JP4396839B2 - キャビティ構造プリント配線板とその製造方法及び実装構造 - Google Patents
キャビティ構造プリント配線板とその製造方法及び実装構造 Download PDFInfo
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- JP4396839B2 JP4396839B2 JP2004234909A JP2004234909A JP4396839B2 JP 4396839 B2 JP4396839 B2 JP 4396839B2 JP 2004234909 A JP2004234909 A JP 2004234909A JP 2004234909 A JP2004234909 A JP 2004234909A JP 4396839 B2 JP4396839 B2 JP 4396839B2
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- wiring board
- cavity
- printed wiring
- post
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Description
本発明では、露光・現像によるウェットプロセスでのキャビティ形成手法であるため、断線の懸念なくキャビティ底面にファイン回路を設けておくことができる。
本発明では、特定回路のみにめっきリードを接続し、めっきが施される回路を特定し、めっきが施されるべきでない回路にはめっきリードを設けないようにして、特定部分にのみめっきを形成することができるから、高密度に配線を形成することができる。
この後、必要により感光性樹脂6を研磨することにより銅ポスト9の表面を削り出しても良いし、ソルダーレジストや銅パッドの表面処理などを行っても良い。
2 外部端子
3 回路
4 めっきリード
5 めっきレジスト
6 感光性樹脂
7 ポスト穴
8 キャビティ
9 銅ポスト
10 キャビティを有するプリント配線板
11,16,17 電子部品
30 マザーボード
100、200,300 モジュール構造
Claims (3)
- キャビティを有するプリント配線基板の製造方法であって、基板面に形成されたプリント回路と外部端子とを有するプリント配線基板の前記プリント回路上に選択的にめっきレジストを形成する第1の工程と、前記めっきレジストの形成されたプリント配線基板に所定の厚みの感光性樹脂を塗布して露光・現像処理によって前記外部端子及びプリント回路上の前記感光性樹脂を除去し、ポスト穴及びキャビティを形成する第2の工程と、前記ポスト穴に銅ポストを形成する第3の工程と、前記プリント回路上の前記めっきレジストを除去する第4の工程とを含み、
前記第3の工程は前記プリント配線基板に形成された外部端子と電気的に接続された電解メッキ用のリードを用いて電解銅めっきによって前記銅ポストを形成することを特徴とするキャビティを有するプリント配線基板の製造方法。 - 前記第1の工程は、キャビティの底面となるプリント回路に剥離可能な樹脂を選択的に印刷工程と加熱工程とを含むことを特徴とする請求項1記載のキャビティを有するプリント配線基板の製造方法。
- キャビティを有するプリント配線基板の製造方法であって、基板面に形成されたプリント回路と外部端子とを有するプリント配線基板に感光性樹脂を塗布して露光・現像処理によって前記外部端子上の前記感光性樹脂を除去しポスト穴を形成する第1の工程と、前記ポスト穴に銅ポストを形成する第2の工程と、前記プリント回路上の前記感光性樹脂を選択的に露光・現像処理してキャビティを形成する第3の工程とを含み、前記第2の工程は前記プリント配線基板に形成された外部端子と電気的に接続された電解メッキ用のリードを用いて電解銅めっきによって前記銅ポストを形成することを特徴とするキャビティを有するプリント配線基板の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004234909A JP4396839B2 (ja) | 2004-08-11 | 2004-08-11 | キャビティ構造プリント配線板とその製造方法及び実装構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2004234909A JP4396839B2 (ja) | 2004-08-11 | 2004-08-11 | キャビティ構造プリント配線板とその製造方法及び実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006054322A JP2006054322A (ja) | 2006-02-23 |
JP4396839B2 true JP4396839B2 (ja) | 2010-01-13 |
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JP2004234909A Expired - Fee Related JP4396839B2 (ja) | 2004-08-11 | 2004-08-11 | キャビティ構造プリント配線板とその製造方法及び実装構造 |
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JP (1) | JP4396839B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5058929B2 (ja) * | 2008-09-29 | 2012-10-24 | 京セラSlcテクノロジー株式会社 | 配線基板およびその製造方法 |
JP2015012139A (ja) * | 2013-06-28 | 2015-01-19 | 凸版印刷株式会社 | 半導体装置及びその製造方法 |
KR101531101B1 (ko) * | 2013-10-02 | 2015-06-23 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
US9768108B2 (en) * | 2015-02-20 | 2017-09-19 | Qualcomm Incorporated | Conductive post protection for integrated circuit packages |
CN112103193B (zh) | 2020-08-21 | 2021-12-03 | 珠海越亚半导体股份有限公司 | 一种嵌埋结构及制备方法、基板 |
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