JPWO2023135720A1 - - Google Patents

Info

Publication number
JPWO2023135720A1
JPWO2023135720A1 JP2023573728A JP2023573728A JPWO2023135720A1 JP WO2023135720 A1 JPWO2023135720 A1 JP WO2023135720A1 JP 2023573728 A JP2023573728 A JP 2023573728A JP 2023573728 A JP2023573728 A JP 2023573728A JP WO2023135720 A1 JPWO2023135720 A1 JP WO2023135720A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023573728A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023135720A1 publication Critical patent/JPWO2023135720A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
JP2023573728A 2022-01-14 2022-01-14 Pending JPWO2023135720A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/001025 WO2023135720A1 (ja) 2022-01-14 2022-01-14 モジュールおよび機器

Publications (1)

Publication Number Publication Date
JPWO2023135720A1 true JPWO2023135720A1 (https=) 2023-07-20

Family

ID=87278692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023573728A Pending JPWO2023135720A1 (https=) 2022-01-14 2022-01-14

Country Status (3)

Country Link
US (1) US20240407098A1 (https=)
JP (1) JPWO2023135720A1 (https=)
WO (1) WO2023135720A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023102815A (ja) * 2022-01-13 2023-07-26 キヤノン株式会社 電子モジュール、中間接続部材及び電子機器
CN118198079B (zh) * 2024-03-26 2026-04-24 上海显耀显示科技股份有限公司 微显示面板及其形成方法、近眼显示设备
FR3165143A1 (fr) * 2024-07-29 2026-01-30 Stmicroelectronics International N.V. Procede de fabrication en nombre de dispositifs electroniques integrant des elements de protection et dispositifs electroniques en resultant

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260226A (ja) * 1993-03-01 1994-09-16 Hitachi Denshi Ltd 基板接続方法及び基板接続端子
JP2001210954A (ja) * 2000-01-24 2001-08-03 Ibiden Co Ltd 多層基板
JP2003007373A (ja) * 2001-06-26 2003-01-10 Toshiba Corp 圧接コネクタを有した撮像素子モジュール
JP2008294331A (ja) * 2007-05-28 2008-12-04 Shinko Electric Ind Co Ltd 部品内蔵基板
JP2010225699A (ja) * 2009-03-19 2010-10-07 Olympus Corp 積層実装構造体
JP2011134777A (ja) * 2009-12-22 2011-07-07 Panasonic Electric Works Co Ltd 回路基板、回路モジュール、回路基板の製造方法および回路モジュールの製造方法
JP2016048728A (ja) * 2014-08-27 2016-04-07 株式会社村田製作所 導電性ポスト、及び、導電性ポストを用いた積層基板の製造方法
JP2016136560A (ja) * 2015-01-23 2016-07-28 キヤノン株式会社 フレキシブル基板およびそれを備える電子機器
JP2020043335A (ja) * 2018-08-14 2020-03-19 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 画像センサのためのマルチチップパッケージング構造体
WO2020184027A1 (ja) * 2019-03-13 2020-09-17 ソニーセミコンダクタソリューションズ株式会社 半導体装置、撮像装置および半導体装置の製造方法
WO2021125074A1 (ja) * 2019-12-20 2021-06-24 ソニーセミコンダクタソリューションズ株式会社 カメラモジュール、スペーサ部品およびカメラモジュールの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4905453B2 (ja) * 2006-04-27 2012-03-28 パナソニック株式会社 三次元接続構造体
JP5281346B2 (ja) * 2008-09-18 2013-09-04 新光電気工業株式会社 半導体装置及びその製造方法
WO2012086100A1 (ja) * 2010-12-21 2012-06-28 パナソニック株式会社 半導体装置
JP2014022573A (ja) * 2012-07-18 2014-02-03 Nikon Corp 撮像素子の製造方法、α線対策ガラスの製造方法、および撮像素子
KR102055361B1 (ko) * 2013-06-05 2019-12-12 삼성전자주식회사 반도체 패키지
US9768108B2 (en) * 2015-02-20 2017-09-19 Qualcomm Incorporated Conductive post protection for integrated circuit packages
US10535632B2 (en) * 2016-09-02 2020-01-14 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor package structure and method of manufacturing the same
KR102677777B1 (ko) * 2019-04-01 2024-06-25 삼성전자주식회사 반도체 패키지
KR102767585B1 (ko) * 2019-07-24 2025-02-17 삼성전자주식회사 이미지 센서 칩을 포함하는 반도체 패키지 및 이의 제조 방법
US12136597B2 (en) * 2020-11-13 2024-11-05 Mediatek Inc. Semiconductor package having an interposer in which one or more dies are formed and method of forming the same

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260226A (ja) * 1993-03-01 1994-09-16 Hitachi Denshi Ltd 基板接続方法及び基板接続端子
JP2001210954A (ja) * 2000-01-24 2001-08-03 Ibiden Co Ltd 多層基板
JP2003007373A (ja) * 2001-06-26 2003-01-10 Toshiba Corp 圧接コネクタを有した撮像素子モジュール
JP2008294331A (ja) * 2007-05-28 2008-12-04 Shinko Electric Ind Co Ltd 部品内蔵基板
JP2010225699A (ja) * 2009-03-19 2010-10-07 Olympus Corp 積層実装構造体
JP2011134777A (ja) * 2009-12-22 2011-07-07 Panasonic Electric Works Co Ltd 回路基板、回路モジュール、回路基板の製造方法および回路モジュールの製造方法
JP2016048728A (ja) * 2014-08-27 2016-04-07 株式会社村田製作所 導電性ポスト、及び、導電性ポストを用いた積層基板の製造方法
JP2016136560A (ja) * 2015-01-23 2016-07-28 キヤノン株式会社 フレキシブル基板およびそれを備える電子機器
JP2020043335A (ja) * 2018-08-14 2020-03-19 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 画像センサのためのマルチチップパッケージング構造体
WO2020184027A1 (ja) * 2019-03-13 2020-09-17 ソニーセミコンダクタソリューションズ株式会社 半導体装置、撮像装置および半導体装置の製造方法
WO2021125074A1 (ja) * 2019-12-20 2021-06-24 ソニーセミコンダクタソリューションズ株式会社 カメラモジュール、スペーサ部品およびカメラモジュールの製造方法

Also Published As

Publication number Publication date
US20240407098A1 (en) 2024-12-05
WO2023135720A1 (ja) 2023-07-20

Similar Documents

Publication Publication Date Title
BR102022025291A2 (https=)
BR102023014872A2 (https=)
BR102023012440A2 (https=)
BR102023010976A2 (https=)
BR102023009641A2 (https=)
BR102023008688A2 (https=)
BR102023007252A2 (https=)
BR102023005164A2 (https=)
BR102023001987A2 (https=)
BR102023001877A2 (https=)
BR102023000289A2 (https=)
BR102022026909A2 (https=)
BR202022009269U2 (https=)
BR202022005961U2 (https=)
BR202022001779U2 (https=)
BR202022000931U2 (https=)
BY13141U (https=)
BY13151U (https=)
BY13135U (https=)
BY13136U (https=)
BY13137U (https=)
BY13138U (https=)
BY13139U (https=)
BY13140U (https=)
CN307045319S (https=)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250108

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20251216

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20260213

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20260325