KR102452787B1 - 필름, 금속박 적층판, 플렉시블 기판, 필름의 제조 방법, 금속박 적층판의 제조 방법, 및 플렉시블 기판의 제조 방법 - Google Patents

필름, 금속박 적층판, 플렉시블 기판, 필름의 제조 방법, 금속박 적층판의 제조 방법, 및 플렉시블 기판의 제조 방법 Download PDF

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KR102452787B1
KR102452787B1 KR1020207028772A KR20207028772A KR102452787B1 KR 102452787 B1 KR102452787 B1 KR 102452787B1 KR 1020207028772 A KR1020207028772 A KR 1020207028772A KR 20207028772 A KR20207028772 A KR 20207028772A KR 102452787 B1 KR102452787 B1 KR 102452787B1
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precursor
polyamic acid
layer
film
metal foil
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KR20200125720A (ko
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타카시 키노
박순용
박영석
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주식회사 엘지화학
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001—Combinations of extrusion moulding with other shaping operations
    • B29C48/0021—Combinations of extrusion moulding with other shaping operations combined with joining, lining or laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B29C48/08—Flat, e.g. panels flexible, e.g. films
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
    • B29C48/18—Articles comprising two or more components, e.g. co-extruded layers the components being layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
    • B29C48/18—Articles comprising two or more components, e.g. co-extruded layers the components being layers
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
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    • B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
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    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
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    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
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  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
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  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Laminated Bodies (AREA)
KR1020207028772A 2019-01-11 2020-01-09 필름, 금속박 적층판, 플렉시블 기판, 필름의 제조 방법, 금속박 적층판의 제조 방법, 및 플렉시블 기판의 제조 방법 Active KR102452787B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-003369 2019-01-11
JP2019003369A JP7195530B2 (ja) 2019-01-11 2019-01-11 フィルム、金属張積層板、フレキシブル基板、フィルムの製造方法、金属張積層板の製造方法、及びフレキシブル基板の製造方法
PCT/KR2020/000409 WO2020145695A1 (ko) 2019-01-11 2020-01-09 필름, 금속박 적층판, 플렉시블 기판, 필름의 제조 방법, 금속박 적층판의 제조 방법, 및 플렉시블 기판의 제조 방법

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KR20200125720A KR20200125720A (ko) 2020-11-04
KR102452787B1 true KR102452787B1 (ko) 2022-10-07

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US (1) US11845246B2 (enExample)
EP (1) EP3769959B1 (enExample)
JP (1) JP7195530B2 (enExample)
KR (1) KR102452787B1 (enExample)
CN (1) CN112020427A (enExample)
WO (1) WO2020145695A1 (enExample)

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WO2023053948A1 (ja) * 2021-09-29 2023-04-06 信越ポリマー株式会社 金属張積層板
US20250346718A1 (en) * 2021-11-22 2025-11-13 Pi Advanced Materials Co., Ltd. Polyimide precursor composition and polyimide film comprising same

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EP0474054B1 (en) * 1990-08-27 1995-12-06 E.I. Du Pont De Nemours And Company Flexible multi-layer polyimide film laminates and preparation thereof
JP3265027B2 (ja) * 1993-01-20 2002-03-11 三菱伸銅株式会社 金属膜付きポリイミドフィルム
TWI300744B (enExample) 2001-04-19 2008-09-11 Nippon Steel Chemical Co
JP4128031B2 (ja) 2002-06-14 2008-07-30 三井化学株式会社 ポリイミド金属積層板
WO2004085146A1 (en) * 2003-03-26 2004-10-07 Lg Chem Ltd Double-sided metallic laminate and method for manufacturing the same
JP2005186274A (ja) 2003-12-24 2005-07-14 Kaneka Corp フレキシブル積層板およびその製造方法
JP2005219463A (ja) * 2004-02-09 2005-08-18 Kaneka Corp ポリイミド／金属積層体およびその製造方法、並びにその利用
JP4619860B2 (ja) 2004-07-13 2011-01-26 新日鐵化学株式会社 フレキシブル積層板及びその製造方法
JP4773726B2 (ja) 2005-01-14 2011-09-14 株式会社カネカ 多層押出ポリイミドフィルムおよびその利用
TWI406757B (zh) 2005-04-04 2013-09-01 Ube Industries 包銅之疊層基板
KR101299310B1 (ko) * 2006-03-17 2013-08-26 가부시키가이샤 가네카 접착 필름
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