KR102469282B1 - 집적 회로 패키지들에 대한 전도성 포스트 보호 - Google Patents

집적 회로 패키지들에 대한 전도성 포스트 보호 Download PDF

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KR102469282B1
KR102469282B1 KR1020177022975A KR20177022975A KR102469282B1 KR 102469282 B1 KR102469282 B1 KR 102469282B1 KR 1020177022975 A KR1020177022975 A KR 1020177022975A KR 20177022975 A KR20177022975 A KR 20177022975A KR 102469282 B1 KR102469282 B1 KR 102469282B1
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South Korea
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substrate
conductive
dielectric
posts
conductive posts
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KR20170113581A (ko
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지 푸
친-관 김
마누엘 알드레테
밀린드 프라빈 샤
드웨인 리차드 셜리
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퀄컴 인코포레이티드
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    • H01L23/5389—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H01L21/4846—
    • H01L21/486—
    • H01L23/49816—
    • H01L23/49827—
    • H01L23/49833—
    • H01L23/49838—
    • H01L23/49866—
    • H01L23/49894—
    • H01L25/105—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
KR1020177022975A 2015-02-20 2016-02-18 집적 회로 패키지들에 대한 전도성 포스트 보호 Active KR102469282B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562118886P 2015-02-20 2015-02-20
US62/118,886 2015-02-20
US14/859,318 2015-09-20
US14/859,318 US9768108B2 (en) 2015-02-20 2015-09-20 Conductive post protection for integrated circuit packages
PCT/US2016/018504 WO2016134165A1 (en) 2015-02-20 2016-02-18 Conductive post protection for integrated circuit packages

Publications (2)

Publication Number Publication Date
KR20170113581A KR20170113581A (ko) 2017-10-12
KR102469282B1 true KR102469282B1 (ko) 2022-11-18

Family

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Application Number Title Priority Date Filing Date
KR1020177022975A Active KR102469282B1 (ko) 2015-02-20 2016-02-18 집적 회로 패키지들에 대한 전도성 포스트 보호

Country Status (8)

Country Link
US (1) US9768108B2 (https=)
EP (1) EP3259776A1 (https=)
JP (1) JP6789228B2 (https=)
KR (1) KR102469282B1 (https=)
CN (1) CN107251217B (https=)
BR (1) BR112017017746A2 (https=)
SG (1) SG11201705672XA (https=)
WO (1) WO2016134165A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102397905B1 (ko) 2017-12-27 2022-05-13 삼성전자주식회사 인터포저 기판 및 반도체 패키지
US11791276B2 (en) * 2021-04-08 2023-10-17 Qualcomm Incorporated Package comprising passive component between substrates for improved power distribution network (PDN) performance
WO2023135720A1 (ja) * 2022-01-14 2023-07-20 キヤノン株式会社 モジュールおよび機器
US20250323136A1 (en) * 2024-04-12 2025-10-16 Qualcomm Incorporated Integrated circuit (ic) package including two substrates and vertical interconnects coupling the two substrates, the vertical interconnects comprising a metal ball and metal pin combination to address an increased distance between substrates

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010012643A1 (en) 1998-01-18 2001-08-09 Kabushiki Kaisha Toshiba Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same
US20110147911A1 (en) 2009-12-22 2011-06-23 Epic Technologies, Inc. Stackable circuit structures and methods of fabrication thereof
US20130009319A1 (en) * 2011-07-07 2013-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and Methods for Forming Through Vias

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JP2003347501A (ja) * 2002-05-23 2003-12-05 Hitachi Cable Ltd 半導体モジュール及びそれに用いる配線板、ならびに半導体モジュールの製造方法及び配線板の製造方法
JP3973624B2 (ja) * 2003-12-24 2007-09-12 富士通株式会社 高周波デバイス
JP4396839B2 (ja) * 2004-08-11 2010-01-13 日本電気株式会社 キャビティ構造プリント配線板とその製造方法及び実装構造
JP4551321B2 (ja) * 2005-07-21 2010-09-29 新光電気工業株式会社 電子部品実装構造及びその製造方法
JP2007053235A (ja) * 2005-08-18 2007-03-01 Matsushita Electric Ind Co Ltd 基台及び半導体デバイス
JP2007123524A (ja) * 2005-10-27 2007-05-17 Shinko Electric Ind Co Ltd 電子部品内蔵基板
US7632708B2 (en) 2005-12-27 2009-12-15 Tessera, Inc. Microelectronic component with photo-imageable substrate
JP2007194436A (ja) * 2006-01-19 2007-08-02 Elpida Memory Inc 半導体パッケージ、導電性ポスト付き基板、積層型半導体装置、半導体パッケージの製造方法及び積層型半導体装置の製造方法
JP2009099750A (ja) * 2007-10-17 2009-05-07 Powertech Technology Inc 半導体パッケージ
JP5185062B2 (ja) * 2008-10-21 2013-04-17 パナソニック株式会社 積層型半導体装置及び電子機器
US8623753B1 (en) * 2009-05-28 2014-01-07 Amkor Technology, Inc. Stackable protruding via package and method
JP2011095705A (ja) * 2009-09-30 2011-05-12 Fujifilm Corp 感光性組成物、感光性ソルダーレジスト組成物及び感光性ソルダーレジストフィルム、並びに、永久パターン、その形成方法及びプリント基板
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US8637992B2 (en) 2011-11-30 2014-01-28 Invensas Corporation Flip chip package for DRAM with two underfill materials
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CN103632988B (zh) * 2012-08-28 2016-10-19 宏启胜精密电子(秦皇岛)有限公司 层叠封装结构及其制作方法
CN103681365B (zh) * 2012-08-31 2016-08-10 宏启胜精密电子(秦皇岛)有限公司 层叠封装结构及其制作方法
CN103681359A (zh) * 2012-09-19 2014-03-26 宏启胜精密电子(秦皇岛)有限公司 层叠封装结构及其制作方法
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US9378982B2 (en) 2013-01-31 2016-06-28 Taiwan Semiconductor Manufacturing Company, Ltd. Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package
CN104051389B (zh) * 2013-03-12 2018-05-15 台湾积体电路制造股份有限公司 具有焊盘连接件上通孔的叠层封装件
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Publication number Priority date Publication date Assignee Title
US20010012643A1 (en) 1998-01-18 2001-08-09 Kabushiki Kaisha Toshiba Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same
US20110147911A1 (en) 2009-12-22 2011-06-23 Epic Technologies, Inc. Stackable circuit structures and methods of fabrication thereof
US20130009319A1 (en) * 2011-07-07 2013-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and Methods for Forming Through Vias

Also Published As

Publication number Publication date
JP2018507556A (ja) 2018-03-15
CN107251217A (zh) 2017-10-13
KR20170113581A (ko) 2017-10-12
WO2016134165A1 (en) 2016-08-25
EP3259776A1 (en) 2017-12-27
US9768108B2 (en) 2017-09-19
CN107251217B (zh) 2021-03-12
US20160247754A1 (en) 2016-08-25
BR112017017746A2 (en) 2018-04-03
JP6789228B2 (ja) 2020-11-25
SG11201705672XA (en) 2017-09-28

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