KR102325456B1 - 수지 조성물 - Google Patents

수지 조성물 Download PDF

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Publication number
KR102325456B1
KR102325456B1 KR1020170037418A KR20170037418A KR102325456B1 KR 102325456 B1 KR102325456 B1 KR 102325456B1 KR 1020170037418 A KR1020170037418 A KR 1020170037418A KR 20170037418 A KR20170037418 A KR 20170037418A KR 102325456 B1 KR102325456 B1 KR 102325456B1
Authority
KR
South Korea
Prior art keywords
resin
resin composition
mass
formula
component
Prior art date
Application number
KR1020170037418A
Other languages
English (en)
Korean (ko)
Other versions
KR20170113230A (ko
Inventor
마사키 나가시마
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20170113230A publication Critical patent/KR20170113230A/ko
Priority to KR1020210118833A priority Critical patent/KR102376003B1/ko
Application granted granted Critical
Publication of KR102325456B1 publication Critical patent/KR102325456B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • C08L45/02—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers of coumarone-indene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020170037418A 2016-03-28 2017-03-24 수지 조성물 KR102325456B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020210118833A KR102376003B1 (ko) 2016-03-28 2021-09-07 수지 조성물

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-064640 2016-03-28
JP2016064640A JP6776577B2 (ja) 2016-03-28 2016-03-28 樹脂組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020210118833A Division KR102376003B1 (ko) 2016-03-28 2021-09-07 수지 조성물

Publications (2)

Publication Number Publication Date
KR20170113230A KR20170113230A (ko) 2017-10-12
KR102325456B1 true KR102325456B1 (ko) 2021-11-15

Family

ID=59983725

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020170037418A KR102325456B1 (ko) 2016-03-28 2017-03-24 수지 조성물
KR1020210118833A KR102376003B1 (ko) 2016-03-28 2021-09-07 수지 조성물

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020210118833A KR102376003B1 (ko) 2016-03-28 2021-09-07 수지 조성물

Country Status (4)

Country Link
JP (1) JP6776577B2 (zh)
KR (2) KR102325456B1 (zh)
CN (1) CN107236251B (zh)
TW (1) TWI745363B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6911806B2 (ja) * 2018-03-29 2021-07-28 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
JP7076263B2 (ja) * 2018-03-30 2022-05-27 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
TWI688607B (zh) * 2018-10-04 2020-03-21 台光電子材料股份有限公司 樹脂組合物及由其製成之物品
JP7342358B2 (ja) * 2018-12-26 2023-09-12 住友ベークライト株式会社 樹脂組成物、それを用いたキャリア付樹脂膜、プリプレグ、積層板、プリント配線基板および半導体装置
CN113348195B (zh) * 2019-02-05 2022-05-31 普林科技有限公司 树脂组合物、清漆、层叠板以及印刷配线基板
US20220267650A1 (en) * 2019-08-06 2022-08-25 Dexerials Corporation Adhesive composition, thermosetting adhesive sheet, and printed wiring board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000309678A (ja) 1999-02-22 2000-11-07 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2002047394A (ja) 2000-08-01 2002-02-12 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP2014034580A (ja) * 2012-08-07 2014-02-24 Ajinomoto Co Inc 樹脂組成物
JP2015004009A (ja) 2013-06-21 2015-01-08 味の素株式会社 樹脂組成物
JP2016008240A (ja) 2014-06-23 2016-01-18 京セラケミカル株式会社 圧縮成形用粉粒状樹脂組成物および樹脂封止型半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02160858A (ja) * 1988-12-15 1990-06-20 Sumitomo Chem Co Ltd 熱可塑性樹脂組成物
CA2002910A1 (en) * 1988-11-18 1990-05-18 Motonobu Furuta Thermoplastic resin composition
JPH05211251A (ja) * 1991-12-04 1993-08-20 Nippon Steel Chem Co Ltd 半導体封止用樹脂組成物
JP2524453B2 (ja) * 1992-06-12 1996-08-14 住友ベークライト株式会社 熱硬化性樹脂組成物
JP6378533B2 (ja) * 2013-06-01 2018-08-22 日東電工株式会社 熱伝導性粘着シート
JP6452335B2 (ja) 2013-08-09 2019-01-16 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000309678A (ja) 1999-02-22 2000-11-07 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2002047394A (ja) 2000-08-01 2002-02-12 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP2014034580A (ja) * 2012-08-07 2014-02-24 Ajinomoto Co Inc 樹脂組成物
JP2015004009A (ja) 2013-06-21 2015-01-08 味の素株式会社 樹脂組成物
JP2016008240A (ja) 2014-06-23 2016-01-18 京セラケミカル株式会社 圧縮成形用粉粒状樹脂組成物および樹脂封止型半導体装置

Also Published As

Publication number Publication date
CN107236251A (zh) 2017-10-10
KR20170113230A (ko) 2017-10-12
KR102376003B1 (ko) 2022-03-21
JP6776577B2 (ja) 2020-10-28
KR20210114901A (ko) 2021-09-24
TW201805324A (zh) 2018-02-16
JP2017179014A (ja) 2017-10-05
TWI745363B (zh) 2021-11-11
CN107236251B (zh) 2021-03-02

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