CN112447569A - 移送装置及安装装置 - Google Patents
移送装置及安装装置 Download PDFInfo
- Publication number
- CN112447569A CN112447569A CN202010816569.0A CN202010816569A CN112447569A CN 112447569 A CN112447569 A CN 112447569A CN 202010816569 A CN202010816569 A CN 202010816569A CN 112447569 A CN112447569 A CN 112447569A
- Authority
- CN
- China
- Prior art keywords
- nozzle
- electronic component
- aligner
- pickup
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019155618A JP7291577B2 (ja) | 2019-08-28 | 2019-08-28 | 移送装置および実装装置 |
JP2019-155618 | 2019-08-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112447569A true CN112447569A (zh) | 2021-03-05 |
Family
ID=74677749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010816569.0A Pending CN112447569A (zh) | 2019-08-28 | 2020-08-14 | 移送装置及安装装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7291577B2 (ja) |
KR (2) | KR102454031B1 (ja) |
CN (1) | CN112447569A (ja) |
TW (2) | TWI785365B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115881600A (zh) * | 2021-09-30 | 2023-03-31 | 芝浦机械电子装置株式会社 | 铺贴装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62245644A (ja) * | 1986-04-18 | 1987-10-26 | Toshiba Seiki Kk | 半導体ペレツトピツクアツプ方法 |
JP2005123638A (ja) * | 2004-11-18 | 2005-05-12 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
JP2005251978A (ja) * | 2004-03-04 | 2005-09-15 | Matsushita Electric Ind Co Ltd | 電子部品装着装置および電子部品の装着方法 |
US20100254788A1 (en) * | 2007-12-24 | 2010-10-07 | Ismeca Semiconductor Holdings Sa | Method and device for aligning components |
JP2014179561A (ja) * | 2013-03-15 | 2014-09-25 | Hitachi High-Tech Instruments Co Ltd | ボンディングヘッドとそれを備えたダイボンダ |
CN108063104A (zh) * | 2016-11-07 | 2018-05-22 | 先进科技新加坡有限公司 | 用于调整接合装置的部件之间的相对位置的系统 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000252303A (ja) | 1999-02-26 | 2000-09-14 | Shibaura Mechatronics Corp | ペレットボンディング方法 |
JP2004179517A (ja) | 2002-11-28 | 2004-06-24 | Shinkawa Ltd | ボンディング装置、ボンディング方法及びボンディングプログラム |
JP4175203B2 (ja) * | 2003-07-14 | 2008-11-05 | 松下電器産業株式会社 | 電子部品搭載装置および電子部品搭載方法ならびに較正用治具 |
JP4571460B2 (ja) | 2004-08-31 | 2010-10-27 | 芝浦メカトロニクス株式会社 | 電子部品の実装方法及び実装装置 |
JP4840862B2 (ja) | 2006-08-29 | 2011-12-21 | 東レエンジニアリング株式会社 | 実装装置のチップ供給方法、及びその実装装置 |
JP4361572B2 (ja) * | 2007-02-28 | 2009-11-11 | 株式会社新川 | ボンディング装置及び方法 |
JP2012094634A (ja) | 2010-10-26 | 2012-05-17 | Panasonic Corp | 部品実装装置および部品実装方法 |
JP5839170B2 (ja) | 2011-09-03 | 2016-01-06 | Tdk株式会社 | ワーク搬送装置、並びにワーク処理装置及びワーク処理方法 |
JP6001934B2 (ja) * | 2012-06-25 | 2016-10-05 | 東京応化工業株式会社 | 重ね合わせ装置および重ね合わせ方法 |
JP5508575B2 (ja) * | 2013-06-03 | 2014-06-04 | 東レエンジニアリング株式会社 | チップ搭載方法およびチップ搭載装置 |
JP2015111613A (ja) | 2013-12-06 | 2015-06-18 | 株式会社リコー | 物品移送装置、電子部品実装装置、物品移送方法、電子部品実装方法及び電子部品実装体 |
KR101970449B1 (ko) * | 2013-12-26 | 2019-04-18 | 카티바, 인크. | 전자 장치의 열 처리를 위한 장치 및 기술 |
JP6390978B2 (ja) * | 2016-02-05 | 2018-09-19 | パナソニックIpマネジメント株式会社 | 半導体装置の製造装置 |
SG11201900112TA (en) * | 2016-07-05 | 2019-02-27 | Canon Machinery Inc | Defect detection device, defect detection method, wafer, semiconductor chip, semiconductor device, die bonder, bonding method, semiconductor manufacturing method, and semiconductor device manufacturing method |
JP6965884B2 (ja) * | 2016-08-08 | 2021-11-10 | 株式会社ニコン | 基板処理装置および基板処理方法 |
JP2019046836A (ja) | 2017-08-30 | 2019-03-22 | パナソニックIpマネジメント株式会社 | 生産システムおよび生産方法ならびに生産ライン管理装置 |
-
2019
- 2019-08-28 JP JP2019155618A patent/JP7291577B2/ja active Active
-
2020
- 2020-08-14 CN CN202010816569.0A patent/CN112447569A/zh active Pending
- 2020-08-17 TW TW109127885A patent/TWI785365B/zh active
- 2020-08-17 TW TW111140729A patent/TWI823650B/zh active
- 2020-08-27 KR KR1020200108641A patent/KR102454031B1/ko active IP Right Grant
-
2022
- 2022-10-06 KR KR1020220128014A patent/KR102547564B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62245644A (ja) * | 1986-04-18 | 1987-10-26 | Toshiba Seiki Kk | 半導体ペレツトピツクアツプ方法 |
JP2005251978A (ja) * | 2004-03-04 | 2005-09-15 | Matsushita Electric Ind Co Ltd | 電子部品装着装置および電子部品の装着方法 |
JP2005123638A (ja) * | 2004-11-18 | 2005-05-12 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
US20100254788A1 (en) * | 2007-12-24 | 2010-10-07 | Ismeca Semiconductor Holdings Sa | Method and device for aligning components |
JP2014179561A (ja) * | 2013-03-15 | 2014-09-25 | Hitachi High-Tech Instruments Co Ltd | ボンディングヘッドとそれを備えたダイボンダ |
CN108063104A (zh) * | 2016-11-07 | 2018-05-22 | 先进科技新加坡有限公司 | 用于调整接合装置的部件之间的相对位置的系统 |
Also Published As
Publication number | Publication date |
---|---|
TWI785365B (zh) | 2022-12-01 |
TW202324581A (zh) | 2023-06-16 |
TW202109722A (zh) | 2021-03-01 |
KR20210027162A (ko) | 2021-03-10 |
KR102547564B1 (ko) | 2023-06-23 |
JP7291577B2 (ja) | 2023-06-15 |
TWI823650B (zh) | 2023-11-21 |
KR20220139286A (ko) | 2022-10-14 |
KR102454031B1 (ko) | 2022-10-12 |
JP2021034645A (ja) | 2021-03-01 |
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