CN107338410A - The cooling means of vacuum deposition apparatus and evaporation source - Google Patents
The cooling means of vacuum deposition apparatus and evaporation source Download PDFInfo
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- CN107338410A CN107338410A CN201710286860.XA CN201710286860A CN107338410A CN 107338410 A CN107338410 A CN 107338410A CN 201710286860 A CN201710286860 A CN 201710286860A CN 107338410 A CN107338410 A CN 107338410A
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- evaporation source
- heat
- evaporation
- refrigerant gas
- container body
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention provides the cooling means of vacuum deposition apparatus and evaporation source, and the evaporation source after evaporation can be made to turn into the temperature that can carry out atmosphere opening in a short time, the debug time of shortening device, improve production efficiency.A kind of vacuum deposition apparatus, it has the evaporation source for evaporating filmogen in vacuum tank, by the filmogen that evaporation is projected from the evaporation oral area for being arranged at evaporation source, evaporation film is formed on substrate, the vacuum deposition apparatus has heat-insulated container body, the heat-insulated container body accommodates evaporation source and the heating part heated to the evaporation source, and completely cut off the heat from evaporation source and heating part, with the refrigerant gas introducing mechanism that refrigerant gas is imported into the space between heat-insulated container body and evaporation source, refrigerant gas introducing mechanism is made up of the refrigerant gas entrance hole for being arranged at heat-insulated container body and the entrance side for being connected to refrigerant gas entrance hole and the refrigerant gas pipe arrangement for exporting refrigerant gas from the outside of vacuum tank to refrigerant gas entrance hole.
Description
Technical field
The present invention relates to the cooling means of vacuum deposition apparatus and evaporation source.
Background technology
Be opposed to state in evaporation source and substrate in the vacuum deposition apparatus being arranged in film forming room, after evaporation into membrane material
The adjunctive program of material, the upkeep operation of equipment need heated evaporation source being cooled to such as 100 DEG C or so and by vacuum
Groove is to carrying out after atmosphere opening.
But if only by the heating that stops evaporation source and being placed on the natural cooling in vacuum environment, it will evaporate
Source cooling is to 100 DEG C or so sometimes for several hours to more than ten hour.Thus, for example in that disclosed in patent document 1
Sample, by setting refrigerant piping on the reflector (reflecting plate) being arranged at around the heating part heated to evaporation source
And refrigerant gas etc. is circulated, so as to improve the cooling effectiveness of evaporation source indirectly using the cooling of reflector, or,
The refrigerant piping cooled down to heating part itself is set and arrives heating part etc., is carried out various for shortening grinding for cool time
Study carefully.
In addition, in patent document 1, disclose and import inert gas into film forming room to promote in the cooling of evaporation source
Cooling, but any enlightenment for specifically wherein how importing inert gas is not provided.
Patent document 1：Japanese Unexamined Patent Publication 2012-207238 publications
The content of the invention
The present invention is to be completed to further shorten the cool time of evaporation source, there is provided one in view of above-mentioned present situation
The cooling means of kind vacuum deposition apparatus and evaporation source, is directly cooled down by using refrigerant gas and is made to evaporation source
Evaporation source after evaporation can turn into the temperature that can carry out atmosphere opening in a short time, the debug time of shortening device, from
And production efficiency can be improved.
Means for solving the problems
A kind of vacuum deposition apparatus, its in vacuum tank have make the evaporation source that the filmogen of storage evaporates, by from
The evaporation oral area for being arranged at the evaporation source projects the filmogen of evaporation, is thus being arranged at the position opposed with the evaporation source
Evaporation film is formed on the substrate put, it is characterised in that the vacuum deposition apparatus has heat-insulated container body, and the heat-insulated container body accommodates
The evaporation source and the heating part heated to the evaporation source, and completely cut off the heat from the evaporation source and the heating part
Amount, the vacuum deposition apparatus set in the space between the oriented heat-insulated container body and the evaporation source and import refrigerant gas
Refrigerant gas introducing mechanism, the refrigerant gas introducing mechanism is by refrigerant gas entrance hole and refrigerant gas pipe arrangement structure
Into the refrigerant gas entrance hole is arranged at the heat-insulated appearance, and the refrigerant gas pipe arrangement is connected to refrigerant gas importing
The entrance side in hole simultaneously is used to export the refrigerant gas from the outside of the vacuum tank to the refrigerant gas entrance hole
Refrigerant gas pipe arrangement is formed.
Invention effect
The present invention is formed as described above, there is provided a kind of cooling means of vacuum deposition apparatus and evaporation source, passes through profit
Directly evaporation source is cooled down with refrigerant gas and the evaporation source after evaporation is turned into can carry out in a short time
The temperature of atmosphere opening, the debug time of shortening device, so as to be improved production efficiency.
Brief description of the drawings
Fig. 1 is that the present embodiment outlines sectional view.
Fig. 2 is the curve map for the cooling curve for showing the present embodiment.
Fig. 3 is to show to evaporate one of source unit to outline sectional view.
Fig. 4 is to show to evaporate one of source unit to outline sectional view.
Fig. 5 is to show to evaporate one of source unit to outline sectional view.
Fig. 6 is the curve map for showing the cooling curve in Fig. 3 example.
Fig. 7 is to show to evaporate one of source unit to outline sectional view.
Fig. 8 is to show to evaporate one of source unit to outline sectional view.
Fig. 9 is to show to evaporate one of source unit to outline sectional view.
Figure 10 is to show to evaporate one of source unit to outline sectional view.
Figure 11 is to show to evaporate one of source unit to outline sectional view.
Figure 12 is that other examples outline sectional view.
Figure 13 is the curve map for the cooling curve for showing other examples.
Label declaration
1：Vacuum tank；2：Incorporating section；3：Diffusion part；4：Evaporation source；5：Evaporate oral area；6：Substrate；7：Heating part；8：It is heat-insulated
Container body；9：Space；10：Refrigerant gas entrance hole；11：Refrigerant gas pipe arrangement；12：Opening portion；13：Heat absorption face；15：
Refrigerant circulating path；16：It is incubated plate portion；17：Connecting piece；18：Insert hole；19：Lattice；20：Filmogen.
Embodiment
The effect of the present invention is shown with reference to the accompanying drawings and simplys illustrate and thinks preferable embodiments of the present invention.
The filmogen 20 for being accommodated in evaporation source 4 is heated and is allowed to evaporate, from evaporation oral area 5 project evaporation into
Membrane material 20 and form evaporation film on substrate 6.
Here, when after film forming to vacuum tank 1 carry out atmosphere opening when, by refrigerant gas imported into heat-insulated container body 8 with
Space 9 between evaporation source 4, and directly evaporation source 4 is cooled down by using the refrigerant gas, so as in short-term
It is interior that evaporation source 4 is cooled to the temperature that can carry out atmosphere opening.That is, can be from the refrigerant for being arranged at heat-insulated container body 8
The space 9 that refrigerant gas is reliably imported between heat-insulated container body 8 and evaporation source 4 by gas introducing port 10, and being capable of profit
By the use of refrigerant gas to directly being cooled down as the evaporation source 4 of cooling object.
Specifically, it is not that the power supply of heating part 7 is cut off after film forming and refrigerant gas is directly imported into the sky
Between 9, but pass through natural cooling etc. radiation carry out cooling the temperature of evaporation source 4 is reduced to refrigerant gas and evaporation source
After 4 can not produce the degree of compound, then refrigerant gas imported into the space 9.
In addition, for example, pass through the refrigerant gas in the space 9 for being configured to make to imported between heat-insulated container body 8 and evaporation source 4
Body is led from the surrounding of evaporation oral area 5 outflow of the opening portion 12 for being used to expose evaporation oral area 5 of heat-insulated container body 8 so as to be formed
Enter the refrigerant gas flowed to the refrigerant gas in the space 9 from refrigerant gas entrance hole 10 towards the opening portion 12
Stream, is further cooled down using the refrigerant gas imported from refrigerant gas entrance hole 10 well.
Therefore, the present invention is not cooled down merely with radiation, and refrigerant gas also is imported into heat-insulated container body 8 and evaporation
Refrigerant gas (convection current) can be directly utilized reliably to cool down evaporation source 4 in space 9 between source 4, can be extremely effective
Ground is cooled down using refrigerant gas.
In addition, for example by being configured to set heat absorption face 13 in the inner side surface side of heat-insulated container body 8, so that and evaporation source
4 opposed opposed faces easily cool off, and correspondingly facilitate cooling of the radiation to evaporation source 4.Thus, for example, after evaporation, just cut
After the power supply of disconnected heating part 7, cooled down using heat absorption face 13 by radiation, after reaching set point of temperature, by by refrigerant
Space 9 that gas is imported between heat-insulated container body 8 and evaporation source 4 and cooled down, can further shorten the cold of evaporation source 4
But the time.
In addition, for example by the way that refrigerant gas entrance hole 10 is arranged at into its outlet and the storage film forming of evaporation source 4
The position that the incorporating section 2 of material 20 faces, can be in the filmogen 20 such as being accommodated with thermal capacity larger organic material
Incorporating section 2 is nearby cooled down well, correspondingly can shorten cool time.
【Embodiment】
Illustrate the specific embodiment of the present invention with reference to the accompanying drawings.
The present embodiment is vacuum deposition apparatus, and the vacuum deposition apparatus is provided with evaporation source 4, to evaporation in vacuum tank 1
The heating part 7 and storage evaporation source 4 and the heat-insulated container body 8 of heating part 7 that source 4 is heated, right with the evaporation source 4
Evaporation film is formed on the substrate 6 put.
Specifically, as illustrated in fig. 1, be provided with by refrigerant gas (nitrogen) imported into evaporation source 4 with it is heat-insulated
The refrigerant gas introducing mechanism in the space 9 between container body 8, the refrigerant gas introducing mechanism is by refrigerant gas entrance hole
10 and refrigerant gas pipe arrangement 11 form, the refrigerant gas entrance hole 10 is arranged at the heat-insulated container body 8, the refrigerant gas
Body pipe arrangement 11 is connected with the entrance side of the refrigerant gas entrance hole 10, for from the outside of the vacuum tank 1 to the gas
Entrance hole exports the refrigerant gas.In Fig. 1, label 25 is the refrigerant gas supply unit of refrigerant gas supply, 26
It is the vavuum pump of exhaust.
The evaporation source 4 of the present embodiment is internally provided with material storage container 21, is stored in the material storage container 21
There is filmogen 20.Material storage container 21 is box-like, is provided with lid 22, and the lid 22 is provided with the hole of material dispensing.
Therefore, when safeguarding, material storage container 21 is taken out from evaporation source 4, evaporation source 4 is set again after filling filmogen 20,
Without the operation of itself of dismounting evaporation source 4, filmogen 20 can be easily filled.
Filmogen 20 is accommodated in the bottom of material storage container 21, the sky between the surface of filmogen 20 and lid 22
Between turn into the diffusion zone that is diffused of filmogen 20 of evaporation.That is, for Fig. 1 evaporation source 4, hold with material storage
The opposed portion that the material storage region for being accommodated with filmogen 20 of device 21 is opposed is divided into incorporating section 2, with the diffusion zone
Opposed opposed portion is divided into diffusion part 3.In addition, the exterior space of material storage container 21 can also turn into diffusion zone.
The sheathed heater (ソ ー ス ヒ ー タ-by circular cross-section are provided with around evaporation source 4) tabular that forms
Heating part 7.In addition, heating part 7 can also be the other structures such as the carbon heater of tabular.
The diffusion part 3 of evaporation source 4 is provided with the evaporation oral area 5 of nozzle-like, and is provided with and makes what evaporation oral area 5 exposed
Evaporation source 4 and the heat-insulated container body 8 of heating part 7 are stored under state.
Heat-insulated container body 8, which has, to be used to make the opening portion 12 that evaporation oral area 5 exposes, and is configured to, from the refrigerant gas
The refrigerant gas in the space 9 that entrance hole 10 is imported between heat-insulated container body 8 and evaporation source 4 is in the inside of vacuum tank 1 from institute
State the outside that heat-insulated container body 8 is flowed out to around the evaporation oral area 5 of opening portion 12.That is, opening portion 12 is configured to, diameter ratio
The external diameter of evaporation oral area 5 is big, and produces gap between the outer peripheral face of evaporation oral area 5 and the end face of opening portion 12.
Refrigerant circulating path 23 has been internally formed in the heat-insulated container body 8 for surrounding the evaporation source 4.By making water etc.
Cryogen circulates in the refrigerant circulating path 23, so as to keep the temperature of heat-insulated container body 8 and make from evaporation source 4, heating
The radiant heat in portion 7 does not impact to the substrate 6 in vacuum tank 1, other positions.In addition, the heat-insulated container body 8 of the present embodiment is
Inside is mounted with the panel body combination of refrigerant circulating path 23 and formed.Refrigerant circulation portion 23 is arranged in snake shape
Each panel body, and be connected with the refrigerant circulating path 23 of other panel bodies and be used as and be monolithically fabricated a circulating path.Fig. 1
In, label 24 is the refrigerant circulation portion for making refrigerant be circulated in refrigerant circulating path 23.
The outlet side of the refrigerant gas entrance hole 10 of the present embodiment is arranged in face of the position of incorporating section 2.Specifically,
Refrigerant gas entrance hole 10 is arranged at the lower end side of the opposite side position of the opening portion 12 as upper end side.Incorporating section 2 is to receive
Receive filmogen 20 and needs the position of large energy in cooling.Therefore, it is possible to make incorporating section 2 cool down well, accordingly
Ground can shorten cool time.Especially in the case where the larger organic material of thermal capacity is filmogen 20, effect is more notable.
In the vacuum deposition apparatus of above structure, after film forming, evaporation source 4 is cooled down according to following process.
In the case that temperature after film forming is 400 DEG C or so, first, stops the heating of heating part 7, entered using heat radiation
The cooling (the first refrigerating work procedure) of row evaporation source 4.
Then, after evaporation source 4 is cooled to 250 DEG C or so, by the way that refrigerant gas is imported into heat-insulated container body 8 with steaming
Rise in the space 9 between 4 and be evaporated the cooling (the second refrigerating work procedure) in source 4.
As illustrated in Figure 2, on according to more than process evaporation source 4 is cooled to about 100 DEG C when spent when
Between, it is 6 hours in the conventional example (C) of no cooling countermeasure, the conventional example (B) of the patent document 1 cooled down to reflector
In be 3.5 hours, and the present embodiment (A) be 2.5 hours or so.
Therefore, improved according to the present embodiment, cooling velocity, be correspondingly capable of the debug time of shortening device.
In addition, the present embodiment passes through above-mentioned first refrigerating work procedure and the second refrigerating work procedure, can prevent from rapidly cooling down causing
Each structure member thermal deformation, in addition, the reaction of metal used by refrigerant gas and evaporation source 4 can be prevented.
In addition, by the way that refrigerant gas entrance hole 10 to be arranged to the lower end side position in face of incorporating section 2, so as to evaporation mouth
Portion 5 somewhat postpones to be cooled in incorporating section 2, therefore the power supply of heating part 7 is cut off in the state of evaporation rate is higher,
Also can prevent from separating out material near evaporation oral area 5.
In addition, by the evaporation source unit impaled in pie graph 1 as described below by dotted line part, cooling effectiveness can be entered
One step improves.
Such as in Fig. 3~5, evaporation source 4 is configured to：Linked with the diameter connecting piece 17 smaller than incorporating section and diffuser casing and received
Receive room and diffuser casing, wherein, the receiving room forms the incorporating section 2 of storage filmogen 20, and the diffuser casing forms the institute for making evaporation
State the diffusion part 3 that filmogen 20 spreads and makes pressure equalization.
In Fig. 3~5, the receiving room of configuration material storage container 21 is set, and by the filmogen for making evaporation
The diffuser casing spread well and receiving room are separately positioned, and using the diffuser casing as diffusion part 3.
In addition, the lattice 19 to being separated between incorporating section 2 and diffusion part 3 is set in heat-insulated container body 8.Utilize
Lattice 19 makes incorporating section 2 and diffusion part 3 turn into thermally independent structure, can separately carry out incorporating section 2 and diffusion part 3
Temperature control, turn into the structure that can further carry out film forming well.
Specifically, the structure of lattice 19 is to be provided with a panel body for forming heat-insulated container body 8 described in confession
What connecting piece 17 inserted inserts hole 18.Insert hole 18 and be configured to that diameter is bigger than the external diameter of connecting piece 17, and in the outer of connecting piece 17
Gap is produced between side face and the end face for inserting hole 18.
In addition, in Fig. 3~5, the suction for the radiance for improving region of ultra-red is provided with the inner side surface side of heat-insulated container body 8
Hot face 13.If heat absorption face 13 region of ultra-red radiance than be not provided with heat absorption face 13 in the case of heat-insulated appearance
The radiance of the region of ultra-red of body 8 is high, then can obtain radiance and improve the cooling effectiveness raising effect brought.In Fig. 3~5
In, it is mounted with the sheet material with heat absorption face 13 in the medial surface of heat-insulated container body 8.Thus, absorbed and come from heat absorption face 13
Heating part 7 and the heat of evaporation source 4, heat absorption face 13 is promptly cooled down using heat-insulated container body 8, can be effectively based on
The cooling of radiation.In addition, by setting heat absorption face 13, between incorporating section 2 and heat-insulated container body 8, exchanged in the unit interval
Heat become big, even if in a vacuum, thermo-responsive is also preferable, turn into the structure for being easily controlled speed.In addition, by making heat absorption
Face 13 with heat-insulated container body 8 turn into Split type structure, be configured to exposed to hot environment it is medium caused by surface treatment deteriorate
When can easily be changed.
Heat absorption face 13 is multiple less than 1/2 diameters with depth are set side by side with the surface of the sheet material blind
Hole and formed.In addition, it is not limited to blind hole or through hole.Using the blind hole, surface area increases, and in blind hole
Inner surface, electromagnetic wave repeat multipath reflection, are improved so as to the radiance of appearance.In addition, surface area increase, refrigerant gas with every
The heet transfer rate of thermal capacitance body 8 improves, so as to further shorten cool time.In addition, the close of blind hole is changed according to position
Degree also can intentionally form the part easily absorbed heat and be difficult to the part absorbed heat.For example, positioned in face of the position of incorporating section 2
Heat absorption face 13 can improve radiance, can be reduced positioned at the heat absorption face 13 in face of diffusion part 3, the position for evaporating oral area 5
Radiance etc..
In addition, heat absorption face 13 is by setting blind hole and the spoke on formed or implementation raising region of ultra-red
Coating processing, spray treatment, oxidation aluminum coated steel or the roughening for penetrating rate handle to be formed.In addition, heat absorption face 13 is made
To turn into the structure for the medial surface for being installed on heat-insulated container body 8 with the structure of the split of heat-insulated container body 8, but it is heat-insulated in order to improve
The radiance of the medial surface of container body 8 region of ultra-red of itself, blind hole can also be formed in the medial surface itself of heat-insulated container body 8
Or implement coating processing etc..In the case where the face 13 that will absorb heat is integrally formed with heat-insulated container body 8, because being formed at heat-insulated appearance
Contact thermal resistance between body 8 and heat absorption face 13 disappears, therefore can correspondingly speed up cooling velocity.
Fig. 3 be in the opposed faces opposed with incorporating section 2 and diffusion part 3 set heat absorption face 13 example, Fig. 4 be with
Heat absorption face 13 is set in the opposed opposed faces in incorporating section 2, and guarantor described later is set between diffusion part 3 and heat-insulated container body 8
The example of warm plate portion 16, Fig. 5 are in the opposed opposed faces of diffusion part 3 with incorporating section 2 and in addition to around evaporation oral area 5
Heat absorption face 13 is set, and the example of insulation plate portion 16 is set around evaporation oral area 5.
In addition, in fig. 3 and in fig. 5, lattice 19 the opposed faces opposed with incorporating section 2 and lattice 19 with diffusion
Heat absorption face 13 is set respectively in the opposed opposed faces in portion 3.By as heat absorption face 13 is set on the lattice 19 respectively
Structure, the height of evaporation source 4 can be made closer.
Insulation plate portion 16 is made up of the relatively low board member of the radiance of region of ultra-red.Insulation plate portion 16, which is worked as, to be arranged to expanding
When dissipating between the heating part 7 heated in portion 3 and heat-insulated container body 8 around the periphery of evaporation oral area 5, the evaporation oral area can be made
5 cooling velocity is slower than other positions, and the power supply of heating part 7 is cut off in the state of evaporation rate is higher, can also be pressed down
The precipitation of prepared material.
Used Fig. 3 structure evaporation source unit in the case of refrigerating work procedure as described below.
In the case that temperature after film forming is 400 DEG C or so, first, stop the heating of heating part 7 and utilize also to use
The heat radiation of heat absorption face 13 is evaporated the cooling (the first refrigerating work procedure) in source 4.
Then, after evaporation source 4 is cooled to 250 DEG C or so, by the way that refrigerant gas is imported into heat-insulated container body 8 with steaming
Rise in the space 9 between 4 and be evaporated the cooling (the second refrigerating work procedure) in source 4.
As illustrated in FIG. 6, on according to more than process evaporation source 4 is cooled to about 100 DEG C when spent when
Between, it is 6 hours in the conventional example (C) of no cooling countermeasure, the conventional example (B) of the patent document 1 cooled down to reflector
In be 3.5 hours, and Fig. 3 (A ') be 2 hours or so.
Promoted namely based on the cooling of heat radiation by heat absorption face 13, can further improve cooling velocity.
Furthermore, it is also possible to the evaporation source unit impaled as described below in pie graph 1 by dotted line part.
Fig. 7~9 are the setting quantity or change set location for increasing the refrigerant gas entrance hole 10 in Fig. 3~5
Example.
Fig. 7 is not only in the lower surface of heat-insulated container body 8, also in the opposed faces opposed with the left and right side of incorporating section 2
The example of refrigerant gas entrance hole 10 is set respectively.In this case, incorporating section 2 can be further cooled down well.
Fig. 8 is not only the lower surface of heat-insulated container body 8 position of incorporating section 2 (face), also in face of the position of diffusion part 3
Put the example that refrigerant gas entrance hole 10 is set in (each opposed faces opposed with the left and right side of diffusion part 3).In addition, figure
9 be not set refrigerant gas entrance hole 10 in the lower surface of heat-insulated container body 8 (position for facing incorporating section 2), and only in face
To setting refrigerant gas entrance hole 10 on the position (each opposed faces opposed with the left and right side of diffusion part 3) of diffusion part 3
Example.In this case, the cooling in portion 3 can be diffused well.
In addition, as illustrated in figure 10, filmogen 20 is directly stored in the evaporation source 4 of box-like, will be accommodated with
The part of filmogen 20 will be around the space between the surface of filmogen 20 and the upper surface of evaporation source 4 as incorporating section 2
Part as diffusion part 3, in such a configuration, the medial surface that can also turn into heat-insulated container body 8 sets heat absorption face
13 structure.
In Fig. 10, it is configured to set heat absorption face 13 on whole faces of the medial surface of heat-insulated container body 8 and is provided with
Two refrigerant gas entrance holes 10.It is different alternatively, it is also possible to be configured to be directed respectively into from each refrigerant gas entrance hole 10
Refrigerant gas.Such as the structure that a side imports nitrogen, the opposing party imports argon gas can also be turned into.
In addition, as illustrated in Figure 11, evaporation source 4 is multiple as being set up in parallel on the length direction of diffusion part 3
In the case of the so-called doubling resource (ラ イ Application ソ ー ス) of evaporation oral area 5 similarly.That is, Figure 11 is arranged side by side on diffusion part 3
There is provided the structure of four evaporation oral areas 5, and four opening portions for exposing each evaporation oral area 5 are provided with heat-insulated container body 8
12.In addition, it is provided with the lattice 19 separated between incorporating section 2 and diffusion part 3.In addition, heat-insulated container body 8 and incorporating section
2 and the opposed opposed faces of diffusion part 3 in addition to around evaporation oral area 5 on be provided with heat absorption face 13, in evaporation oral area 5
Around be provided with insulation plate portion 16.In addition, the lattice 19 of heat-insulated container body 8 the opposed faces opposed with incorporating section 2 and
Also heat absorption face 13 is respectively arranged with the opposed faces opposed with diffusion part 3 of lattice 19.By as in lattice 19
Upper and lower surface sets the structure of heat absorption face 13 respectively, and the height of evaporation source 4 can be made closer.In addition, in incorporating section 2 and expand
It is that incorporating section 2 and the temperature of diffusion part 3 are easily mutually affected, and are made using lattice 19 in large-scale doubling resource to dissipate portion 3
The good result that incorporating section 2 turns into thermally independent structure with diffusion part 3 especially becomes big.
Figure 11 is the structure for being provided with two refrigerant gas entrance holes 10, can also turn into and be imported from each refrigerant gas
Hole 10 is directed respectively into the structure of different refrigerant gas.Such as a side can also be turned into and import nitrogen, the opposing party's importing argon gas
Structure.
Figure 12 is other examples of the present embodiment for turning into the structure that refrigerant circulating path 15 is set on heating part 7.
Specifically, refrigerant circulating path 15 is configured at the outer surface side of each heating part 7 in snake shape, connects and is used as overall respectively
Form a circulating path.
Cooling water supply portion 29 of the supply as the cooling water of refrigerant is connected with one end of refrigerant circulating path 15,
The cooling water recoverer 30 of cooling Water Sproading is connected with via three-way valve 32 and outflow cooling water is used to carry out greatly in the other end
The atmosphere opening portion 31 that gas opens.In Figure 12, label 24a is to supply cooling to the refrigerant circulating path 23 of heat-insulated container body 8
The cooling water supply portion of water, 24b are the cooling water recoverers for the cooling water for reclaiming refrigerant circulating path 23.
In addition, in other examples, it is configured to two refrigerant gas entrance holes 10 being juxtaposed on heat-insulated container body 8
In face of the lower end of incorporating section 2.In addition, nitrogen supply unit 27 is connected to a refrigerant gas via refrigerant gas pipe arrangement 11
Entrance hole 10, argon gas feed portion 28 are connected to another refrigerant gas entrance hole 10 via refrigerant gas pipe arrangement 11.
In addition, in other examples, heat absorption face 13 and it is incubated that plate portion 16 is same with Fig. 5 example to be set.
In other examples, in evaporation, make in the refrigerant circulating path 23 of heat-insulated container body 8 circulating cooling all the time
Water, and the valve that the refrigerant circulating path 15 of heating part 7 is led in cooling water supply portion 29 is closed, and make system using three-way valve 32
Refrigerant cycle path 15 carries out atmosphere opening.
Then, the cooling after being deposited as follows.
Stop the heating of heating part 7, and carry out the cooling based on radiation.Now, the cooling of incorporating section 2 is by heat absorption face 13
Promote, and the cooling for evaporating oral area 5 is slack-off due to insulation plate portion 16.Therefore, it is possible to suppress as much as possible heating stop after from
Evaporation particulate is cooled and separated out near evaporation oral area 5 a little caused by incorporating section 2, and carries out incorporating section 2 well
Cooling.
Then, the temperature in the incorporating section 2 of evaporation source 4 be reduced to as defined in the first temperature (250 DEG C) when, by by argon gas
The space 9 that imports between evaporation source 4 and heat-insulated container body 8 promotes to cool down.Moreover, the temperature in the incorporating section 2 of evaporation source 4 drops
It is low during second temperature (200 DEG C), to promote to cool down by the way that nitrogen is imported into the space 9 as defined in.
Then, when the temperature in the incorporating section 2 of evaporation source 4 is reduced to defined 3rd temperature (150 DEG C), cooling water is opened
The valve of supply unit 29, and cooling water is reclaimed using three-way valve 32, so that cooling water is in the refrigerant circulation portion 15 of heating part 7
It is middle to circulate to carry out water cooling.
According to above process, as illustrated in figure 13, can be contracted certainly compared with the conventional example (C) of no cooling countermeasure
Short cool time, additionally it is possible to promptly cooled down to incorporating section (X) and postpone diffusion part (Y) cooling, material can be suppressed
The precipitation of material, the breakage of each several part, evaporation source 4 can be promptly cooled to the temperature that can carry out atmosphere opening.
Further, it is also possible to be configured to, after evaporation source 4 is cooled to set point of temperature, the refrigerant of other species is not introduced into
Gas, but accelerate cooling velocity by increasing the import volume (flow) of the refrigerant gas in importing.In addition, make cooling water
To be about that 5Pa~50Pa is circulated in refrigerant circulating path 15.If because hypertonia, it is likely that due to urgency
Acute temperature change and produce thermal stress so that heating part 7 is damaged.
Claims (20)
1. a kind of vacuum deposition apparatus, it has in vacuum tank and makes the evaporation source that the filmogen of storage evaporates, from being arranged at
The evaporation oral area of the evaporation source projects the filmogen of evaporation, is thus being arranged at the base of the position opposed with the evaporation source
Evaporation film is formed on plate, it is characterised in that
The vacuum deposition apparatus has heat-insulated container body, and the heat-insulated container body accommodates the evaporation source and the evaporation source is added
The heating part of heat, and completely cut off the heat from the evaporation source and the heating part,
The vacuum deposition apparatus sets in the space between the oriented heat-insulated container body and the evaporation source and imports refrigerant gas
Refrigerant gas introducing mechanism, the refrigerant gas introducing mechanism is by refrigerant gas entrance hole and refrigerant gas pipe arrangement structure
Into the refrigerant gas entrance hole is arranged at the heat-insulated container body, and the refrigerant gas pipe arrangement is connected to the refrigerant gas
The entrance side of entrance hole, for exporting the refrigerant gas from the outside of the vacuum tank to the refrigerant gas entrance hole
Body.
2. a kind of vacuum deposition apparatus, it has evaporation source in vacuum tank, and the evaporation source has the storage of storage filmogen
Portion and make the diffusion part that the filmogen of evaporation spread, from the evaporation oral area injection evaporation for being arranged at the diffusion part
Filmogen, thus form evaporation film on the substrate of the position opposed with the evaporation source is arranged at, it is characterised in that
The vacuum deposition apparatus has heat-insulated container body, and the heat-insulated container body accommodates the evaporation source and the evaporation source is added
The heating part of heat, and completely cut off the heat from the evaporation source and the heating part,
The vacuum deposition apparatus sets in the space between the oriented heat-insulated container body and the evaporation source and imports refrigerant gas
Refrigerant gas introducing mechanism, the refrigerant gas introducing mechanism is by refrigerant gas entrance hole and refrigerant gas pipe arrangement structure
Into the refrigerant gas entrance hole is arranged at the heat-insulated container body, and the refrigerant gas pipe arrangement is connected to the refrigerant gas
The entrance side of entrance hole, for exporting the refrigerant gas from the outside of the vacuum tank to the refrigerant gas entrance hole
Body.
3. vacuum deposition apparatus according to claim 1 or 2, it is characterised in that
The heat-insulated container body has the opening portion for being used for exposing the evaporation oral area, and is configured to, from the refrigerant
The refrigerant gas in the space that gas introducing port has been imported between the heat-insulated container body and the evaporation source is from the opening
The outside of the heat-insulated container body is flowed out to around the evaporation oral area in portion.
4. vacuum deposition apparatus according to claim 1 or 2, it is characterised in that
The refrigerant gas entrance hole is arranged at the incorporating section of its outlet side and the storage filmogen of the evaporation source
The position faced.
5. vacuum deposition apparatus according to claim 1 or 2, it is characterised in that
The refrigerant gas entrance hole is arranged at the heat-insulated container body, and is arranged at what is exposed for making the evaporation oral area
The opposite side position of opening portion.
6. vacuum deposition apparatus according to claim 1 or 2, it is characterised in that
In the inner side surface side opposed with the evaporation source of the heat-insulated container body, setting is improved the radiance of region of ultra-red
Heat absorption face.
7. vacuum deposition apparatus according to claim 6, it is characterised in that
The heat absorption face is arranged at the position faced with the incorporating section of the storage filmogen of the evaporation source.
8. vacuum deposition apparatus according to claim 6, it is characterised in that
Blind hole or through hole formed with multiple less than 1/2 diameters with depth on the heat absorption face.
9. vacuum deposition apparatus according to claim 6, it is characterised in that
The opposed faces opposed with the evaporation source of the heat absorption face are coating, the sprayed coating for the radiance for improving region of ultra-red
Or oxidation overlay film, or the male and fomale(M＆F) of regulation roughness.
10. vacuum deposition apparatus according to claim 1 or 2, it is characterised in that
Refrigerant circulating path is provided with the heating part, is configured to refrigerant and is circulated in the refrigerant circulating path.
11. vacuum deposition apparatus according to claim 1 or 2, it is characterised in that
In the position faced with the diffusion part for spreading the filmogen of evaporation of the evaporation source of the heat-insulated container body
Put, be provided with the insulation plate portion for the radiance for reducing region of ultra-red.
12. vacuum deposition apparatus according to claim 11, it is characterised in that
The insulation plate portion is arranged at position near the evaporation oral area.
13. vacuum deposition apparatus according to claim 1 or 2, it is characterised in that
The evaporation source has receiving room and diffuser casing, and the receiving room forms the incorporating section for storing the filmogen, the diffusion
Room, which is formed, makes the diffusion part that the filmogen of evaporation spreads, and the receiving room is linked with the diffuser casing with connecting piece.
14. vacuum deposition apparatus according to claim 13, it is characterised in that
Be provided with the lattice of tabular on the heat-insulated container body, the lattice by the incorporating section and the diffusion part every
Open, and with hole is inserted, the connecting piece inserts this and inserted in hole.
15. vacuum deposition apparatus according to claim 14, it is characterised in that
In the opposed faces opposed with incorporating section of the lattice and the opposed faces opposed with the diffusion part of the lattice
On be respectively arranged with improve region of ultra-red radiance heat absorption face.
16. vacuum deposition apparatus according to claim 1 or 2, it is characterised in that
The evaporation oral area is set side by side with multiple on the length direction of the evaporation source.
17. a kind of cooling means of evaporation source, is the cooling means of the evaporation source of vacuum deposition apparatus, the vacuum deposition apparatus exists
Having in vacuum tank makes the evaporation source that the filmogen of storage evaporates, and is projected from the evaporation oral area for being arranged at the evaporation source
The filmogen of evaporation, evaporation film thus is formed on the substrate of the position opposed with the evaporation source is arranged at, the evaporation source
Cooling means be characterised by,
The space that refrigerant gas is imported between heat-insulated container body and the evaporation source, wherein, the heat-insulated container body accommodates
The evaporation source and the heating part heated to evaporation source, and completely cut off the heat from the evaporation source and the heating part.
18. a kind of cooling means of evaporation source, is the cooling means of the evaporation source of vacuum deposition apparatus, the vacuum deposition apparatus exists
There is the evaporation source, the evaporation source has the incorporating section of storage filmogen and makes the described into membrane material of evaporation in vacuum tank
Expect the diffusion part of diffusion, the filmogen of the evaporation is projected from the evaporation oral area for being arranged at the diffusion part, is thus being set
In forming evaporation film on the substrate of the position opposed with the evaporation source, the cooling means of the evaporation source is characterised by,
The space that refrigerant gas is imported between heat-insulated container body and the evaporation source, wherein, the heat-insulated container body accommodates
The evaporation source and the heating part heated to evaporation source, and completely cut off the heat from the evaporation source and the heating part.
19. the cooling means of the evaporation source according to claim 17 or 18, it is characterised in that
The first refrigerating work procedure is carried out, in the first refrigerating work procedure, by the heat radiation by means of heat absorption face to the evaporation source
Cooled down, wherein, the heat absorption face is arranged at the inner side surface side opposed with the evaporation source of the heat-insulated container body, and carries
The radiance in high IR region,
Then carry out the second refrigerating work procedure, in the second refrigerating work procedure, by refrigerant gas imported into the heat-insulated container body with
Space between the evaporation source, thus the evaporation source is cooled down.
20. the cooling means of the evaporation source according to claim 17 or 18, it is characterised in that
When the evaporation source turns into below set point of temperature, make the import volume of the refrigerant gas increase.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111476889.7A CN114231909B (en) | 2016-04-28 | 2017-04-27 | Vacuum vapor deposition device and method for cooling evaporation source |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-090099 | 2016-04-28 | ||
| JP2016090099A JP6641226B2 (en) | 2016-04-28 | 2016-04-28 | Vacuum evaporation apparatus and method for cooling evaporation source |
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| CN202111476889.7A Division CN114231909B (en) | 2016-04-28 | 2017-04-27 | Vacuum vapor deposition device and method for cooling evaporation source |
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| CN201710286860.XA Pending CN107338410A (en) | 2016-04-28 | 2017-04-27 | The cooling means of vacuum deposition apparatus and evaporation source |
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| JP (1) | JP6641226B2 (en) |
| KR (1) | KR102190775B1 (en) |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109321883A (en) * | 2018-10-15 | 2019-02-12 | 武汉华星光电半导体显示技术有限公司 | A kind of evaporator |
| CN110541146A (en) * | 2018-05-29 | 2019-12-06 | 佳能特机株式会社 | evaporation source device, evaporation device and evaporation system |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11795541B2 (en) * | 2017-11-16 | 2023-10-24 | Applied Materials, Inc. | Method of cooling a deposition source, chamber for cooling a deposition source and deposition system |
| JP6526880B1 (en) * | 2018-06-29 | 2019-06-05 | キヤノントッキ株式会社 | Evaporation source and evaporation apparatus |
| KR20200079901A (en) | 2018-12-26 | 2020-07-06 | 송재만 | (Refrigerant circuit structure for temperature maintenance of refrigerant evaporator of vacuum evaporator |
| JP6605163B1 (en) * | 2019-03-05 | 2019-11-13 | 日本エア・リキード株式会社 | Solid material container |
| KR102221962B1 (en) * | 2019-03-25 | 2021-03-04 | 엘지전자 주식회사 | Deposition apparatus |
| CN112877651A (en) * | 2021-01-08 | 2021-06-01 | 京东方科技集团股份有限公司 | Evaporation plating device |
| KR102509629B1 (en) * | 2021-02-08 | 2023-03-16 | (주)에스브이엠테크 | High frequency induction heating device for film deposition facilities |
| JP7291197B2 (en) * | 2021-07-15 | 2023-06-14 | キヤノントッキ株式会社 | Film forming apparatus, film forming method, and evaporation source unit |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2017197824A (en) | 2017-11-02 |
| CN114231909A (en) | 2022-03-25 |
| CN114231909B (en) | 2023-12-01 |
| JP6641226B2 (en) | 2020-02-05 |
| KR102190775B1 (en) | 2020-12-14 |
| KR20170123244A (en) | 2017-11-07 |
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