KR102516183B1 - 밀폐된 환경들을 위한 위치 피드백 - Google Patents

밀폐된 환경들을 위한 위치 피드백 Download PDF

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KR102516183B1
KR102516183B1 KR1020217041367A KR20217041367A KR102516183B1 KR 102516183 B1 KR102516183 B1 KR 102516183B1 KR 1020217041367 A KR1020217041367 A KR 1020217041367A KR 20217041367 A KR20217041367 A KR 20217041367A KR 102516183 B1 KR102516183 B1 KR 102516183B1
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South Korea
Prior art keywords
sensor
track
rotor
stator
aspects
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Korean (ko)
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KR20210156868A (ko
Inventor
자이로 티. 모우라
레자 사에이드포우라자르
브랜든 군
매튜 코디
율리시스 길크라이스트
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브룩스 오토메이션 인코퍼레이티드
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Priority to KR1020237010524A priority Critical patent/KR102732373B1/ko
Publication of KR20210156868A publication Critical patent/KR20210156868A/ko
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K19/00—Synchronous motors or generators
    • H02K19/02—Synchronous motors
    • H02K19/10—Synchronous motors for multi-phase current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K1/00—Details of the magnetic circuit
    • H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
    • H02K1/12—Stationary parts of the magnetic circuit
    • H02K1/14—Stator cores with salient poles
    • H02K1/146—Stator cores with salient poles consisting of a generally annular yoke with salient poles
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K1/00—Details of the magnetic circuit
    • H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
    • H02K1/22—Rotating parts of the magnetic circuit
    • H02K1/24—Rotor cores with salient poles ; Variable reluctance rotors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K1/00—Details of the magnetic circuit
    • H02K1/06—Details of the magnetic circuit characterised by the shape, form or construction
    • H02K1/22—Rotating parts of the magnetic circuit
    • H02K1/24—Rotor cores with salient poles ; Variable reluctance rotors
    • H02K1/246—Variable reluctance rotors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/21—Devices for sensing speed or position, or actuated thereby
    • H02K11/215—Magnetic effect devices, e.g. Hall-effect or magneto-resistive elements
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/12—Casings or enclosures characterised by the shape, form or construction thereof specially adapted for operating in liquid or gas
    • H02K5/128—Casings or enclosures characterised by the shape, form or construction thereof specially adapted for operating in liquid or gas using air-gap sleeves or air-gap discs
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K2211/00—Specific aspects not provided for in the other groups of this subclass relating to measuring or protective devices or electric components
    • H02K2211/03—Machines characterised by circuit boards, e.g. pcb

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Manipulator (AREA)
KR1020217041367A 2013-11-13 2014-11-13 밀폐된 환경들을 위한 위치 피드백 Active KR102516183B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020237010524A KR102732373B1 (ko) 2013-11-13 2014-11-13 밀폐된 환경들을 위한 위치 피드백

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201361903726P 2013-11-13 2013-11-13
US61/903,726 2013-11-13
PCT/US2014/065392 WO2015073634A1 (en) 2013-11-13 2014-11-13 Position feedback for sealed environments
US14/540,058 2014-11-13
KR1020167015689A KR102341790B1 (ko) 2013-11-13 2014-11-13 밀폐된 환경들을 위한 위치 피드백
US14/540,058 US10742092B2 (en) 2013-11-13 2014-11-13 Position feedback for sealed environments

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020167015689A Division KR102341790B1 (ko) 2013-11-13 2014-11-13 밀폐된 환경들을 위한 위치 피드백

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020237010524A Division KR102732373B1 (ko) 2013-11-13 2014-11-13 밀폐된 환경들을 위한 위치 피드백

Publications (2)

Publication Number Publication Date
KR20210156868A KR20210156868A (ko) 2021-12-27
KR102516183B1 true KR102516183B1 (ko) 2023-03-30

Family

ID=54851449

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020217041367A Active KR102516183B1 (ko) 2013-11-13 2014-11-13 밀폐된 환경들을 위한 위치 피드백
KR1020167015689A Active KR102341790B1 (ko) 2013-11-13 2014-11-13 밀폐된 환경들을 위한 위치 피드백
KR1020237010524A Active KR102732373B1 (ko) 2013-11-13 2014-11-13 밀폐된 환경들을 위한 위치 피드백

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020167015689A Active KR102341790B1 (ko) 2013-11-13 2014-11-13 밀폐된 환경들을 위한 위치 피드백
KR1020237010524A Active KR102732373B1 (ko) 2013-11-13 2014-11-13 밀폐된 환경들을 위한 위치 피드백

Country Status (7)

Country Link
US (3) US10742092B2 (enExample)
EP (1) EP3069380B1 (enExample)
JP (4) JP6820198B2 (enExample)
KR (3) KR102516183B1 (enExample)
CN (1) CN107135667B (enExample)
TW (1) TWI695447B (enExample)
WO (1) WO2015073634A1 (enExample)

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CN205159286U (zh) * 2012-12-31 2016-04-13 菲力尔系统公司 用于微辐射热计真空封装组件的晶片级封装的装置
US10523081B2 (en) * 2014-11-25 2019-12-31 Black & Decker Inc. Brushless motor for a power tool
US10404239B2 (en) * 2016-06-03 2019-09-03 Caterpillar Inc. Control system for controlling operation of a machine by imposing shaped hysterisis
DE102016112879B4 (de) * 2016-07-13 2020-01-23 Steiner-Optik Gmbh Fernoptische Einrichtung, insbesondere Zielfernrohr
US10651065B2 (en) * 2017-12-06 2020-05-12 Lam Research Corporation Auto-calibration to a station of a process module that spins a wafer
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US20200411348A1 (en) * 2019-06-28 2020-12-31 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer apparatus
US11353345B2 (en) 2019-07-22 2022-06-07 Boston Dynamics, Inc. Magnetic encoder calibration
CN114640404A (zh) * 2020-12-16 2022-06-17 深圳市中兴微电子技术有限公司 一种幅度相位校准方法、装置、存储介质及电子装置
KR102424176B1 (ko) * 2021-12-17 2022-07-25 김상조 자기부상 회전 장치 및 이를 포함하는 진공 처리 장치
CN115159006B (zh) * 2022-07-13 2024-03-29 中国工程物理研究院材料研究所 一种物料转运系统

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