KR102352422B1 - 광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 - Google Patents

광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 Download PDF

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Publication number
KR102352422B1
KR102352422B1 KR1020167031307A KR20167031307A KR102352422B1 KR 102352422 B1 KR102352422 B1 KR 102352422B1 KR 1020167031307 A KR1020167031307 A KR 1020167031307A KR 20167031307 A KR20167031307 A KR 20167031307A KR 102352422 B1 KR102352422 B1 KR 102352422B1
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KR
South Korea
Prior art keywords
carboxyl group
resin
type
bisphenol
containing resin
Prior art date
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KR1020167031307A
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English (en)
Korean (ko)
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KR20170039617A (ko
Inventor
쇼헤이 마키타
슈이치 야마모토
구오빈 푸
시유안 동
Original Assignee
타이요 잉크 (쑤저우) 컴퍼니 리미티드
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Publication of KR20170039617A publication Critical patent/KR20170039617A/ko
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Publication of KR102352422B1 publication Critical patent/KR102352422B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
KR1020167031307A 2014-07-31 2014-11-12 광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 KR102352422B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201410373453.9 2014-07-31
CN201410373453.9A CN105467753B (zh) 2014-07-31 2014-07-31 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板
PCT/CN2014/090861 WO2016015398A1 (fr) 2014-07-31 2014-11-12 Composition de résine thermodurcissable durcie à la lumière, film sec, produit durci et carte de circuit imprimé

Publications (2)

Publication Number Publication Date
KR20170039617A KR20170039617A (ko) 2017-04-11
KR102352422B1 true KR102352422B1 (ko) 2022-01-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167031307A KR102352422B1 (ko) 2014-07-31 2014-11-12 광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JP6669668B2 (fr)
KR (1) KR102352422B1 (fr)
CN (1) CN105467753B (fr)
TW (1) TWI624729B (fr)
WO (1) WO2016015398A1 (fr)

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* Cited by examiner, † Cited by third party
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KR102053322B1 (ko) * 2016-03-08 2019-12-06 주식회사 엘지화학 감광성 수지 조성물 및 감광성 절연 필름
JP6748663B2 (ja) * 2017-03-31 2020-09-02 太陽インキ製造株式会社 硬化性組成物、ドライフィルム、硬化物およびプリント配線板
JP7254511B2 (ja) * 2018-03-28 2023-04-10 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、およびプリント配線板の製造方法
CN110527349A (zh) * 2019-08-06 2019-12-03 甘肃泰升化工科技有限公司 一种光固化性热固化性树脂组合物及其固化物
WO2023190456A1 (fr) * 2022-03-31 2023-10-05 太陽ホールディングス株式会社 Produit durci, composition de résine photosensible, film sec et carte de circuit imprimé
CN118259540A (zh) * 2022-12-28 2024-06-28 太阳油墨（苏州）有限公司 碱性显影型树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板
CN118259548A (zh) * 2022-12-28 2024-06-28 太阳油墨（苏州）有限公司 感光热固化显影性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板

Citations (2)

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JP2012215716A (ja) * 2011-03-31 2012-11-08 Taiyo Ink Mfg Ltd 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
JP2014060445A (ja) * 2013-12-03 2014-04-03 Taiyo Holdings Co Ltd ポリエステル基材用樹脂組成物、それを用いたドライフィルム及びプリント配線板

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KR100845657B1 (ko) * 2004-07-07 2008-07-10 다이요 잉키 세이조 가부시키가이샤 광 경화성·열 경화성 수지 조성물과 그것을 사용한 건식필름, 및 그의 경화물
JP2007220652A (ja) * 2005-11-30 2007-08-30 Sumitomo Chemical Co Ltd 感光性ペースト
JP4376290B2 (ja) * 2007-03-05 2009-12-02 株式会社日本触媒 ソルダーレジスト、そのドライフィルム及び硬化物ならびにプリント配線板
JP4814134B2 (ja) * 2007-03-23 2011-11-16 太陽ホールディングス株式会社 硬化性組成物及びその硬化物
JP5285257B2 (ja) * 2007-09-21 2013-09-11 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物
JP5449688B2 (ja) * 2008-03-26 2014-03-19 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5377020B2 (ja) * 2009-03-23 2013-12-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5250479B2 (ja) * 2009-05-18 2013-07-31 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
KR101307144B1 (ko) * 2009-09-10 2013-09-10 세키스이가가쿠 고교가부시키가이샤 솔더 레지스트 조성물 및 인쇄 배선판
WO2012132423A1 (fr) * 2011-03-31 2012-10-04 太陽ホールディングス株式会社 Composition d'encre photodurcissable/thermodurcissable pour l'impression par jet d'encre et carte de circuit imprimé l'utilisant
TWI541594B (zh) * 2011-09-30 2016-07-11 Taiyo Ink Mfg Co Ltd A photosensitive resin composition, a hardened film thereof, and a printed wiring board
CN103324029B (zh) * 2012-03-23 2016-01-13 太阳油墨（苏州）有限公司 感光性树脂组合物及其固化物、以及印刷电路板
JP5878913B2 (ja) * 2013-12-17 2016-03-08 互応化学工業株式会社 感光性樹脂組成物、ソルダーレジスト用組成物、プリント配線板、及び感光性樹脂組成物の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012215716A (ja) * 2011-03-31 2012-11-08 Taiyo Ink Mfg Ltd 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
JP2014060445A (ja) * 2013-12-03 2014-04-03 Taiyo Holdings Co Ltd ポリエステル基材用樹脂組成物、それを用いたドライフィルム及びプリント配線板

Also Published As

Publication number Publication date
WO2016015398A1 (fr) 2016-02-04
TW201604652A (zh) 2016-02-01
CN105467753B (zh) 2020-01-14
KR20170039617A (ko) 2017-04-11
JP2017529551A (ja) 2017-10-05
CN105467753A (zh) 2016-04-06
TWI624729B (zh) 2018-05-21
JP6669668B2 (ja) 2020-03-18

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