KR102433759B1 - 웨이퍼 식각장치 - Google Patents

웨이퍼 식각장치 Download PDF

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Publication number
KR102433759B1
KR102433759B1 KR1020200159800A KR20200159800A KR102433759B1 KR 102433759 B1 KR102433759 B1 KR 102433759B1 KR 1020200159800 A KR1020200159800 A KR 1020200159800A KR 20200159800 A KR20200159800 A KR 20200159800A KR 102433759 B1 KR102433759 B1 KR 102433759B1
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KR
South Korea
Prior art keywords
ring
wafer
shaped wall
carrier
working fluid
Prior art date
Application number
KR1020200159800A
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English (en)
Korean (ko)
Other versions
KR20220056763A (ko
Inventor
추안-창 펭
마오-린 리우
팅-위 우
Original Assignee
사이언테크 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 사이언테크 코포레이션 filed Critical 사이언테크 코포레이션
Publication of KR20220056763A publication Critical patent/KR20220056763A/ko
Application granted granted Critical
Publication of KR102433759B1 publication Critical patent/KR102433759B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
KR1020200159800A 2020-10-28 2020-11-25 웨이퍼 식각장치 KR102433759B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW109137455 2020-10-28
TW109137455A TWI747580B (zh) 2020-10-28 2020-10-28 晶圓蝕刻裝置

Publications (2)

Publication Number Publication Date
KR20220056763A KR20220056763A (ko) 2022-05-06
KR102433759B1 true KR102433759B1 (ko) 2022-08-18

Family

ID=79907526

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200159800A KR102433759B1 (ko) 2020-10-28 2020-11-25 웨이퍼 식각장치

Country Status (2)

Country Link
KR (1) KR102433759B1 (zh)
TW (1) TWI747580B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118231300B (zh) * 2024-05-24 2024-08-23 北京翼华云网科技有限公司 一种半导体器件及应用

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001192845A (ja) * 2000-01-13 2001-07-17 Tokyo Electron Ltd 無電解メッキ装置及び無電解メッキ方法
KR100618868B1 (ko) * 2004-10-19 2006-08-31 삼성전자주식회사 스핀 장치
JP2008251806A (ja) * 2007-03-30 2008-10-16 Sumco Corp ウェーハの枚葉式エッチング方法及びそのエッチング装置
JP2011103361A (ja) 2009-11-10 2011-05-26 Sofu Engineering:Kk リフトオフ装置およびリフトオフ処理方法
JP2015220369A (ja) * 2014-05-19 2015-12-07 東京エレクトロン株式会社 基板液処理装置、基板液処理方法及び記憶媒体
KR101678269B1 (ko) 2011-10-24 2016-11-21 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
JP6982432B2 (ja) 2017-08-24 2021-12-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2520833B2 (ja) * 1992-12-21 1996-07-31 東京エレクトロン株式会社 浸漬式の液処理装置
JP5276420B2 (ja) * 2008-01-31 2013-08-28 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5301505B2 (ja) * 2009-08-27 2013-09-25 東京エレクトロン株式会社 液処理装置および液処理方法
JP5844681B2 (ja) * 2011-07-06 2016-01-20 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
CN106711060B (zh) * 2015-11-16 2019-07-26 弘塑科技股份有限公司 旋转蚀刻清洗机台的流体收集装置
JP6770886B2 (ja) * 2016-12-28 2020-10-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法
JP7029251B2 (ja) * 2017-08-28 2022-03-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001192845A (ja) * 2000-01-13 2001-07-17 Tokyo Electron Ltd 無電解メッキ装置及び無電解メッキ方法
KR100618868B1 (ko) * 2004-10-19 2006-08-31 삼성전자주식회사 스핀 장치
JP2008251806A (ja) * 2007-03-30 2008-10-16 Sumco Corp ウェーハの枚葉式エッチング方法及びそのエッチング装置
JP2011103361A (ja) 2009-11-10 2011-05-26 Sofu Engineering:Kk リフトオフ装置およびリフトオフ処理方法
KR101678269B1 (ko) 2011-10-24 2016-11-21 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
JP2015220369A (ja) * 2014-05-19 2015-12-07 東京エレクトロン株式会社 基板液処理装置、基板液処理方法及び記憶媒体
JP6982432B2 (ja) 2017-08-24 2021-12-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Also Published As

Publication number Publication date
TWI747580B (zh) 2021-11-21
KR20220056763A (ko) 2022-05-06
TW202218003A (zh) 2022-05-01

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