KR102469282B1 - 집적 회로 패키지들에 대한 전도성 포스트 보호 - Google Patents

집적 회로 패키지들에 대한 전도성 포스트 보호 Download PDF

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KR102469282B1
KR102469282B1 KR1020177022975A KR20177022975A KR102469282B1 KR 102469282 B1 KR102469282 B1 KR 102469282B1 KR 1020177022975 A KR1020177022975 A KR 1020177022975A KR 20177022975 A KR20177022975 A KR 20177022975A KR 102469282 B1 KR102469282 B1 KR 102469282B1
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substrate
conductive
dielectric
posts
conductive posts
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KR20170113581A (ko
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지 푸
친-관 김
마누엘 알드레테
밀린드 프라빈 샤
드웨인 리차드 셜리
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퀄컴 인코포레이티드
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    • H01L23/5389—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H01L21/4846—
    • H01L21/486—
    • H01L23/49816—
    • H01L23/49827—
    • H01L23/49833—
    • H01L23/49838—
    • H01L23/49866—
    • H01L23/49894—
    • H01L25/105—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
KR1020177022975A 2015-02-20 2016-02-18 집적 회로 패키지들에 대한 전도성 포스트 보호 Active KR102469282B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562118886P 2015-02-20 2015-02-20
US62/118,886 2015-02-20
US14/859,318 2015-09-20
US14/859,318 US9768108B2 (en) 2015-02-20 2015-09-20 Conductive post protection for integrated circuit packages
PCT/US2016/018504 WO2016134165A1 (en) 2015-02-20 2016-02-18 Conductive post protection for integrated circuit packages

Publications (2)

Publication Number Publication Date
KR20170113581A KR20170113581A (ko) 2017-10-12
KR102469282B1 true KR102469282B1 (ko) 2022-11-18

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KR1020177022975A Active KR102469282B1 (ko) 2015-02-20 2016-02-18 집적 회로 패키지들에 대한 전도성 포스트 보호

Country Status (8)

Country Link
US (1) US9768108B2 (enExample)
EP (1) EP3259776A1 (enExample)
JP (1) JP6789228B2 (enExample)
KR (1) KR102469282B1 (enExample)
CN (1) CN107251217B (enExample)
BR (1) BR112017017746A2 (enExample)
SG (1) SG11201705672XA (enExample)
WO (1) WO2016134165A1 (enExample)

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KR102397905B1 (ko) 2017-12-27 2022-05-13 삼성전자주식회사 인터포저 기판 및 반도체 패키지
US11791276B2 (en) * 2021-04-08 2023-10-17 Qualcomm Incorporated Package comprising passive component between substrates for improved power distribution network (PDN) performance
WO2023135720A1 (ja) * 2022-01-14 2023-07-20 キヤノン株式会社 モジュールおよび機器
US12667029B2 (en) 2022-01-19 2026-06-23 Qualcomm Incorporated Package comprising a substrate with post interconnects and a solder resist layer having a cavity
US20240071848A1 (en) * 2022-08-25 2024-02-29 Intel Corporation Through glass vias (tgvs) in glass core substrates
US20250140704A1 (en) * 2023-10-25 2025-05-01 GM Global Technology Operations LLC Multimodule package for multilevel inverter
US20250323136A1 (en) * 2024-04-12 2025-10-16 Qualcomm Incorporated Integrated circuit (ic) package including two substrates and vertical interconnects coupling the two substrates, the vertical interconnects comprising a metal ball and metal pin combination to address an increased distance between substrates

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US20010012643A1 (en) 1998-01-18 2001-08-09 Kabushiki Kaisha Toshiba Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same
US20110147911A1 (en) 2009-12-22 2011-06-23 Epic Technologies, Inc. Stackable circuit structures and methods of fabrication thereof
US20130009319A1 (en) * 2011-07-07 2013-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and Methods for Forming Through Vias

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JP3973624B2 (ja) * 2003-12-24 2007-09-12 富士通株式会社 高周波デバイス
JP4396839B2 (ja) * 2004-08-11 2010-01-13 日本電気株式会社 キャビティ構造プリント配線板とその製造方法及び実装構造
JP4551321B2 (ja) * 2005-07-21 2010-09-29 新光電気工業株式会社 電子部品実装構造及びその製造方法
JP2007053235A (ja) * 2005-08-18 2007-03-01 Matsushita Electric Ind Co Ltd 基台及び半導体デバイス
JP2007123524A (ja) * 2005-10-27 2007-05-17 Shinko Electric Ind Co Ltd 電子部品内蔵基板
US7632708B2 (en) 2005-12-27 2009-12-15 Tessera, Inc. Microelectronic component with photo-imageable substrate
JP2007194436A (ja) * 2006-01-19 2007-08-02 Elpida Memory Inc 半導体パッケージ、導電性ポスト付き基板、積層型半導体装置、半導体パッケージの製造方法及び積層型半導体装置の製造方法
JP2009099750A (ja) * 2007-10-17 2009-05-07 Powertech Technology Inc 半導体パッケージ
JP5185062B2 (ja) * 2008-10-21 2013-04-17 パナソニック株式会社 積層型半導体装置及び電子機器
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US20010012643A1 (en) 1998-01-18 2001-08-09 Kabushiki Kaisha Toshiba Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same
US20110147911A1 (en) 2009-12-22 2011-06-23 Epic Technologies, Inc. Stackable circuit structures and methods of fabrication thereof
US20130009319A1 (en) * 2011-07-07 2013-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and Methods for Forming Through Vias

Also Published As

Publication number Publication date
US9768108B2 (en) 2017-09-19
SG11201705672XA (en) 2017-09-28
JP6789228B2 (ja) 2020-11-25
BR112017017746A2 (en) 2018-04-03
JP2018507556A (ja) 2018-03-15
CN107251217A (zh) 2017-10-13
CN107251217B (zh) 2021-03-12
US20160247754A1 (en) 2016-08-25
KR20170113581A (ko) 2017-10-12
EP3259776A1 (en) 2017-12-27
WO2016134165A1 (en) 2016-08-25

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