KR102502524B1 - 황산동 도금액 및 이를 이용한 황산동 도금방법 - Google Patents

황산동 도금액 및 이를 이용한 황산동 도금방법 Download PDF

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Publication number
KR102502524B1
KR102502524B1 KR1020197025705A KR20197025705A KR102502524B1 KR 102502524 B1 KR102502524 B1 KR 102502524B1 KR 1020197025705 A KR1020197025705 A KR 1020197025705A KR 20197025705 A KR20197025705 A KR 20197025705A KR 102502524 B1 KR102502524 B1 KR 102502524B1
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KR
South Korea
Prior art keywords
group
formula
compound
copper sulfate
atoms
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KR1020197025705A
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English (en)
Korean (ko)
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KR20210030184A (ko
Inventor
켄 이케다
아야 시모무라
카즈키 키시모토
테츠로 에다
야스코 타카야
유미 타니모토
미키코 코사카
히로키 야스다
Original Assignee
가부시끼가이샤 제이씨유
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Publication of KR20210030184A publication Critical patent/KR20210030184A/ko
Application granted granted Critical
Publication of KR102502524B1 publication Critical patent/KR102502524B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C217/00—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton
    • C07C217/02—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton
    • C07C217/04—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated
    • C07C217/28—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having one amino group and at least two singly-bound oxygen atoms, with at least one being part of an etherified hydroxy group, bound to the carbon skeleton, e.g. ethers of polyhydroxy amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Polyethers (AREA)
  • Epoxy Resins (AREA)
KR1020197025705A 2018-08-28 2018-08-28 황산동 도금액 및 이를 이용한 황산동 도금방법 KR102502524B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/031628 WO2020044416A1 (ja) 2018-08-28 2018-08-28 硫酸銅めっき液およびこれを用いた硫酸銅めっき方法

Publications (2)

Publication Number Publication Date
KR20210030184A KR20210030184A (ko) 2021-03-17
KR102502524B1 true KR102502524B1 (ko) 2023-02-21

Family

ID=69642720

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197025705A KR102502524B1 (ko) 2018-08-28 2018-08-28 황산동 도금액 및 이를 이용한 황산동 도금방법

Country Status (5)

Country Link
JP (1) JP7208913B2 (zh)
KR (1) KR102502524B1 (zh)
CN (1) CN111108234B (zh)
TW (1) TWI787534B (zh)
WO (1) WO2020044416A1 (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012149351A (ja) * 2004-07-22 2012-08-09 Rohm & Haas Electronic Materials Llc 平滑化剤化合物

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002090623A1 (fr) 2001-05-09 2002-11-14 Ebara-Udylite Co., Ltd. Bain galvanoplastique et procede pour substrat de galvanoplastie faisant appel audit bain
CN1402480B (zh) 2001-08-07 2010-04-21 株式会社藤仓 介质访问控制桥路的地址管理方法和该桥路
JP4115240B2 (ja) * 2002-10-21 2008-07-09 日鉱金属株式会社 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
EP1741804B1 (en) 2005-07-08 2016-04-27 Rohm and Haas Electronic Materials, L.L.C. Electrolytic copper plating method
US7662981B2 (en) * 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
JP4816901B2 (ja) 2005-11-21 2011-11-16 上村工業株式会社 電気銅めっき浴
WO2010132876A1 (en) 2009-05-15 2010-11-18 Arizona Board Of Regents For And On Behalf Of Arizona State University Polymers for delivering a substance into a cell
EP2504396B1 (en) 2009-11-27 2021-02-24 Basf Se Composition for copper electroplating comprising leveling agent
US8268157B2 (en) * 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
WO2011135716A1 (ja) 2010-04-30 2011-11-03 荏原ユージライト株式会社 新規化合物およびその利用
JP5505153B2 (ja) * 2010-07-16 2014-05-28 上村工業株式会社 電気銅めっき浴及び電気銅めっき方法
CN103397354B (zh) * 2013-08-08 2016-10-26 上海新阳半导体材料股份有限公司 一种用于减少硅通孔技术镀铜退火后空洞的添加剂
CN104211957B (zh) * 2014-08-28 2016-08-17 中山市宏科化工有限公司 一种纳米二氧化硅改性飞灰金属离子螯合剂及其制备方法
US9783905B2 (en) * 2014-12-30 2017-10-10 Rohm and Haas Electronic Mateirals LLC Reaction products of amino acids and epoxies
ES2681836T3 (es) * 2015-09-10 2018-09-17 Atotech Deutschland Gmbh Composición de baño para chapado de cobre

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012149351A (ja) * 2004-07-22 2012-08-09 Rohm & Haas Electronic Materials Llc 平滑化剤化合物

Also Published As

Publication number Publication date
WO2020044416A1 (ja) 2020-03-05
TW202020234A (zh) 2020-06-01
CN111108234A (zh) 2020-05-05
JP7208913B2 (ja) 2023-01-19
JPWO2020044416A1 (ja) 2021-08-10
CN111108234B (zh) 2023-11-17
TWI787534B (zh) 2022-12-21
KR20210030184A (ko) 2021-03-17

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