KR102402242B1 - 연마 장치 - Google Patents

연마 장치 Download PDF

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Publication number
KR102402242B1
KR102402242B1 KR1020180126121A KR20180126121A KR102402242B1 KR 102402242 B1 KR102402242 B1 KR 102402242B1 KR 1020180126121 A KR1020180126121 A KR 1020180126121A KR 20180126121 A KR20180126121 A KR 20180126121A KR 102402242 B1 KR102402242 B1 KR 102402242B1
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KR
South Korea
Prior art keywords
substrate
polishing
abrasive
tape
polishing head
Prior art date
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Application number
KR1020180126121A
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English (en)
Korean (ko)
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KR20190046657A (ko
Inventor
겐이치 고바야시
마사유키 나카니시
마코토 가시와기
마나오 호시나
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20190046657A publication Critical patent/KR20190046657A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/12—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a contact wheel or roller pressing the belt against the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/008—Machines comprising two or more tools or having several working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/10—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a rigid member, e.g. pressure bar, table, pressing or supporting the belt over substantially its whole span
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/56—Cleaning of wafer backside
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020180126121A 2017-10-25 2018-10-22 연마 장치 Active KR102402242B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-206648 2017-10-25
JP2017206648A JP6908496B2 (ja) 2017-10-25 2017-10-25 研磨装置

Publications (2)

Publication Number Publication Date
KR20190046657A KR20190046657A (ko) 2019-05-07
KR102402242B1 true KR102402242B1 (ko) 2022-05-26

Family

ID=63965426

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180126121A Active KR102402242B1 (ko) 2017-10-25 2018-10-22 연마 장치

Country Status (6)

Country Link
US (2) US11865665B2 (https=)
EP (1) EP3476536B1 (https=)
JP (1) JP6908496B2 (https=)
KR (1) KR102402242B1 (https=)
CN (1) CN109702641B (https=)
TW (1) TWI748130B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6908496B2 (ja) * 2017-10-25 2021-07-28 株式会社荏原製作所 研磨装置
US11335588B2 (en) * 2019-06-18 2022-05-17 Ebara Corporation Substrate holding apparatus and substrate processing apparatus
JP7442314B2 (ja) * 2019-12-24 2024-03-04 東京エレクトロン株式会社 基板処理装置、および基板処理方法
JP7355670B2 (ja) * 2020-02-05 2023-10-03 株式会社荏原製作所 研磨ヘッドおよび研磨装置
JP7592434B2 (ja) 2020-08-28 2024-12-02 株式会社荏原製作所 ワークピース支持装置およびワークピース支持方法
JP7733453B2 (ja) * 2021-03-05 2025-09-03 株式会社荏原製作所 ワークピース処理装置およびワークピース処理方法
JP7756535B2 (ja) * 2021-10-06 2025-10-20 キヤノン株式会社 位置決め装置、リソグラフィ装置、および物品製造方法
JP7830072B2 (ja) 2021-10-20 2026-03-16 株式会社荏原製作所 基板処理装置
CN114131496B (zh) * 2021-12-29 2025-06-10 深圳市普盛旺科技有限公司 自动抛光生产线
CN114393480A (zh) * 2021-12-30 2022-04-26 咸宁南玻光电玻璃有限公司 抛光设备
JP7762092B2 (ja) 2022-03-08 2025-10-29 株式会社荏原製作所 基板研磨方法
CN118219119B (zh) * 2024-04-17 2024-08-23 东台启盛新能源科技有限公司 一种方便取出的风扇叶片打磨机及使用方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002208572A (ja) * 2001-01-09 2002-07-26 Ebara Corp 研磨装置
US20070226992A1 (en) 2006-03-31 2007-10-04 Hiroyuki Kaneko Substrate holding rotating mechanism, and substrate processing apparatus
JP2014017472A (ja) 2012-06-15 2014-01-30 Tokyo Electron Ltd シート剥離装置、接合システム、剥離システム、シート剥離方法、プログラム及びコンピュータ記憶媒体

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08161738A (ja) * 1994-12-06 1996-06-21 Mitsubishi Chem Corp 磁気記録媒体の製造方法
JP2000315665A (ja) * 1999-04-29 2000-11-14 Ebara Corp 研磨方法及び装置
US6184139B1 (en) * 1998-09-17 2001-02-06 Speedfam-Ipec Corporation Oscillating orbital polisher and method
US6273800B1 (en) * 1999-08-31 2001-08-14 Micron Technology, Inc. Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates
AU2001263709A1 (en) * 2000-07-03 2002-01-14 Kundig Ag Sanding device comprising abrasive rolls mounted on winding shafts
US6913528B2 (en) * 2001-03-19 2005-07-05 Speedfam-Ipec Corporation Low amplitude, high speed polisher and method
JP2003080451A (ja) * 2001-09-07 2003-03-18 Tokyo Seimitsu Co Ltd 研磨装置及び研磨方法
JP5026957B2 (ja) * 2004-10-15 2012-09-19 株式会社東芝 研磨装置及び研磨方法
TW200800488A (en) 2006-03-03 2008-01-01 Inopla Inc Polishing head for polishing semiconductor wafers
US8578953B2 (en) 2006-12-20 2013-11-12 Tokyo Electron Limited Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium
JP5254575B2 (ja) * 2007-07-11 2013-08-07 株式会社東芝 研磨装置および研磨方法
JP2009045679A (ja) * 2007-08-16 2009-03-05 Ebara Corp 研磨装置
JP5393039B2 (ja) * 2008-03-06 2014-01-22 株式会社荏原製作所 研磨装置
JP2010162624A (ja) * 2009-01-13 2010-07-29 Ebara Corp 研磨装置および研磨方法
JP5544642B2 (ja) 2009-07-03 2014-07-09 国立大学法人東北大学 ウェット処理装置及びウェット処理方法
JP2011224680A (ja) * 2010-04-16 2011-11-10 Ebara Corp 研磨方法及び研磨装置
JP6113960B2 (ja) * 2012-02-21 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
JP6100002B2 (ja) 2013-02-01 2017-03-22 株式会社荏原製作所 基板裏面の研磨方法および基板処理装置
JP6145334B2 (ja) * 2013-06-28 2017-06-07 株式会社荏原製作所 基板処理装置
US10076817B2 (en) * 2014-07-17 2018-09-18 Applied Materials, Inc. Orbital polishing with small pad
JP2016058675A (ja) * 2014-09-12 2016-04-21 株式会社東芝 研磨装置および半導体ウェハの研磨方法
JP6403159B2 (ja) * 2015-02-26 2018-10-10 株式会社日立プラントメカニクス フィルムの真空ラミネート装置
JP2017148931A (ja) * 2016-02-19 2017-08-31 株式会社荏原製作所 研磨装置および研磨方法
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP6908496B2 (ja) * 2017-10-25 2021-07-28 株式会社荏原製作所 研磨装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002208572A (ja) * 2001-01-09 2002-07-26 Ebara Corp 研磨装置
US20070226992A1 (en) 2006-03-31 2007-10-04 Hiroyuki Kaneko Substrate holding rotating mechanism, and substrate processing apparatus
JP2014017472A (ja) 2012-06-15 2014-01-30 Tokyo Electron Ltd シート剥離装置、接合システム、剥離システム、シート剥離方法、プログラム及びコンピュータ記憶媒体

Also Published As

Publication number Publication date
JP6908496B2 (ja) 2021-07-28
US20240091899A1 (en) 2024-03-21
TWI748130B (zh) 2021-12-01
CN109702641B (zh) 2022-07-08
CN109702641A (zh) 2019-05-03
US20190118335A1 (en) 2019-04-25
JP2019077003A (ja) 2019-05-23
EP3476536B1 (en) 2022-12-28
EP3476536A1 (en) 2019-05-01
TW201923872A (zh) 2019-06-16
US11865665B2 (en) 2024-01-09
KR20190046657A (ko) 2019-05-07

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