CN118538644A - 采用线性真空传送模块减少占用面积平台架构 - Google Patents
采用线性真空传送模块减少占用面积平台架构 Download PDFInfo
- Publication number
- CN118538644A CN118538644A CN202410408652.2A CN202410408652A CN118538644A CN 118538644 A CN118538644 A CN 118538644A CN 202410408652 A CN202410408652 A CN 202410408652A CN 118538644 A CN118538644 A CN 118538644A
- Authority
- CN
- China
- Prior art keywords
- transfer
- load lock
- transfer robot
- atv
- transfer module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012546 transfer Methods 0.000 title claims abstract description 124
- 238000012545 processing Methods 0.000 claims abstract description 90
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 239000012636 effector Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 description 31
- 230000008569 process Effects 0.000 description 26
- 239000004065 semiconductor Substances 0.000 description 8
- 239000000872 buffer Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000012536 storage buffer Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
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- 238000003860 storage Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 235000019687 Lamb Nutrition 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- -1 oxides Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
- Prostheses (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762471478P | 2017-03-15 | 2017-03-15 | |
| US62/471,478 | 2017-03-15 | ||
| PCT/US2018/022397 WO2018170104A1 (en) | 2017-03-15 | 2018-03-14 | Reduced footprint platform architecture with linear vacuum transfer module |
| CN201880018373.8A CN110447095B (zh) | 2017-03-15 | 2018-03-14 | 采用线性真空传送模块减少占用面积平台架构 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880018373.8A Division CN110447095B (zh) | 2017-03-15 | 2018-03-14 | 采用线性真空传送模块减少占用面积平台架构 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118538644A true CN118538644A (zh) | 2024-08-23 |
Family
ID=63523643
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410408652.2A Pending CN118538644A (zh) | 2017-03-15 | 2018-03-14 | 采用线性真空传送模块减少占用面积平台架构 |
| CN202410408568.0A Pending CN118538643A (zh) | 2017-03-15 | 2018-03-14 | 采用线性真空传送模块减少占用面积平台架构 |
| CN201880018373.8A Active CN110447095B (zh) | 2017-03-15 | 2018-03-14 | 采用线性真空传送模块减少占用面积平台架构 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410408568.0A Pending CN118538643A (zh) | 2017-03-15 | 2018-03-14 | 采用线性真空传送模块减少占用面积平台架构 |
| CN201880018373.8A Active CN110447095B (zh) | 2017-03-15 | 2018-03-14 | 采用线性真空传送模块减少占用面积平台架构 |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US11521869B2 (enExample) |
| EP (2) | EP3596752B1 (enExample) |
| JP (3) | JP7275039B2 (enExample) |
| KR (3) | KR102577199B1 (enExample) |
| CN (3) | CN118538644A (enExample) |
| SG (2) | SG11201908188SA (enExample) |
| TW (2) | TWI765984B (enExample) |
| WO (1) | WO2018170104A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10424498B2 (en) | 2013-09-09 | 2019-09-24 | Persimmon Technologies Corporation | Substrate transport vacuum platform |
| JP7576555B2 (ja) * | 2019-02-14 | 2024-10-31 | パーシモン テクノロジーズ コーポレイション | ２リンクアームを有するリニアロボット |
| US11164769B2 (en) * | 2019-07-30 | 2021-11-02 | Brooks Automation, Inc. | Robot embedded vision apparatus |
| JP7705388B2 (ja) | 2019-11-01 | 2025-07-09 | ラム リサーチ コーポレーション | 重力場センサを備えたウエハハンドリングロボット |
| CN111081619B (zh) * | 2019-12-27 | 2022-11-25 | 上海至纯洁净系统科技股份有限公司 | 一种晶圆片传输装置以及方法 |
| JP7592098B2 (ja) * | 2020-03-02 | 2024-11-29 | ラム リサーチ コーポレーション | 基板処理システム用のチラー開閉コネクタ |
| KR20220164576A (ko) * | 2020-04-06 | 2022-12-13 | 램 리써치 코포레이션 | 기판 프로세싱 시스템들의 프로세스 모듈 바이어스 어셈블리들을 위한 슬라이드 및 피봇 어셈블리들 |
| CN113644005A (zh) * | 2020-05-11 | 2021-11-12 | 中微半导体设备(上海)股份有限公司 | 一种半导体处理系统 |
| US11581203B2 (en) * | 2020-09-02 | 2023-02-14 | Applied Materials, Inc. | Systems for integrating load locks into a factory interface footprint space |
| KR102866529B1 (ko) * | 2020-10-28 | 2025-09-30 | 삼성전자주식회사 | 반도체 소자의 제조 장치 |
| KR20240004090A (ko) * | 2021-04-28 | 2024-01-11 | 램 리써치 코포레이션 | 반도체 툴 배치들 |
| JP7726746B2 (ja) | 2021-11-09 | 2025-08-20 | 東京エレクトロン株式会社 | 基板処理システム |
| WO2023086848A1 (en) * | 2021-11-11 | 2023-05-19 | Lam Research Corporation | Nesting atmospheric robot arms for high throughput |
| KR20230111438A (ko) | 2022-01-18 | 2023-07-25 | 삼성전자주식회사 | 반도체 기판 처리 장치 |
| US20250250125A1 (en) * | 2022-04-22 | 2025-08-07 | Lam Research Corporation | Shallow-depth equipment front end module with robot |
| KR102638655B1 (ko) * | 2023-08-07 | 2024-02-20 | 에이피티씨 주식회사 | 멀티 층 efem을 포함하는 기판 이송 장치 |
| TWI874040B (zh) * | 2023-12-13 | 2025-02-21 | 日商Ｊｅｌ股份有限公司 | 搬送裝置及搬送裝置之控制方法 |
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| US5789890A (en) * | 1996-03-22 | 1998-08-04 | Genmark Automation | Robot having multiple degrees of freedom |
| US6062798A (en) | 1996-06-13 | 2000-05-16 | Brooks Automation, Inc. | Multi-level substrate processing apparatus |
| US6050891A (en) * | 1998-02-06 | 2000-04-18 | Applied Materials, Inc. | Vacuum processing system with turbo-axial fan in clean-air supply system of front end environment |
| US6142722A (en) * | 1998-06-17 | 2000-11-07 | Genmark Automation, Inc. | Automated opening and closing of ultra clean storage containers |
| JP4558981B2 (ja) * | 2000-11-14 | 2010-10-06 | 株式会社ダイヘン | トランスファロボット |
| US7066707B1 (en) * | 2001-08-31 | 2006-06-27 | Asyst Technologies, Inc. | Wafer engine |
| JP2004006665A (ja) * | 2002-02-20 | 2004-01-08 | Tokyo Electron Ltd | 真空処理装置 |
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| JP4283559B2 (ja) * | 2003-02-24 | 2009-06-24 | 東京エレクトロン株式会社 | 搬送装置及び真空処理装置並びに常圧搬送装置 |
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| JP4907077B2 (ja) * | 2004-11-30 | 2012-03-28 | 株式会社Ｓｅｎ | ウエハ処理装置及びウエハ処理方法並びにイオン注入装置 |
| JP4619854B2 (ja) * | 2005-04-18 | 2011-01-26 | 東京エレクトロン株式会社 | ロードロック装置及び処理方法 |
| US20080206036A1 (en) * | 2007-02-27 | 2008-08-28 | Smith John M | Magnetic media processing tool with storage bays and multi-axis robot arms |
| JP5006122B2 (ja) * | 2007-06-29 | 2012-08-22 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| KR101413762B1 (ko) | 2007-08-22 | 2014-07-01 | 위순임 | 기판 처리 시스템 |
| CN101383311B (zh) * | 2007-09-04 | 2010-12-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 晶片传输系统 |
| JP4473343B2 (ja) * | 2007-11-09 | 2010-06-02 | キヤノンアネルバ株式会社 | インライン型ウェハ搬送装置 |
| KR100998663B1 (ko) | 2010-05-24 | 2010-12-07 | 지이에스(주) | 로드락챔버 진공형성장치 |
| JP5387622B2 (ja) * | 2011-06-17 | 2014-01-15 | 株式会社安川電機 | 搬送ロボット |
| KR20180128987A (ko) | 2011-09-16 | 2018-12-04 | 퍼시몬 테크놀로지스 코포레이션 | 기판 이동 장치 |
| JP5810929B2 (ja) | 2012-01-13 | 2015-11-11 | シンフォニアテクノロジー株式会社 | ウェーハ搬送装置 |
| KR20130083857A (ko) * | 2012-01-13 | 2013-07-23 | 노벨러스 시스템즈, 인코포레이티드 | 듀얼 암 진공 로봇 |
| TWI629743B (zh) | 2012-02-10 | 2018-07-11 | 布魯克斯自動機械公司 | 基材處理設備 |
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| US10424498B2 (en) | 2013-09-09 | 2019-09-24 | Persimmon Technologies Corporation | Substrate transport vacuum platform |
| JP6594304B2 (ja) * | 2013-10-18 | 2019-10-23 | ブルックス オートメーション インコーポレイテッド | 処理装置 |
| US9299598B2 (en) * | 2013-12-23 | 2016-03-29 | Lam Research Corp. | Robot with integrated aligner |
| US10278501B2 (en) | 2014-04-25 | 2019-05-07 | Applied Materials, Inc. | Load lock door assembly, load lock apparatus, electronic device processing systems, and methods |
| US9818633B2 (en) * | 2014-10-17 | 2017-11-14 | Lam Research Corporation | Equipment front end module for transferring wafers and method of transferring wafers |
| US10347516B2 (en) * | 2014-11-11 | 2019-07-09 | Applied Materials, Inc. | Substrate transfer chamber |
| KR102417929B1 (ko) | 2015-08-07 | 2022-07-06 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 장치 |
| JP6710518B2 (ja) * | 2015-12-03 | 2020-06-17 | 東京エレクトロン株式会社 | 搬送装置及び補正方法 |
| JP2018174186A (ja) * | 2017-03-31 | 2018-11-08 | 東京エレクトロン株式会社 | 基板処理装置 |
-
2018
- 2018-03-14 CN CN202410408652.2A patent/CN118538644A/zh active Pending
- 2018-03-14 SG SG11201908188S patent/SG11201908188SA/en unknown
- 2018-03-14 KR KR1020197030174A patent/KR102577199B1/ko active Active
- 2018-03-14 KR KR1020257007190A patent/KR20250035046A/ko active Pending
- 2018-03-14 TW TW107108573A patent/TWI765984B/zh active
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| WO2018170104A1 (en) | 2018-09-20 |
| JP2023099172A (ja) | 2023-07-11 |
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| SG11201908188SA (en) | 2019-10-30 |
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