KR102454031B1 - 이송 장치 및 실장 장치 - Google Patents

이송 장치 및 실장 장치 Download PDF

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Publication number
KR102454031B1
KR102454031B1 KR1020200108641A KR20200108641A KR102454031B1 KR 102454031 B1 KR102454031 B1 KR 102454031B1 KR 1020200108641 A KR1020200108641 A KR 1020200108641A KR 20200108641 A KR20200108641 A KR 20200108641A KR 102454031 B1 KR102454031 B1 KR 102454031B1
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KR
South Korea
Prior art keywords
nozzle
electronic component
imaging
bonding head
pickup
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KR1020200108641A
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English (en)
Korean (ko)
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KR20210027162A (ko
Inventor
노리카즈 도가시
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
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Publication of KR20210027162A publication Critical patent/KR20210027162A/ko
Priority to KR1020220128014A priority Critical patent/KR102547564B1/ko
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Publication of KR102454031B1 publication Critical patent/KR102454031B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Operations Research (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Forklifts And Lifting Vehicles (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Manipulator (AREA)
KR1020200108641A 2019-08-28 2020-08-27 이송 장치 및 실장 장치 Active KR102454031B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020220128014A KR102547564B1 (ko) 2019-08-28 2022-10-06 이송 장치 및 실장 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-155618 2019-08-28
JP2019155618A JP7291577B2 (ja) 2019-08-28 2019-08-28 移送装置および実装装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020220128014A Division KR102547564B1 (ko) 2019-08-28 2022-10-06 이송 장치 및 실장 장치

Publications (2)

Publication Number Publication Date
KR20210027162A KR20210027162A (ko) 2021-03-10
KR102454031B1 true KR102454031B1 (ko) 2022-10-12

Family

ID=74677749

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020200108641A Active KR102454031B1 (ko) 2019-08-28 2020-08-27 이송 장치 및 실장 장치
KR1020220128014A Active KR102547564B1 (ko) 2019-08-28 2022-10-06 이송 장치 및 실장 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020220128014A Active KR102547564B1 (ko) 2019-08-28 2022-10-06 이송 장치 및 실장 장치

Country Status (4)

Country Link
JP (1) JP7291577B2 (enExample)
KR (2) KR102454031B1 (enExample)
CN (1) CN112447569B (enExample)
TW (2) TWI785365B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7689472B2 (ja) * 2021-09-29 2025-06-06 芝浦メカトロニクス株式会社 ピックアップ装置及び実装装置
TWI824750B (zh) * 2021-09-30 2023-12-01 日商芝浦機械電子裝置股份有限公司 鋪貼裝置
CN116782628A (zh) * 2022-03-18 2023-09-19 芝浦机械电子装置株式会社 安装装置以及安装方法
KR102874275B1 (ko) * 2022-03-30 2025-10-22 시바우라 메카트로닉스 가부시끼가이샤 접촉 위치 설정 장치, 실장 장치 및 접촉 위치 설정 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2726927B2 (ja) * 1986-04-18 1998-03-11 東芝メカトロニクス株式会社 半導体ペレツトピツクアツプ方法
JP2005032988A (ja) * 2003-07-14 2005-02-03 Matsushita Electric Ind Co Ltd 電子部品搭載装置および電子部品搭載方法ならびに較正用治具
JP2013055207A (ja) * 2011-09-03 2013-03-21 Tdk Corp ワーク搬送装置、並びにワーク処理装置及びワーク処理方法
JP2013168683A (ja) * 2013-06-03 2013-08-29 Toray Eng Co Ltd チップ搭載方法およびチップ搭載装置
JP2014179561A (ja) * 2013-03-15 2014-09-25 Hitachi High-Tech Instruments Co Ltd ボンディングヘッドとそれを備えたダイボンダ

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252303A (ja) * 1999-02-26 2000-09-14 Shibaura Mechatronics Corp ペレットボンディング方法
JP2004179517A (ja) * 2002-11-28 2004-06-24 Shinkawa Ltd ボンディング装置、ボンディング方法及びボンディングプログラム
JP2005251978A (ja) * 2004-03-04 2005-09-15 Matsushita Electric Ind Co Ltd 電子部品装着装置および電子部品の装着方法
JP4571460B2 (ja) * 2004-08-31 2010-10-27 芝浦メカトロニクス株式会社 電子部品の実装方法及び実装装置
JP4016982B2 (ja) * 2004-11-18 2007-12-05 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
JP4840862B2 (ja) * 2006-08-29 2011-12-21 東レエンジニアリング株式会社 実装装置のチップ供給方法、及びその実装装置
JP4361572B2 (ja) * 2007-02-28 2009-11-11 株式会社新川 ボンディング装置及び方法
ATE528792T1 (de) * 2007-12-24 2011-10-15 Ismeca Semiconductor Holding Verfahren und vorrichtung zur ausrichtung von komponenten
JP2012094634A (ja) * 2010-10-26 2012-05-17 Panasonic Corp 部品実装装置および部品実装方法
JP6001934B2 (ja) * 2012-06-25 2016-10-05 東京応化工業株式会社 重ね合わせ装置および重ね合わせ方法
JP2015111613A (ja) * 2013-12-06 2015-06-18 株式会社リコー 物品移送装置、電子部品実装装置、物品移送方法、電子部品実装方法及び電子部品実装体
US10468279B2 (en) * 2013-12-26 2019-11-05 Kateeva, Inc. Apparatus and techniques for thermal treatment of electronic devices
JP6390978B2 (ja) * 2016-02-05 2018-09-19 パナソニックＩｐマネジメント株式会社 半導体装置の製造装置
SG11201900112TA (en) * 2016-07-05 2019-02-27 Canon Machinery Inc Defect detection device, defect detection method, wafer, semiconductor chip, semiconductor device, die bonder, bonding method, semiconductor manufacturing method, and semiconductor device manufacturing method
KR102472595B1 (ko) * 2016-08-08 2022-12-01 가부시키가이샤 니콘 기판 처리 장치 및 기판 처리 방법
US10882298B2 (en) * 2016-11-07 2021-01-05 Asm Technology Singapore Pte Ltd System for adjusting relative positions between components of a bonding apparatus
JP2019046836A (ja) * 2017-08-30 2019-03-22 パナソニックＩｐマネジメント株式会社 生産システムおよび生産方法ならびに生産ライン管理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2726927B2 (ja) * 1986-04-18 1998-03-11 東芝メカトロニクス株式会社 半導体ペレツトピツクアツプ方法
JP2005032988A (ja) * 2003-07-14 2005-02-03 Matsushita Electric Ind Co Ltd 電子部品搭載装置および電子部品搭載方法ならびに較正用治具
JP2013055207A (ja) * 2011-09-03 2013-03-21 Tdk Corp ワーク搬送装置、並びにワーク処理装置及びワーク処理方法
JP2014179561A (ja) * 2013-03-15 2014-09-25 Hitachi High-Tech Instruments Co Ltd ボンディングヘッドとそれを備えたダイボンダ
JP2013168683A (ja) * 2013-06-03 2013-08-29 Toray Eng Co Ltd チップ搭載方法およびチップ搭載装置

Also Published As

Publication number Publication date
TW202324581A (zh) 2023-06-16
KR20220139286A (ko) 2022-10-14
TWI823650B (zh) 2023-11-21
TW202109722A (zh) 2021-03-01
CN112447569B (zh) 2024-08-06
JP7291577B2 (ja) 2023-06-15
TWI785365B (zh) 2022-12-01
CN112447569A (zh) 2021-03-05
KR20210027162A (ko) 2021-03-10
KR102547564B1 (ko) 2023-06-23
JP2021034645A (ja) 2021-03-01

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