KR102455429B1 - 플립칩 실장체의 제조 방법, 플립칩 실장체, 및 선공급형 언더필용 수지 조성물 - Google Patents

플립칩 실장체의 제조 방법, 플립칩 실장체, 및 선공급형 언더필용 수지 조성물 Download PDF

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KR102455429B1
KR102455429B1 KR1020177021758A KR20177021758A KR102455429B1 KR 102455429 B1 KR102455429 B1 KR 102455429B1 KR 1020177021758 A KR1020177021758 A KR 1020177021758A KR 20177021758 A KR20177021758 A KR 20177021758A KR 102455429 B1 KR102455429 B1 KR 102455429B1
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South Korea
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component
resin composition
mass
underfill
parts
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KR1020177021758A
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Korean (ko)
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KR20170128224A (ko
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신이치 무네무라
유키히로 이케다
히로키 묘도
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나믹스 가부시끼가이샤
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Publication of KR20170128224A publication Critical patent/KR20170128224A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020177021758A 2015-03-19 2016-03-15 플립칩 실장체의 제조 방법, 플립칩 실장체, 및 선공급형 언더필용 수지 조성물 KR102455429B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015056935 2015-03-19
JPJP-P-2015-056935 2015-03-19
PCT/JP2016/058064 WO2016148121A1 (ja) 2015-03-19 2016-03-15 フリップチップ実装体の製造方法、フリップチップ実装体、および先供給型アンダーフィル用樹脂組成物

Publications (2)

Publication Number Publication Date
KR20170128224A KR20170128224A (ko) 2017-11-22
KR102455429B1 true KR102455429B1 (ko) 2022-10-14

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KR1020177021758A KR102455429B1 (ko) 2015-03-19 2016-03-15 플립칩 실장체의 제조 방법, 플립칩 실장체, 및 선공급형 언더필용 수지 조성물

Country Status (5)

Country Link
JP (1) JP6800140B2 (ja)
KR (1) KR102455429B1 (ja)
CN (1) CN107251209B (ja)
TW (1) TWI674633B (ja)
WO (1) WO2016148121A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11186742B2 (en) 2016-10-14 2021-11-30 Showa Denko Materials Co., Ltd. Sealing resin composition, electronic component device, and method of manufacturing electronic component device
WO2018181603A1 (ja) * 2017-03-31 2018-10-04 日立化成株式会社 液状エポキシ樹脂組成物、半導体装置及び半導体装置の製造方法
CN107293498B (zh) * 2017-07-03 2019-06-11 华进半导体封装先导技术研发中心有限公司 一种倒装芯片制备方法
JP6920723B2 (ja) * 2017-07-14 2021-08-18 ナミックス株式会社 加圧実装用ｎｃｆ
CN111480218B (zh) * 2017-12-18 2023-07-21 株式会社力森诺科 半导体装置、半导体装置的制造方法和粘接剂
TWI811215B (zh) * 2018-04-13 2023-08-11 日商力森諾科股份有限公司 密封用樹脂組成物、電子零件裝置及電子零件裝置的製造方法
JP7406336B2 (ja) 2019-10-11 2023-12-27 三星電子株式会社 半導体装置の製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007056266A (ja) * 2005-08-25 2007-03-08 Natl Starch & Chem Investment Holding Corp アンダーフィル組成物用のフラクシング及び促進剤としてのキノリノール類
JP2008274083A (ja) 2007-04-27 2008-11-13 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP2012057052A (ja) * 2010-09-09 2012-03-22 Namics Corp エポキシ樹脂組成物
JP2012079872A (ja) 2010-09-30 2012-04-19 Shin Etsu Chem Co Ltd フリップチップ接続用アンダーフィル剤、及びそれを用いる半導体装置の製造方法
JP2012089750A (ja) * 2010-10-21 2012-05-10 Hitachi Chem Co Ltd 半導体封止充てん用熱硬化性樹脂組成物及び半導体装置
JP2013073955A (ja) 2011-09-26 2013-04-22 Hitachi Chemical Co Ltd 回路接続構造体の製造方法
JP5564151B1 (ja) * 2012-08-06 2014-07-30 積水化学工業株式会社 半導体装置の製造方法及びフリップチップ実装用接着剤
WO2015025867A1 (ja) * 2013-08-22 2015-02-26 積水化学工業株式会社 半導体用接着剤

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6009860B2 (ja) 2011-11-09 2016-10-19 積水化学工業株式会社 半導体装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007056266A (ja) * 2005-08-25 2007-03-08 Natl Starch & Chem Investment Holding Corp アンダーフィル組成物用のフラクシング及び促進剤としてのキノリノール類
JP2008274083A (ja) 2007-04-27 2008-11-13 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP2012057052A (ja) * 2010-09-09 2012-03-22 Namics Corp エポキシ樹脂組成物
JP2012079872A (ja) 2010-09-30 2012-04-19 Shin Etsu Chem Co Ltd フリップチップ接続用アンダーフィル剤、及びそれを用いる半導体装置の製造方法
JP2012089750A (ja) * 2010-10-21 2012-05-10 Hitachi Chem Co Ltd 半導体封止充てん用熱硬化性樹脂組成物及び半導体装置
JP2013073955A (ja) 2011-09-26 2013-04-22 Hitachi Chemical Co Ltd 回路接続構造体の製造方法
JP5564151B1 (ja) * 2012-08-06 2014-07-30 積水化学工業株式会社 半導体装置の製造方法及びフリップチップ実装用接着剤
WO2015025867A1 (ja) * 2013-08-22 2015-02-26 積水化学工業株式会社 半導体用接着剤

Also Published As

Publication number Publication date
CN107251209A (zh) 2017-10-13
JP6800140B2 (ja) 2020-12-16
JPWO2016148121A1 (ja) 2017-12-28
KR20170128224A (ko) 2017-11-22
WO2016148121A1 (ja) 2016-09-22
CN107251209B (zh) 2019-12-27
TW201707096A (zh) 2017-02-16
TWI674633B (zh) 2019-10-11

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