorbing surface 13, and the heat absorbing surface 13 is quickly cooled by the heat shielding container 8, so that the radiation cooling can be efficiently performed. Further, by providing the heat absorbing surface portion 13, the amount of heat exchanged per unit time between the storage portion 2 and the heat shield container 8 is increased, so that the heat response is good even in a vacuum and the rate can be easily controlled. In addition, since the heat absorbing surface portion 13 is formed separately from the heat shield container 8, the structure can be easily replaced when the surface treatment is deteriorated due to exposure to a high temperature environment.

  The heat absorbing surface portion 13 is formed by arranging a plurality of blind holes having a diameter of 以下 or less of a depth on the surface of the plate material. In addition, it is good also as not only a blind hole but a through-hole. The blind hole increases the surface area, and further improves the apparent emissivity by repeating multiple reflections of the electromagnetic wave on the inner surface of the blind hole. In addition, the cooling time can be further reduced by increasing the surface area and improving the heat transfer coefficient between the refrigerant gas and the heat shield container 8. Further, the density of the blind hole can be changed depending on the portion, and a portion that easily absorbs heat and a portion that is difficult to absorb heat can be intentionally formed. For example, the emissivity of the heat absorbing surface 13 at the position facing the storage unit 2 can be increased, and the emissivity of the heat absorbing surface 13 at the position facing the diffusion unit 3 and the evaporating port 5 can be reduced.

  Although the heat absorbing surface portion 13 is formed by providing a blind hole, the heat absorbing surface portion 13 may be formed by performing a plating process, a thermal spraying process, an oxide film process, or a rough surface process for increasing the emissivity in the infrared region. good. Further, the heat absorbing surface portion 13 is configured to be attached to the inner surface of the heat shield container 8 as a separate structure from the heat shield container 8, but the emissivity of the inner surface of the heat shield container 8 itself in the infrared region is increased. Alternatively, a blind hole may be formed in the inner surface of the heat shield container 8 itself, or plating may be performed. When the heat absorbing surface portion 13 is formed integrally with the heat shield container 8, there is no contact thermal resistance formed between the heat shield container 8 and the heat absorbing surface portion 13, so that the cooling rate can be increased accordingly.

  FIG. 3 shows an example in which a heat absorbing surface portion 13 is provided on a surface facing the storage portion 2 and the diffusion portion 3. FIG. 4 shows an example in which a heat absorption surface portion 13 is provided on a surface facing the storage portion 2. FIG. 5 shows an example in which a heat insulating plate portion 16 is provided between the heat absorbing plate portion 16 and the diffusion portion 3 except for the periphery of the storage portion 2 and the evaporating port portion 5. This is an example in which a plate portion 16 is provided.

  3 and 5, a heat absorbing surface portion 13 is provided also on the surface of the partition 19 facing the storage section 2 and on the surface of the partition 19 facing the diffusion portion 3, respectively. By providing the heat absorbing surface portions 13 in the partition portions 19, respectively, the height of the evaporation source 4 can be made more compact.

  The heat retaining plate 16 is made of a plate member having a low emissivity in the infrared region. When the heat retaining plate 16 is provided between the heating unit 7 for heating the diffusion unit 3 and the heat shield container 8 so as to surround the outer periphery of the evaporating port 5, the cooling rate of the evaporating port 5 is set to be lower than that of other parts. Even if the power of the heating unit 7 is turned off at a high deposition rate, the deposition of the material can be suppressed.

  The cooling process when the evaporation source unit having the configuration shown in FIG. 3 is used is as follows.

  When the temperature after film formation is about 400 ° C., first, the heating by the heating unit 7 is stopped, and the evaporation source 4 is cooled by heat radiation using the heat absorbing surface 13 (first cooling step).

  Subsequently, after the evaporation source 4 is cooled to about 250 ° C., the evaporation source 4 is cooled by introducing a refrigerant gas into the space 9 between the heat shielding container 8 and the evaporation source 4 (second cooling step). ).

  As shown in FIG. 6, the time required to cool the evaporation source 4 to about 100 ° C. in the above-described process is 6 hours in the conventional example (C) having no cooling measures. The conventional example (B) takes 3.5 hours, while the example (A ′) of FIG. 3 takes about 2 hours.

  That is, cooling by heat radiation is promoted by the heat absorbing surface portion 13, and the cooling rate can be further improved.

  Further, the evaporation source unit surrounded by a broken line in FIG. 1 may be configured as follows.

  7 to 9 show examples in which the number of the refrigerant gas introduction holes 10 shown in FIGS. 3 to 5 is increased or the installation position is changed.

  FIG. 7 shows an example in which the refrigerant gas introduction holes 10 are provided not only on the lower end surface of the heat shield container 8 but also on the surfaces facing the left and right side surfaces of the storage section 2. In this case, the storage section 2 can be cooled more favorably.

  FIG. 8 shows that the refrigerant gas introduction holes 10 are provided not only at the lower end surface of the heat shield container 8 (at the position facing the storage unit 2) but also at the position facing the diffusion unit 3 (each of the surfaces facing the left and right side surfaces of the diffusion unit 3). This is an example. FIG. 9 shows a position in which the refrigerant gas introduction hole 10 is not provided at the lower end surface of the heat shielding container 8 (a position facing the storage unit 2) and the diffusion unit 3 is facing (the surfaces facing the left and right side surfaces of the diffusion unit 3). This is an example in which the coolant gas introduction holes 10 are provided only in the holes. In this case, the cooling of the diffusion unit 3 can be favorably performed.

  As shown in FIG. 10, the film-forming material 20 is directly stored in the box-shaped evaporation source 4, and a portion in which the film-forming material 20 is stored is referred to as a storage unit 2. In the configuration in which the portion surrounding the space between the upper surface of the heat shield 4 and the upper surface of the heat shield 4 is the diffusion portion 3, the heat absorbing surface 13 may be provided on the inner surface of the heat shield container 8.

  In FIG. 10, a heat absorbing surface portion 13 is provided on the entire inner side surface of the heat shield container 8, and two refrigerant gas introduction holes 10 are provided. Further, different refrigerant gas may be introduced from each refrigerant gas introduction hole 10. For example, one may introduce nitrogen gas and the other may introduce argon gas.

  Also, as shown in FIG. 11, the same applies to a case where the evaporation source 4 is a so-called line source in which a plurality of evaporation ports 5 are arranged in the longitudinal direction of the diffusion section 3. That is, FIG. 11 shows a configuration in which four evaporating ports 5 are provided side by side in the diffusing section 3, and the heat shield container 8 is provided with four openings 12 for exposing each evaporating port 5. Further, a partition 19 is provided to partition between the storage section 2 and the diffusion section 3. In addition, a heat absorbing surface 13 is provided on a surface of the heat shielding container 8 facing the diffusion unit 3 except for the periphery of the storage unit 2 and the evaporating port 5, and a heat retaining plate 16 is provided around the evaporating port 5. Further, a heat absorbing surface portion 13 is also provided on a surface of the heat shielding container 8 facing the storage portion 2 of the partition portion 19 and a surface of the partition portion 19 facing the diffusion portion 3. By providing the heat absorbing surfaces 13 on the upper and lower surfaces of the partition 19, respectively, the height of the evaporation source 4 can be made more compact. In a line source in which the storage unit 2 and the diffusion unit 3 are large, the temperatures of the storage unit 2 and the diffusion unit 3 are easily affected by each other, and the storage unit 2 and the diffusion unit 3 are thermally separated by the partition unit 19. The benefit of having an independent configuration is particularly great.

  FIG. 11 shows a configuration in which two refrigerant gas introduction holes 10 are provided, and different refrigerant gas may be introduced from each refrigerant gas introduction hole 10. For example, one may introduce nitrogen gas and the other may introduce argon gas.

  FIG. 12 is another example of the present embodiment in which a refrigerant circulation path 15 is provided in the heating unit 7. Specifically, the refrigerant circulation paths 15 are arranged in a meandering shape on the outer surface side of each heating unit 7 and are connected to each other to constitute one circulation path as a whole.

  A coolant supply unit 29 for supplying coolant as a coolant is connected to one end of the coolant circulation path 15, and a coolant collection unit 30 for coolant collection via a three-way valve 32 and a coolant Is connected to an atmosphere opening section 31 for dropping the air to the atmosphere. In FIG. 12, reference numeral 24a denotes a cooling water supply unit that supplies cooling water to the refrigerant circulation path 23 of the heat shield container 8, and 24b denotes a cooling water recovery unit that collects cooling water of the refrigerant circulation path 23.

  In another example, two refrigerant gas introduction holes 10 are arranged side by side at the lower end facing the storage section 2 of the heat shield container 8. A nitrogen gas supply unit 27 is connected to one of the refrigerant gas introduction holes 10 via the refrigerant gas pipe 11, and an argon gas supply unit 28 is connected to the other refrigerant gas introduction hole 10 via the refrigerant gas pipe 11. Have been.

  Further, in another example, the heat absorbing surface portion 13 and the heat retaining plate portion 16 are provided similarly to the example of FIG.

  In another example, during vapor deposition, cooling water is constantly circulated through the refrigerant circulation path 23 of the heat shield container 8, the valve of the cooling water supply unit 29 to the refrigerant circulation path 15 of the heating unit 7 is closed, and the refrigerant circulates. The passage 15 is opened to the atmosphere by a three-way valve 32.

  Cooling after vapor deposition is performed as follows.

  The heating by the heating unit 7 is stopped, and cooling by radiation is performed. At this time, the cooling of the storage section 2 is promoted by the heat absorbing surface section 13, and the cooling of the evaporation port section 5 is delayed by the heat retaining plate section 16. Therefore, the cooling of the storage unit 2 is performed satisfactorily while the evaporation particles generated from the storage unit 2 after the stop of the heating are suppressed as much as possible in the vicinity of the evaporating port portion 5 by cooling.

  Subsequently, when the temperature of the storage section 2 of the evaporation source 4 has decreased to a predetermined first temperature (250 ° C.), cooling is performed by introducing argon gas into the space 9 between the evaporation source 4 and the heat shield container 8. Facilitate. Further, when the temperature of the storage section 2 of the evaporation source 4 decreases to a predetermined second temperature (200 ° C.), cooling is promoted by introducing nitrogen gas into the space 9.

  Subsequently, when the temperature of the storage section 2 of the evaporation source 4 has decreased to a predetermined third temperature (150 ° C.), the valve of the cooling water supply section 29 is opened, and the cooling water is collected by the three-way valve 32. Cooling water is circulated through the refrigerant circulating unit 15 of the heating unit 7 to perform water cooling.

  According to the above-described steps, as shown in FIG. 13, the cooling time can be shortened as compared with the conventional example (C) having no cooling measures, and the diffusion section (Y) can be cooled while the storage section (X) is cooled quickly. ), The evaporation source 4 can be quickly cooled to a temperature at which the evaporation source 4 can be opened to the atmosphere while suppressing precipitation of materials and damage to various parts.

  After the evaporation source 4 is cooled to a predetermined temperature, the cooling rate may be increased by increasing the introduction amount (flow rate) of the refrigerant gas being introduced instead of introducing another type of refrigerant gas. . In addition, cooling water is circulated through the refrigerant circulation path 15 at about 5 Pa to 50 Pa. This is because if the pressure is too high, thermal stress is generated due to rapid temperature change, and the heating unit 7 may be damaged.

DESCRIPTION OF SYMBOLS 1 Vacuum tank 2 Storage part 3 Diffusion part 4 Evaporation source 5 Evaporation port part 6 Substrate 7 Heating part 8 Heat shielding container 9 Space
10 Refrigerant gas inlet
11 Refrigerant gas piping
12 Opening
13 Heat absorbing surface
15 Refrigerant circuit
16 Heat insulation plate
17 Connecting pipe
18 Insertion hole
19 Partition
20 Film-forming materials

Claims (19)

In the vacuum chamber, an evaporation source for evaporating the stored film-forming material is provided, and the film-forming material evaporated from the evaporation port provided in the evaporation source is provided at a position opposed to the evaporation source. A vacuum deposition apparatus for forming a vapor deposition film on the substrate, comprising a heat shield for housing the evaporation source and a heating unit for heating the evaporation source, and shielding heat from the evaporation source and the heating unit. A refrigerant gas introduction mechanism for introducing a refrigerant gas into a space between the heat shield container and the evaporation source is provided, and the refrigerant gas introduction mechanism includes a refrigerant gas introduction hole provided in the heat shield container. A refrigerant gas pipe connected to the inlet side of the refrigerant gas introduction hole for sending the refrigerant gas from outside the vacuum chamber to the refrigerant gas introduction hole, and the heat shield container is provided with the evaporating port. Having an opening for exposing the portion, The evaporation source is directly cooled by the refrigerant gas introduced from the medium gas introduction hole into the space between the heat shielding container and the evaporation source, and the refrigerant gas is supplied to the evaporation port of the opening. vacuum vapor deposition apparatus characterized that you have been composed around as flow out of the heat insulating condition. In a vacuum chamber, there is provided an evaporation source having a storage section in which a film-forming material is stored and a diffusion section in which the evaporated film-forming material is diffused, wherein the evaporated film is formed from an evaporation port provided in the diffusion section What is claimed is: 1. A vacuum evaporation apparatus for forming an evaporation film on a substrate provided at a position facing said evaporation source by injecting a material, said vacuum evaporation apparatus containing said evaporation source and a heating unit for heating said evaporation source. A heat-shielding container that shuts off heat from the heat source and the heating unit, and a refrigerant gas introduction mechanism that introduces a refrigerant gas into a space between the heat-shielding container and the evaporation source is provided. The mechanism includes a refrigerant gas introduction hole provided in the heat shield container, and a refrigerant gas connected to the inlet side of the refrigerant gas introduction hole for sending the refrigerant gas from outside the vacuum chamber to the refrigerant gas introduction hole. be constituted by a pipe, the heat insulating condition is The evaporation source has an opening for exposing the evaporation port, and the evaporation source is directly cooled by the refrigerant gas introduced from the refrigerant gas introduction hole into the space between the heat shield container and the evaporation source. Rutotomoni, vacuum vapor deposition apparatus characterized that you have been configured so that this refrigerant gas is discharged to the outside of the heat insulating condition from the periphery of the evaporation port of the opening. 4. The refrigerant gas introduction hole according to claim 1 , wherein an outlet side thereof is provided at a position facing a storage portion of the evaporation source where the film forming material is stored. Vacuum evaporation equipment. The refrigerant gas introducing hole, the provided heat shield condition, any one of the claims 1 and 2 wherein the opening for exposing the evaporation opening, characterized in that on the opposite side positions Item 6. The vacuum evaporation apparatus according to Item 1. On the inner surface side facing the evaporation source of the heat shielding condition, according to any one of claims 1 to 4, characterized in that the heat absorbing surface to increase the emissivity in the infrared region is provided Vacuum evaporation equipment. 6. The vacuum evaporation apparatus according to claim 5 , wherein the heat absorbing surface is provided at a position facing a storage portion of the evaporation source in which the film forming material is stored. 7. The vacuum evaporation apparatus according to claim 5 , wherein a plurality of blind holes or through holes having a diameter equal to or less than の of a depth are formed in the heat absorbing surface portion. 8. The surface of the heat absorption surface portion facing the evaporation source is a plating layer, a thermal spray layer, or an oxide film for increasing the emissivity in an infrared region, or an uneven surface having a predetermined roughness. Item 8. The vacuum evaporation apparatus according to any one of Items 5 to 7 . The vacuum evaporation apparatus according to any one of claims 1 to 8 , wherein a refrigerant circulation path is provided in the heating unit, and the refrigerant is circulated through the refrigerant circulation path. A heat retaining plate for lowering the emissivity in an infrared region is provided at a position of the heat shielding container facing a diffusion portion where the film forming material evaporated by the evaporation source is diffused. The vacuum evaporation apparatus according to any one of claims 1 to 9 . The vacuum evaporation apparatus according to claim 10 , wherein the heat retaining plate is provided at a position near the evaporation port. The evaporation source has a storage chamber that forms a storage section in which the film-forming material is stored, and a diffusion chamber that forms a diffusion section in which the evaporated film-forming material is diffused. The storage chamber and the diffusion chamber The vacuum evaporation apparatus according to any one of claims 1 to 11 , wherein are connected by a connection pipe. 13. The vacuum vapor deposition according to claim 12 , wherein the heat shield container has a plate-shaped partition portion having an insertion hole through which the connection pipe is inserted and separating the storage portion and the diffusion portion. apparatus. According to claim 13, characterized in that the heat absorbing surface to increase the opposing surfaces and emissivity at each infrared region to the opposing surfaces of the diffusing portion of the partition portion between the housing portion of the partition portion is provided Vacuum evaporation equipment. The vacuum evaporation apparatus according to any one of claims 1 to 14 , wherein a plurality of the evaporation ports are arranged in a longitudinal direction of the evaporation source. In the vacuum chamber, an evaporation source for evaporating the stored film-forming material is provided, and the film-forming material evaporated from the evaporation port provided in the evaporation source is provided at a position opposed to the evaporation source. A method for cooling an evaporation source of a vacuum evaporation apparatus for forming an evaporation film on a substrate, wherein the evaporation source and a heating unit for heating the evaporation source are accommodated, and heat from the evaporation source and the heating unit is shut off. A refrigerant gas is introduced between the heat shield container and the evaporation source to cool the evaporation source directly with the refrigerant gas and to expose the evaporation port of the heat shield container to the refrigerant gas. A method of cooling an evaporation source, wherein the cooling source is caused to flow out of the heat shielding container from around the evaporating opening of the opening . In a vacuum chamber, there is provided an evaporation source having a storage section in which a film-forming material is stored and a diffusion section in which the evaporated film-forming material is diffused, wherein the evaporated film is formed from an evaporation port provided in the diffusion section A method for cooling an evaporation source of a vacuum evaporation apparatus for forming an evaporation film on a substrate provided at a position facing the evaporation source by injecting a material, the method comprising: heating the evaporation source and the evaporation source. A refrigerant gas is introduced between the evaporation source and a heat shield container that shuts off heat from the evaporation source and the heating unit, and directly cools the evaporation source with the refrigerant gas. A method for cooling an evaporation source , wherein gas is caused to flow out of the heat shield container from around the evaporation port portion of the opening for exposing the evaporation port portion of the heat shield container . Performing a first cooling step of cooling the evaporation source by heat radiation through a heat absorption surface portion that increases the emissivity in the infrared region provided on the inner surface side of the heat shield container facing the evaporation source, 18. The method according to claim 16 , wherein a second cooling step of cooling the evaporation source by introducing a refrigerant gas into a space between the heat shielding container and the evaporation source is performed. Item 14. The method for cooling an evaporation source according to Item 3. The method according to any one of claims 16 to 18 , wherein the amount of the refrigerant gas introduced is increased when the temperature of the evaporation source becomes equal to or lower than a predetermined temperature.

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