KR102454031B1 - 이송 장치 및 실장 장치 - Google Patents

이송 장치 및 실장 장치 Download PDF

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Publication number
KR102454031B1
KR102454031B1 KR1020200108641A KR20200108641A KR102454031B1 KR 102454031 B1 KR102454031 B1 KR 102454031B1 KR 1020200108641 A KR1020200108641 A KR 1020200108641A KR 20200108641 A KR20200108641 A KR 20200108641A KR 102454031 B1 KR102454031 B1 KR 102454031B1
Authority
KR
South Korea
Prior art keywords
nozzle
electronic component
imaging
bonding head
pickup
Prior art date
Application number
KR1020200108641A
Other languages
English (en)
Korean (ko)
Other versions
KR20210027162A (ko
Inventor
노리카즈 도가시
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20210027162A publication Critical patent/KR20210027162A/ko
Priority to KR1020220128014A priority Critical patent/KR102547564B1/ko
Application granted granted Critical
Publication of KR102454031B1 publication Critical patent/KR102454031B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Operations Research (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
  • Forklifts And Lifting Vehicles (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
KR1020200108641A 2019-08-28 2020-08-27 이송 장치 및 실장 장치 KR102454031B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020220128014A KR102547564B1 (ko) 2019-08-28 2022-10-06 이송 장치 및 실장 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019155618A JP7291577B2 (ja) 2019-08-28 2019-08-28 移送装置および実装装置
JPJP-P-2019-155618 2019-08-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020220128014A Division KR102547564B1 (ko) 2019-08-28 2022-10-06 이송 장치 및 실장 장치

Publications (2)

Publication Number Publication Date
KR20210027162A KR20210027162A (ko) 2021-03-10
KR102454031B1 true KR102454031B1 (ko) 2022-10-12

Family

ID=74677749

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020200108641A KR102454031B1 (ko) 2019-08-28 2020-08-27 이송 장치 및 실장 장치
KR1020220128014A KR102547564B1 (ko) 2019-08-28 2022-10-06 이송 장치 및 실장 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020220128014A KR102547564B1 (ko) 2019-08-28 2022-10-06 이송 장치 및 실장 장치

Country Status (4)

Country Link
JP (1) JP7291577B2 (ja)
KR (2) KR102454031B1 (ja)
CN (1) CN112447569A (ja)
TW (2) TWI785365B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115881600A (zh) * 2021-09-30 2023-03-31 芝浦机械电子装置株式会社 铺贴装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2726927B2 (ja) * 1986-04-18 1998-03-11 東芝メカトロニクス株式会社 半導体ペレツトピツクアツプ方法
JP2005032988A (ja) * 2003-07-14 2005-02-03 Matsushita Electric Ind Co Ltd 電子部品搭載装置および電子部品搭載方法ならびに較正用治具
JP2013055207A (ja) * 2011-09-03 2013-03-21 Tdk Corp ワーク搬送装置、並びにワーク処理装置及びワーク処理方法
JP2013168683A (ja) * 2013-06-03 2013-08-29 Toray Eng Co Ltd チップ搭載方法およびチップ搭載装置
JP2014179561A (ja) * 2013-03-15 2014-09-25 Hitachi High-Tech Instruments Co Ltd ボンディングヘッドとそれを備えたダイボンダ

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252303A (ja) 1999-02-26 2000-09-14 Shibaura Mechatronics Corp ペレットボンディング方法
JP2004179517A (ja) 2002-11-28 2004-06-24 Shinkawa Ltd ボンディング装置、ボンディング方法及びボンディングプログラム
JP2005251978A (ja) * 2004-03-04 2005-09-15 Matsushita Electric Ind Co Ltd 電子部品装着装置および電子部品の装着方法
JP4571460B2 (ja) 2004-08-31 2010-10-27 芝浦メカトロニクス株式会社 電子部品の実装方法及び実装装置
JP4016982B2 (ja) * 2004-11-18 2007-12-05 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
JP4840862B2 (ja) 2006-08-29 2011-12-21 東レエンジニアリング株式会社 実装装置のチップ供給方法、及びその実装装置
JP4361572B2 (ja) * 2007-02-28 2009-11-11 株式会社新川 ボンディング装置及び方法
EP2075829B1 (en) * 2007-12-24 2011-10-12 ISMECA Semiconductor Holding SA A method and device for aligning components
JP2012094634A (ja) 2010-10-26 2012-05-17 Panasonic Corp 部品実装装置および部品実装方法
JP6001934B2 (ja) * 2012-06-25 2016-10-05 東京応化工業株式会社 重ね合わせ装置および重ね合わせ方法
JP2015111613A (ja) 2013-12-06 2015-06-18 株式会社リコー 物品移送装置、電子部品実装装置、物品移送方法、電子部品実装方法及び電子部品実装体
US10468279B2 (en) * 2013-12-26 2019-11-05 Kateeva, Inc. Apparatus and techniques for thermal treatment of electronic devices
JP6390978B2 (ja) * 2016-02-05 2018-09-19 パナソニックＩｐマネジメント株式会社 半導体装置の製造装置
CN109564172B (zh) * 2016-07-05 2021-08-31 佳能机械株式会社 缺陷检测装置、缺陷检测方法、裸片接合机、半导体制造方法、以及半导体装置制造方法
CN114229474B (zh) * 2016-08-08 2023-05-05 株式会社尼康 基板处理装置
US10882298B2 (en) * 2016-11-07 2021-01-05 Asm Technology Singapore Pte Ltd System for adjusting relative positions between components of a bonding apparatus
JP2019046836A (ja) 2017-08-30 2019-03-22 パナソニックＩｐマネジメント株式会社 生産システムおよび生産方法ならびに生産ライン管理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2726927B2 (ja) * 1986-04-18 1998-03-11 東芝メカトロニクス株式会社 半導体ペレツトピツクアツプ方法
JP2005032988A (ja) * 2003-07-14 2005-02-03 Matsushita Electric Ind Co Ltd 電子部品搭載装置および電子部品搭載方法ならびに較正用治具
JP2013055207A (ja) * 2011-09-03 2013-03-21 Tdk Corp ワーク搬送装置、並びにワーク処理装置及びワーク処理方法
JP2014179561A (ja) * 2013-03-15 2014-09-25 Hitachi High-Tech Instruments Co Ltd ボンディングヘッドとそれを備えたダイボンダ
JP2013168683A (ja) * 2013-06-03 2013-08-29 Toray Eng Co Ltd チップ搭載方法およびチップ搭載装置

Also Published As

Publication number Publication date
TWI785365B (zh) 2022-12-01
JP2021034645A (ja) 2021-03-01
JP7291577B2 (ja) 2023-06-15
KR102547564B1 (ko) 2023-06-23
TW202109722A (zh) 2021-03-01
KR20210027162A (ko) 2021-03-10
CN112447569A (zh) 2021-03-05
KR20220139286A (ko) 2022-10-14
TW202324581A (zh) 2023-06-16
TWI823650B (zh) 2023-11-21

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