KR102503365B1 - 내열성이 우수한 도금재 및 그 제조방법 - Google Patents

내열성이 우수한 도금재 및 그 제조방법 Download PDF

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Publication number
KR102503365B1
KR102503365B1 KR1020187003474A KR20187003474A KR102503365B1 KR 102503365 B1 KR102503365 B1 KR 102503365B1 KR 1020187003474 A KR1020187003474 A KR 1020187003474A KR 20187003474 A KR20187003474 A KR 20187003474A KR 102503365 B1 KR102503365 B1 KR 102503365B1
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KR
South Korea
Prior art keywords
layer
alloy
base layer
conductive substrate
plating material
Prior art date
Application number
KR1020187003474A
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English (en)
Korean (ko)
Other versions
KR20180044886A (ko
Inventor
요시토 후지이
요시카즈 오쿠노
신고 가와타
아키라 다치바나
다쓰야 나카쓰가와
슈이치 기타가와
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20180044886A publication Critical patent/KR20180044886A/ko
Application granted granted Critical
Publication of KR102503365B1 publication Critical patent/KR102503365B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020187003474A 2015-09-01 2016-08-30 내열성이 우수한 도금재 및 그 제조방법 KR102503365B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015172147 2015-09-01
JPJP-P-2015-172147 2015-09-01
PCT/JP2016/075347 WO2017038825A1 (ja) 2015-09-01 2016-08-30 耐熱性に優れためっき材及びその製造方法

Publications (2)

Publication Number Publication Date
KR20180044886A KR20180044886A (ko) 2018-05-03
KR102503365B1 true KR102503365B1 (ko) 2023-02-24

Family

ID=58188064

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187003474A KR102503365B1 (ko) 2015-09-01 2016-08-30 내열성이 우수한 도금재 및 그 제조방법

Country Status (4)

Country Link
JP (1) JP6219553B2 (ja)
KR (1) KR102503365B1 (ja)
CN (1) CN107849721B (ja)
WO (1) WO2017038825A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6653340B2 (ja) * 2018-02-01 2020-02-26 Ｊｘ金属株式会社 バーンインテストソケット用表面処理金属材料、それを用いたバーンインテストソケット用コネクタ及びバーンインテストソケット
JP6805217B2 (ja) * 2018-10-18 2020-12-23 Ｊｘ金属株式会社 導電性材料、成型品及び電子部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011195927A (ja) 2010-03-23 2011-10-06 Jx Nippon Mining & Metals Corp 電子材料用銅合金及びその製造方法
JP2014062322A (ja) 2012-08-29 2014-04-10 Kobe Steel Ltd 耐熱性に優れる表面被覆層付き銅合金板条
JP2014122403A (ja) 2012-12-21 2014-07-03 Mitsubishi Materials Corp Ｓｎめっき付き導電材及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2801355B2 (ja) * 1990-04-23 1998-09-21 古河電気工業株式会社 ニッケルめっき銅線とその製造方法
JP4090302B2 (ja) 2001-07-31 2008-05-28 株式会社神戸製鋼所 接続部品成形加工用導電材料板
JP3880877B2 (ja) * 2002-03-29 2007-02-14 Ｄｏｗａホールディングス株式会社 めっきを施した銅または銅合金およびその製造方法
JP6173943B2 (ja) * 2014-02-20 2017-08-02 株式会社神戸製鋼所 耐熱性に優れる表面被覆層付き銅合金板条

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011195927A (ja) 2010-03-23 2011-10-06 Jx Nippon Mining & Metals Corp 電子材料用銅合金及びその製造方法
JP2014062322A (ja) 2012-08-29 2014-04-10 Kobe Steel Ltd 耐熱性に優れる表面被覆層付き銅合金板条
JP2014122403A (ja) 2012-12-21 2014-07-03 Mitsubishi Materials Corp Ｓｎめっき付き導電材及びその製造方法

Also Published As

Publication number Publication date
JPWO2017038825A1 (ja) 2017-11-02
CN107849721A (zh) 2018-03-27
JP6219553B2 (ja) 2017-10-25
CN107849721B (zh) 2020-11-17
KR20180044886A (ko) 2018-05-03
WO2017038825A1 (ja) 2017-03-09

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