KR102409604B1 - 가공 장치 - Google Patents

가공 장치 Download PDF

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Publication number
KR102409604B1
KR102409604B1 KR1020160038414A KR20160038414A KR102409604B1 KR 102409604 B1 KR102409604 B1 KR 102409604B1 KR 1020160038414 A KR1020160038414 A KR 1020160038414A KR 20160038414 A KR20160038414 A KR 20160038414A KR 102409604 B1 KR102409604 B1 KR 102409604B1
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KR
South Korea
Prior art keywords
imaging
processing
division
line
chuck table
Prior art date
Application number
KR1020160038414A
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English (en)
Korean (ko)
Other versions
KR20160119694A (ko
Inventor
나오야 도쿠미츠
Original Assignee
가부시기가이샤 디스코
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Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20160119694A publication Critical patent/KR20160119694A/ko
Application granted granted Critical
Publication of KR102409604B1 publication Critical patent/KR102409604B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Dicing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laser Beam Processing (AREA)
KR1020160038414A 2015-04-06 2016-03-30 가공 장치 KR102409604B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2015-078032 2015-04-06
JP2015078032A JP6465722B2 (ja) 2015-04-06 2015-04-06 加工装置

Publications (2)

Publication Number Publication Date
KR20160119694A KR20160119694A (ko) 2016-10-14
KR102409604B1 true KR102409604B1 (ko) 2022-06-17

Family

ID=57157267

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160038414A KR102409604B1 (ko) 2015-04-06 2016-03-30 가공 장치

Country Status (4)

Country Link
JP (1) JP6465722B2 (ja)
KR (1) KR102409604B1 (ja)
CN (1) CN106042199B (ja)
TW (1) TWI671836B (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6607639B2 (ja) * 2015-12-24 2019-11-20 株式会社ディスコ ウェーハの加工方法
US11315832B2 (en) * 2015-12-30 2022-04-26 Onto Innovation Inc. Wafer singulation process control
JP6680954B2 (ja) * 2016-10-10 2020-04-15 イリノイ トゥール ワークス インコーポレイティド サンプル作製ソー
JP6879747B2 (ja) * 2017-01-16 2021-06-02 株式会社ディスコ チャックテーブルの詰まり検出方法及び加工装置
JP6912267B2 (ja) * 2017-05-09 2021-08-04 株式会社ディスコ レーザ加工方法
JP6994852B2 (ja) * 2017-06-30 2022-01-14 株式会社ディスコ レーザー加工装置及びレーザー加工方法
JP6979296B2 (ja) * 2017-07-28 2021-12-08 株式会社ディスコ 切削方法
JP2019046923A (ja) * 2017-08-31 2019-03-22 株式会社ディスコ ウエーハの加工方法
JP7118522B2 (ja) * 2017-09-19 2022-08-16 株式会社ディスコ ウェーハの加工方法
JP7118521B2 (ja) * 2017-09-19 2022-08-16 株式会社ディスコ ウェーハの加工方法
JP7028607B2 (ja) * 2017-11-06 2022-03-02 株式会社ディスコ 切削装置
JP7017949B2 (ja) * 2018-03-02 2022-02-09 株式会社ディスコ 加工装置
JP7022624B2 (ja) * 2018-03-13 2022-02-18 株式会社ディスコ 位置付け方法
JP7325913B2 (ja) * 2019-11-22 2023-08-15 株式会社ディスコ ウェーハ加工装置
JP7222941B2 (ja) * 2020-02-10 2023-02-15 Ｔｏｗａ株式会社 加工装置
JP2022081919A (ja) 2020-11-20 2022-06-01 株式会社ディスコ 加工装置
CN113427143A (zh) * 2021-05-10 2021-09-24 深圳市仁创艺电子有限公司 用于热电分离金属基板加工的裁切装置及方法
JP2023163591A (ja) 2022-04-28 2023-11-10 株式会社ディスコ 被加工物の検査方法、及び検査装置、加工方法、加工装置
CN116394135B (zh) * 2023-06-08 2023-08-25 沈阳和研科技股份有限公司 划片机接触测高方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008004806A (ja) * 2006-06-23 2008-01-10 Disco Abrasive Syst Ltd ウエーハの加工結果管理方法
JP2008131015A (ja) * 2006-11-27 2008-06-05 Tokyo Electron Ltd ウエハ電極の登録方法及びウエハのアライメント方法並びにこれらの方法を記録した記録媒体
JP2009246015A (ja) * 2008-03-28 2009-10-22 Disco Abrasive Syst Ltd チッピング検出方法
JP2011012971A (ja) * 2009-06-30 2011-01-20 Toray Eng Co Ltd 外観検査方法およびその方法を用いて検査する外観検査装置
JP2014207354A (ja) 2013-04-15 2014-10-30 株式会社東京精密 エッジ検出装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07130806A (ja) * 1993-11-08 1995-05-19 Disco Abrasive Syst Ltd カーフチェック方法
JP4542223B2 (ja) * 2000-04-14 2010-09-08 株式会社ディスコ 切削装置
KR100863341B1 (ko) * 2008-03-28 2008-10-15 와이즈플래닛(주) 중복 영상을 이용한 에프피디 기판 및 반도체 웨이퍼검사시스템
KR101885392B1 (ko) * 2010-10-26 2018-08-03 가부시키가이샤 니콘 검사 장치, 검사 방법, 노광 방법, 및 반도체 디바이스의 제조 방법
JP5854501B2 (ja) * 2011-11-17 2016-02-09 東レエンジニアリング株式会社 自動外観検査装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008004806A (ja) * 2006-06-23 2008-01-10 Disco Abrasive Syst Ltd ウエーハの加工結果管理方法
JP2008131015A (ja) * 2006-11-27 2008-06-05 Tokyo Electron Ltd ウエハ電極の登録方法及びウエハのアライメント方法並びにこれらの方法を記録した記録媒体
JP2009246015A (ja) * 2008-03-28 2009-10-22 Disco Abrasive Syst Ltd チッピング検出方法
JP2011012971A (ja) * 2009-06-30 2011-01-20 Toray Eng Co Ltd 外観検査方法およびその方法を用いて検査する外観検査装置
JP2014207354A (ja) 2013-04-15 2014-10-30 株式会社東京精密 エッジ検出装置

Also Published As

Publication number Publication date
KR20160119694A (ko) 2016-10-14
JP6465722B2 (ja) 2019-02-06
CN106042199B (zh) 2019-09-06
TW201639054A (zh) 2016-11-01
CN106042199A (zh) 2016-10-26
JP2016197702A (ja) 2016-11-24
TWI671836B (zh) 2019-09-11

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