KR102409545B1 - 부동태 형성성 경금속 상의 열처리식 도전성 피막 형성 방법 - Google Patents

부동태 형성성 경금속 상의 열처리식 도전성 피막 형성 방법 Download PDF

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Publication number
KR102409545B1
KR102409545B1 KR1020217011088A KR20217011088A KR102409545B1 KR 102409545 B1 KR102409545 B1 KR 102409545B1 KR 1020217011088 A KR1020217011088 A KR 1020217011088A KR 20217011088 A KR20217011088 A KR 20217011088A KR 102409545 B1 KR102409545 B1 KR 102409545B1
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South Korea
Prior art keywords
film
acid
nickel
mol
phosphorus
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KR1020217011088A
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English (en)
Korean (ko)
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KR20210045505A (ko
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마사히로 후지와라
가즈유키 야마모토
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이시하라 케미칼 가부시키가이샤
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Publication of KR20210045505A publication Critical patent/KR20210045505A/ko
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C23C18/1692—Heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
KR1020217011088A 2016-10-25 2017-09-29 부동태 형성성 경금속 상의 열처리식 도전성 피막 형성 방법 KR102409545B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016208639A JP6326591B2 (ja) 2016-10-25 2016-10-25 不導態形成性の軽金属上への熱処理式の導電性皮膜形成方法
JPJP-P-2016-208639 2016-10-25
PCT/JP2017/035477 WO2018079188A1 (ja) 2016-10-25 2017-09-29 不導態形成性軽金属上への熱処理式の導電性皮膜形成方法
KR1020197011955A KR20190057105A (ko) 2016-10-25 2017-09-29 부동태 형성성 경금속 상의 열처리식 도전성 피막 형성 방법

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020197011955A Division KR20190057105A (ko) 2016-10-25 2017-09-29 부동태 형성성 경금속 상의 열처리식 도전성 피막 형성 방법

Publications (2)

Publication Number Publication Date
KR20210045505A KR20210045505A (ko) 2021-04-26
KR102409545B1 true KR102409545B1 (ko) 2022-06-15

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Application Number Title Priority Date Filing Date
KR1020197011955A KR20190057105A (ko) 2016-10-25 2017-09-29 부동태 형성성 경금속 상의 열처리식 도전성 피막 형성 방법
KR1020217011088A KR102409545B1 (ko) 2016-10-25 2017-09-29 부동태 형성성 경금속 상의 열처리식 도전성 피막 형성 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020197011955A KR20190057105A (ko) 2016-10-25 2017-09-29 부동태 형성성 경금속 상의 열처리식 도전성 피막 형성 방법

Country Status (5)

Country Link
JP (1) JP6326591B2 (ja)
KR (2) KR20190057105A (ja)
CN (1) CN109891004B (ja)
TW (1) TWI739920B (ja)
WO (1) WO2018079188A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220235468A1 (en) * 2019-07-31 2022-07-28 Showa Denko K.K. Laminate and method for producing same
CN110484943A (zh) * 2019-08-12 2019-11-22 天津市凯鑫金属制品有限公司 一种高位下拉训练器把手的电镀工艺
CN113737233A (zh) * 2021-06-23 2021-12-03 中国科学院深圳先进技术研究院 一种Fe-Ni-P合金电镀液、Fe-Ni-P合金镀层的电沉积方法及合金镀层

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000087291A (ja) * 1998-09-17 2000-03-28 Furukawa Electric Co Ltd:The アルミ基複合材製電子機器用ベース板およびその製造方法
JP2013237895A (ja) * 2012-05-15 2013-11-28 Ricoh Co Ltd 皮膜及びその製造方法、並びに金型

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JPH11302854A (ja) 1998-04-20 1999-11-02 Shimizuchou Kinzoku Kogyo Kk アルミニウム又はアルミニウム合金のめっき方法
JP3502921B2 (ja) 1999-10-29 2004-03-02 Ｔｄｋ株式会社 現像ローラー及びその製造方法
JP2003239057A (ja) * 2002-02-19 2003-08-27 Osaka Gas Co Ltd アルミニウムおよび／または亜鉛溶融用部材
MX2007007955A (es) 2005-01-19 2007-11-23 Aleris Aluminum Koblenz Gmbh Metodo de electro-revestimiento y pretratamiento de piezas de trabajo de aluminio.
TWI431150B (zh) 2007-01-12 2014-03-21 Uyemura C & Co Ltd 鋁或鋁合金之表面處理方法
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JP2010180457A (ja) * 2009-02-06 2010-08-19 Toyota Central R&D Labs Inc 耐食導電材の製造方法
KR101365661B1 (ko) * 2011-10-24 2014-02-24 (주)지오데코 무전해 니켈-인 도금액 및 이를 이용한 도금방법
JP6090693B2 (ja) * 2012-12-28 2017-03-08 福田金属箔粉工業株式会社 表面処理銅箔及び当該表面処理銅箔を用いたプリント配線板
JP6274556B2 (ja) 2013-12-03 2018-02-07 スズキ株式会社 電解めっき方法
JP6369748B2 (ja) * 2014-04-23 2018-08-08 スズキ株式会社 アルミニウム部材の表面被覆方法及び表面被覆アルミニウム部材並びに内燃機関用ピストン
CN104947162A (zh) * 2015-07-22 2015-09-30 四川华丰企业集团有限公司 一种钛合金表面电镀方法
CN105112960A (zh) * 2015-09-21 2015-12-02 无锡清杨机械制造有限公司 一种次磷酸盐体系镀Ni-P合金的电镀液及电镀方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000087291A (ja) * 1998-09-17 2000-03-28 Furukawa Electric Co Ltd:The アルミ基複合材製電子機器用ベース板およびその製造方法
JP2013237895A (ja) * 2012-05-15 2013-11-28 Ricoh Co Ltd 皮膜及びその製造方法、並びに金型

Also Published As

Publication number Publication date
CN109891004A (zh) 2019-06-14
CN109891004B (zh) 2021-05-25
TWI739920B (zh) 2021-09-21
WO2018079188A1 (ja) 2018-05-03
JP2018070911A (ja) 2018-05-10
JP6326591B2 (ja) 2018-05-23
KR20210045505A (ko) 2021-04-26
KR20190057105A (ko) 2019-05-27
TW201819690A (zh) 2018-06-01

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