TWI750246B - 片、膠帶及半導體裝置的製造方法 - Google Patents

片、膠帶及半導體裝置的製造方法 Download PDF

Info

Publication number
TWI750246B
TWI750246B TW106136807A TW106136807A TWI750246B TW I750246 B TWI750246 B TW I750246B TW 106136807 A TW106136807 A TW 106136807A TW 106136807 A TW106136807 A TW 106136807A TW I750246 B TWI750246 B TW I750246B
Authority
TW
Taiwan
Prior art keywords
layer
semiconductor
protective film
resin
weight
Prior art date
Application number
TW106136807A
Other languages
English (en)
Chinese (zh)
Other versions
TW201833270A (zh
Inventor
木村龍一
志賀豪士
高本尚英
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201833270A publication Critical patent/TW201833270A/zh
Application granted granted Critical
Publication of TWI750246B publication Critical patent/TWI750246B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW106136807A 2016-11-14 2017-10-26 片、膠帶及半導體裝置的製造方法 TWI750246B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016221438A JP6812212B2 (ja) 2016-11-14 2016-11-14 シート、テープおよび半導体装置の製造方法
JP2016-221438 2016-11-14

Publications (2)

Publication Number Publication Date
TW201833270A TW201833270A (zh) 2018-09-16
TWI750246B true TWI750246B (zh) 2021-12-21

Family

ID=62172118

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106136807A TWI750246B (zh) 2016-11-14 2017-10-26 片、膠帶及半導體裝置的製造方法

Country Status (5)

Country Link
JP (1) JP6812212B2 (ja)
KR (1) KR102430188B1 (ja)
CN (1) CN108091604B (ja)
SG (1) SG10201708895QA (ja)
TW (1) TWI750246B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7478524B2 (ja) * 2019-09-05 2024-05-07 リンテック株式会社 保護膜形成用フィルム、保護膜形成用複合シート、及び保護膜付きワーク加工物の製造方法
JP2023147738A (ja) 2022-03-30 2023-10-13 リンテック株式会社 保護膜形成フィルム、保護膜形成用複合シート、半導体装置の製造方法、及び保護膜形成フィルムの使用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201306114A (zh) * 2011-07-13 2013-02-01 Nitto Denko Corp 半導體裝置用接著膜、覆晶型半導體背面用膜、及切晶帶一體型半導體背面用膜
JP2014099439A (ja) * 2012-11-13 2014-05-29 Shin Etsu Chem Co Ltd 半導体ウエハ用保護フィルム及び半導体チップの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5885325B2 (ja) 2009-05-29 2016-03-15 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP5501938B2 (ja) * 2009-12-24 2014-05-28 日東電工株式会社 フリップチップ型半導体裏面用フィルム
JP5456642B2 (ja) 2009-12-24 2014-04-02 日東電工株式会社 フリップチップ型半導体裏面用フィルム
JP5367656B2 (ja) * 2010-07-29 2013-12-11 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
JP5662810B2 (ja) 2011-01-14 2015-02-04 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
JP5930625B2 (ja) * 2011-08-03 2016-06-08 日東電工株式会社 ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置
CN104508069B (zh) * 2012-08-02 2017-03-29 琳得科株式会社 膜状粘接剂、半导体接合用粘接片、和半导体装置的制造方法
CN104685609B (zh) * 2012-10-05 2018-06-08 琳得科株式会社 带有保护膜形成层的切片及芯片的制造方法
JP6431343B2 (ja) * 2014-11-21 2018-11-28 日東電工株式会社 接着シート、ダイシングシート付き接着シート、積層シート及び半導体装置の製造方法
JP6415383B2 (ja) * 2015-04-30 2018-10-31 日東電工株式会社 半導体素子の裏面を保護するための裏面保護フィルム、一体型フィルム、フィルム、半導体装置の製造方法および保護チップの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201306114A (zh) * 2011-07-13 2013-02-01 Nitto Denko Corp 半導體裝置用接著膜、覆晶型半導體背面用膜、及切晶帶一體型半導體背面用膜
JP2014099439A (ja) * 2012-11-13 2014-05-29 Shin Etsu Chem Co Ltd 半導体ウエハ用保護フィルム及び半導体チップの製造方法

Also Published As

Publication number Publication date
TW201833270A (zh) 2018-09-16
CN108091604B (zh) 2023-05-12
SG10201708895QA (en) 2018-06-28
JP6812212B2 (ja) 2021-01-13
JP2018081953A (ja) 2018-05-24
KR20180054462A (ko) 2018-05-24
KR102430188B1 (ko) 2022-08-08
CN108091604A (zh) 2018-05-29

Similar Documents

Publication Publication Date Title
TWI521578B (zh) 切晶黏晶膜
TWI733931B (zh) 片、膠帶及半導體裝置的製造方法
TWI401326B (zh) 切割背膠一體型黏著片
JP4770126B2 (ja) 接着シート
JP5206769B2 (ja) 接着シート
JP6264126B2 (ja) ウエハ加工用テープ
JP6295304B1 (ja) ダイシングテープ一体型接着シート
JP6310748B2 (ja) ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置、及び、半導体装置の製造方法
JP4923398B2 (ja) 接着剤層付き半導体素子の製造方法
JP4927187B2 (ja) ダイシング・ダイボンドフィルム
JP2011228399A (ja) 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
JP2011060848A (ja) 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置
JP2017183705A (ja) ダイシングダイボンドフィルム、及び、半導体装置の製造方法
JP6577341B2 (ja) 積層体および半導体装置の製造方法
KR20170056446A (ko) 적층체 및 합동체·조합의 회수 방법·반도체 장치의 제조 방법
JP2008231366A (ja) 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
TW202035605A (zh) 接著膜、附有切晶帶之接著膜、及半導體裝置製造方法
JP6299315B2 (ja) ウエハ加工用テープ
TWI750246B (zh) 片、膠帶及半導體裝置的製造方法
JP5908543B2 (ja) 半導体装置の製造方法
JP6660156B2 (ja) 積層体および合同体・半導体装置の製造方法
KR20170126796A (ko) 시트, 테이프, 및 반도체 장치의 제조 방법
TW202028392A (zh) 切晶黏晶膜
TW202039612A (zh) 切晶黏晶膜
TW202045660A (zh) 切晶帶、及附接著膜之切晶帶