KR102577199B1 - 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture) - Google Patents

선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture) Download PDF

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KR102577199B1
KR102577199B1 KR1020197030174A KR20197030174A KR102577199B1 KR 102577199 B1 KR102577199 B1 KR 102577199B1 KR 1020197030174 A KR1020197030174 A KR 1020197030174A KR 20197030174 A KR20197030174 A KR 20197030174A KR 102577199 B1 KR102577199 B1 KR 102577199B1
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transfer robot
load lock
transfer
atv
efem
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KR20190120834A (ko
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리처드 에이치. 굴드
리처드 블랭크
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램 리써치 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Prostheses (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
KR1020197030174A 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture) Active KR102577199B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020237030422A KR102778382B1 (ko) 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762471478P 2017-03-15 2017-03-15
US62/471,478 2017-03-15
PCT/US2018/022397 WO2018170104A1 (en) 2017-03-15 2018-03-14 Reduced footprint platform architecture with linear vacuum transfer module

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020237030422A Division KR102778382B1 (ko) 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)

Publications (2)

Publication Number Publication Date
KR20190120834A KR20190120834A (ko) 2019-10-24
KR102577199B1 true KR102577199B1 (ko) 2023-09-08

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KR1020257007190A Pending KR20250035046A (ko) 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)
KR1020237030422A Active KR102778382B1 (ko) 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)
KR1020197030174A Active KR102577199B1 (ko) 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)

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KR1020257007190A Pending KR20250035046A (ko) 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)
KR1020237030422A Active KR102778382B1 (ko) 2017-03-15 2018-03-14 선형 진공 이송 모듈을 갖는 감소된 풋프린트 플랫폼 아키텍처 (Footprint Platform Architecture)

Country Status (8)

Country Link
US (3) US11521869B2 (enExample)
EP (2) EP3596752B1 (enExample)
JP (3) JP7275039B2 (enExample)
KR (3) KR20250035046A (enExample)
CN (3) CN118538644A (enExample)
SG (2) SG11201908188SA (enExample)
TW (2) TWI765984B (enExample)
WO (1) WO2018170104A1 (enExample)

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KR20240004090A (ko) * 2021-04-28 2024-01-11 램 리써치 코포레이션 반도체 툴 배치들
JP7726746B2 (ja) 2021-11-09 2025-08-20 東京エレクトロン株式会社 基板処理システム
KR20240096821A (ko) * 2021-11-11 2024-06-26 램 리써치 코포레이션 높은 처리량을 위한 네스팅 대기형 로봇 암
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KR20250006926A (ko) * 2022-04-22 2025-01-13 램 리써치 코포레이션 로봇을 갖는 얕은 깊이의 장비 프론트 엔드 모듈
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치
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CN110447095A (zh) 2019-11-12
JP7275039B2 (ja) 2023-05-17
TW201901835A (zh) 2019-01-01
US20230062737A1 (en) 2023-03-02
KR102778382B1 (ko) 2025-03-06
CN118538643A (zh) 2024-08-23
KR20230131969A (ko) 2023-09-14
KR20190120834A (ko) 2019-10-24
JP2020510310A (ja) 2020-04-02
CN110447095B (zh) 2024-04-26
JP7608512B2 (ja) 2025-01-06
US11908714B2 (en) 2024-02-20
CN118538644A (zh) 2024-08-23
US11521869B2 (en) 2022-12-06
SG11201908188SA (en) 2019-10-30
EP3596752A1 (en) 2020-01-22
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JP2025038126A (ja) 2025-03-18
KR20250035046A (ko) 2025-03-11
US20240194505A1 (en) 2024-06-13
TW202232632A (zh) 2022-08-16
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