KR102430188B1 - 시트, 테이프 및 반도체 장치의 제조 방법 - Google Patents

시트, 테이프 및 반도체 장치의 제조 방법 Download PDF

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Publication number
KR102430188B1
KR102430188B1 KR1020170148641A KR20170148641A KR102430188B1 KR 102430188 B1 KR102430188 B1 KR 102430188B1 KR 1020170148641 A KR1020170148641 A KR 1020170148641A KR 20170148641 A KR20170148641 A KR 20170148641A KR 102430188 B1 KR102430188 B1 KR 102430188B1
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KR
South Korea
Prior art keywords
layer
resin
back surface
protective film
surface protective
Prior art date
Application number
KR1020170148641A
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English (en)
Korean (ko)
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KR20180054462A (ko
Inventor
류이치 기무라
고지 시가
나오히데 다카모토
Original Assignee
닛토덴코 가부시키가이샤
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Publication of KR20180054462A publication Critical patent/KR20180054462A/ko
Application granted granted Critical
Publication of KR102430188B1 publication Critical patent/KR102430188B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020170148641A 2016-11-14 2017-11-09 시트, 테이프 및 반도체 장치의 제조 방법 KR102430188B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016221438A JP6812212B2 (ja) 2016-11-14 2016-11-14 シート、テープおよび半導体装置の製造方法
JPJP-P-2016-221438 2016-11-14

Publications (2)

Publication Number Publication Date
KR20180054462A KR20180054462A (ko) 2018-05-24
KR102430188B1 true KR102430188B1 (ko) 2022-08-08

Family

ID=62172118

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170148641A KR102430188B1 (ko) 2016-11-14 2017-11-09 시트, 테이프 및 반도체 장치의 제조 방법

Country Status (5)

Country Link
JP (1) JP6812212B2 (ja)
KR (1) KR102430188B1 (ja)
CN (1) CN108091604B (ja)
SG (1) SG10201708895QA (ja)
TW (1) TWI750246B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7478524B2 (ja) * 2019-09-05 2024-05-07 リンテック株式会社 保護膜形成用フィルム、保護膜形成用複合シート、及び保護膜付きワーク加工物の製造方法
JP2023147738A (ja) 2022-03-30 2023-10-13 リンテック株式会社 保護膜形成フィルム、保護膜形成用複合シート、半導体装置の製造方法、及び保護膜形成フィルムの使用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012144667A (ja) 2011-01-14 2012-08-02 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
JP2014099439A (ja) * 2012-11-13 2014-05-29 Shin Etsu Chem Co Ltd 半導体ウエハ用保護フィルム及び半導体チップの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5885325B2 (ja) 2009-05-29 2016-03-15 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP5501938B2 (ja) * 2009-12-24 2014-05-28 日東電工株式会社 フリップチップ型半導体裏面用フィルム
JP5456642B2 (ja) 2009-12-24 2014-04-02 日東電工株式会社 フリップチップ型半導体裏面用フィルム
JP5367656B2 (ja) * 2010-07-29 2013-12-11 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
JP5820170B2 (ja) * 2011-07-13 2015-11-24 日東電工株式会社 半導体装置用の接着フィルム、フリップチップ型半導体裏面用フィルム、及び、ダイシングテープ一体型半導体裏面用フィルム
JP5930625B2 (ja) * 2011-08-03 2016-06-08 日東電工株式会社 ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置
CN104508069B (zh) * 2012-08-02 2017-03-29 琳得科株式会社 膜状粘接剂、半导体接合用粘接片、和半导体装置的制造方法
CN104685609B (zh) * 2012-10-05 2018-06-08 琳得科株式会社 带有保护膜形成层的切片及芯片的制造方法
JP6431343B2 (ja) * 2014-11-21 2018-11-28 日東電工株式会社 接着シート、ダイシングシート付き接着シート、積層シート及び半導体装置の製造方法
JP6415383B2 (ja) * 2015-04-30 2018-10-31 日東電工株式会社 半導体素子の裏面を保護するための裏面保護フィルム、一体型フィルム、フィルム、半導体装置の製造方法および保護チップの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012144667A (ja) 2011-01-14 2012-08-02 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
JP2014099439A (ja) * 2012-11-13 2014-05-29 Shin Etsu Chem Co Ltd 半導体ウエハ用保護フィルム及び半導体チップの製造方法

Also Published As

Publication number Publication date
TW201833270A (zh) 2018-09-16
CN108091604B (zh) 2023-05-12
SG10201708895QA (en) 2018-06-28
JP6812212B2 (ja) 2021-01-13
JP2018081953A (ja) 2018-05-24
KR20180054462A (ko) 2018-05-24
TWI750246B (zh) 2021-12-21
CN108091604A (zh) 2018-05-29

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