CN112447569B - 移送装置及安装装置 - Google Patents

移送装置及安装装置 Download PDF

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Publication number
CN112447569B
CN112447569B CN202010816569.0A CN202010816569A CN112447569B CN 112447569 B CN112447569 B CN 112447569B CN 202010816569 A CN202010816569 A CN 202010816569A CN 112447569 B CN112447569 B CN 112447569B
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CN
China
Prior art keywords
nozzle
electronic component
calibrator
center
bonding head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010816569.0A
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English (en)
Chinese (zh)
Other versions
CN112447569A (zh
Inventor
冨樫徳和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN112447569A publication Critical patent/CN112447569A/zh
Application granted granted Critical
Publication of CN112447569B publication Critical patent/CN112447569B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Operations Research (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Forklifts And Lifting Vehicles (AREA)
  • Manipulator (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
CN202010816569.0A 2019-08-28 2020-08-14 移送装置及安装装置 Active CN112447569B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-155618 2019-08-28
JP2019155618A JP7291577B2 (ja) 2019-08-28 2019-08-28 移送装置および実装装置

Publications (2)

Publication Number Publication Date
CN112447569A CN112447569A (zh) 2021-03-05
CN112447569B true CN112447569B (zh) 2024-08-06

Family

ID=74677749

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010816569.0A Active CN112447569B (zh) 2019-08-28 2020-08-14 移送装置及安装装置

Country Status (4)

Country Link
JP (1) JP7291577B2 (enExample)
KR (2) KR102454031B1 (enExample)
CN (1) CN112447569B (enExample)
TW (2) TWI785365B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7689472B2 (ja) * 2021-09-29 2025-06-06 芝浦メカトロニクス株式会社 ピックアップ装置及び実装装置
TWI824750B (zh) * 2021-09-30 2023-12-01 日商芝浦機械電子裝置股份有限公司 鋪貼裝置
CN116782628A (zh) * 2022-03-18 2023-09-19 芝浦机械电子装置株式会社 安装装置以及安装方法
KR102874275B1 (ko) * 2022-03-30 2025-10-22 시바우라 메카트로닉스 가부시끼가이샤 접촉 위치 설정 장치, 실장 장치 및 접촉 위치 설정 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62245644A (ja) * 1986-04-18 1987-10-26 Toshiba Seiki Kk 半導体ペレツトピツクアツプ方法
JP2014179561A (ja) * 2013-03-15 2014-09-25 Hitachi High-Tech Instruments Co Ltd ボンディングヘッドとそれを備えたダイボンダ
CN108063104A (zh) * 2016-11-07 2018-05-22 先进科技新加坡有限公司 用于调整接合装置的部件之间的相对位置的系统

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252303A (ja) * 1999-02-26 2000-09-14 Shibaura Mechatronics Corp ペレットボンディング方法
JP2004179517A (ja) * 2002-11-28 2004-06-24 Shinkawa Ltd ボンディング装置、ボンディング方法及びボンディングプログラム
JP4175203B2 (ja) * 2003-07-14 2008-11-05 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法ならびに較正用治具
JP2005251978A (ja) * 2004-03-04 2005-09-15 Matsushita Electric Ind Co Ltd 電子部品装着装置および電子部品の装着方法
JP4571460B2 (ja) * 2004-08-31 2010-10-27 芝浦メカトロニクス株式会社 電子部品の実装方法及び実装装置
JP4016982B2 (ja) * 2004-11-18 2007-12-05 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
JP4840862B2 (ja) * 2006-08-29 2011-12-21 東レエンジニアリング株式会社 実装装置のチップ供給方法、及びその実装装置
JP4361572B2 (ja) * 2007-02-28 2009-11-11 株式会社新川 ボンディング装置及び方法
ATE528792T1 (de) * 2007-12-24 2011-10-15 Ismeca Semiconductor Holding Verfahren und vorrichtung zur ausrichtung von komponenten
JP2012094634A (ja) * 2010-10-26 2012-05-17 Panasonic Corp 部品実装装置および部品実装方法
JP5839170B2 (ja) * 2011-09-03 2016-01-06 Tdk株式会社 ワーク搬送装置、並びにワーク処理装置及びワーク処理方法
JP6001934B2 (ja) * 2012-06-25 2016-10-05 東京応化工業株式会社 重ね合わせ装置および重ね合わせ方法
JP5508575B2 (ja) * 2013-06-03 2014-06-04 東レエンジニアリング株式会社 チップ搭載方法およびチップ搭載装置
JP2015111613A (ja) * 2013-12-06 2015-06-18 株式会社リコー 物品移送装置、電子部品実装装置、物品移送方法、電子部品実装方法及び電子部品実装体
US10468279B2 (en) * 2013-12-26 2019-11-05 Kateeva, Inc. Apparatus and techniques for thermal treatment of electronic devices
JP6390978B2 (ja) * 2016-02-05 2018-09-19 パナソニックＩｐマネジメント株式会社 半導体装置の製造装置
SG11201900112TA (en) * 2016-07-05 2019-02-27 Canon Machinery Inc Defect detection device, defect detection method, wafer, semiconductor chip, semiconductor device, die bonder, bonding method, semiconductor manufacturing method, and semiconductor device manufacturing method
KR102472595B1 (ko) * 2016-08-08 2022-12-01 가부시키가이샤 니콘 기판 처리 장치 및 기판 처리 방법
JP2019046836A (ja) * 2017-08-30 2019-03-22 パナソニックＩｐマネジメント株式会社 生産システムおよび生産方法ならびに生産ライン管理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62245644A (ja) * 1986-04-18 1987-10-26 Toshiba Seiki Kk 半導体ペレツトピツクアツプ方法
JP2014179561A (ja) * 2013-03-15 2014-09-25 Hitachi High-Tech Instruments Co Ltd ボンディングヘッドとそれを備えたダイボンダ
CN108063104A (zh) * 2016-11-07 2018-05-22 先进科技新加坡有限公司 用于调整接合装置的部件之间的相对位置的系统

Also Published As

Publication number Publication date
TW202324581A (zh) 2023-06-16
KR20220139286A (ko) 2022-10-14
TWI823650B (zh) 2023-11-21
TW202109722A (zh) 2021-03-01
JP7291577B2 (ja) 2023-06-15
TWI785365B (zh) 2022-12-01
CN112447569A (zh) 2021-03-05
KR102454031B1 (ko) 2022-10-12
KR20210027162A (ko) 2021-03-10
KR102547564B1 (ko) 2023-06-23
JP2021034645A (ja) 2021-03-01

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