KR102315943B1 - 금 함유 층 전착용 조성물, 이의 용도 및 방법 - Google Patents

금 함유 층 전착용 조성물, 이의 용도 및 방법 Download PDF

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Publication number
KR102315943B1
KR102315943B1 KR1020177004453A KR20177004453A KR102315943B1 KR 102315943 B1 KR102315943 B1 KR 102315943B1 KR 1020177004453 A KR1020177004453 A KR 1020177004453A KR 20177004453 A KR20177004453 A KR 20177004453A KR 102315943 B1 KR102315943 B1 KR 102315943B1
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KR
South Korea
Prior art keywords
gold
substrate
mercapto
triazole
electroplating composition
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KR1020177004453A
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English (en)
Korean (ko)
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KR20170046651A (ko
Inventor
야나 브라이트펠더
로베르트 뤼터
올라프 쿠르츠
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아토테크더치랜드게엠베하
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51390050&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR102315943(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 아토테크더치랜드게엠베하 filed Critical 아토테크더치랜드게엠베하
Publication of KR20170046651A publication Critical patent/KR20170046651A/ko
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020177004453A 2014-08-25 2015-08-21 금 함유 층 전착용 조성물, 이의 용도 및 방법 KR102315943B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14182083.7 2014-08-25
EP14182083.7A EP2990507A1 (de) 2014-08-25 2014-08-25 Zusammensetzung, ihre Verwendung und Verfahren zur galvanischen Abscheidung von Gold enthaltenden Schichten
PCT/EP2015/069234 WO2016030290A1 (en) 2014-08-25 2015-08-21 Composition, use thereof and method for electrodepositing gold containing layers

Publications (2)

Publication Number Publication Date
KR20170046651A KR20170046651A (ko) 2017-05-02
KR102315943B1 true KR102315943B1 (ko) 2021-10-21

Family

ID=51390050

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177004453A KR102315943B1 (ko) 2014-08-25 2015-08-21 금 함유 층 전착용 조성물, 이의 용도 및 방법

Country Status (8)

Country Link
US (1) US20170159195A1 (de)
EP (2) EP2990507A1 (de)
JP (1) JP6726173B2 (de)
KR (1) KR102315943B1 (de)
CN (1) CN106661751B (de)
SG (1) SG11201700461VA (de)
TW (1) TWI669296B (de)
WO (1) WO2016030290A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016208340A1 (ja) * 2015-06-26 2016-12-29 メタローテクノロジーズジャパン株式会社 電解硬質金めっき液用置換防止剤及びそれを含む電解硬質金めっき液
CN108063219B (zh) * 2017-11-23 2020-01-10 浙江大学 一种高效液态碱金属合金电极及其制备方法和应用
US11674235B2 (en) * 2018-04-11 2023-06-13 Hutchinson Technology Incorporated Plating method to reduce or eliminate voids in solder applied without flux
CN108998817B (zh) * 2018-07-06 2021-04-16 鹤山市精工制版有限公司 一种打底镀镍液用添加剂及其应用
CN108754554B (zh) * 2018-09-18 2019-10-22 泉州益丰贵金属科技有限公司 一种镀金液及一种镀金方法
EP4370732A1 (de) 2021-07-15 2024-05-22 Seolfor Aktiebolag Elektroplattierungszusammensetzungen und verfahren zu ihrer herstellung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006348383A (ja) * 2005-06-02 2006-12-28 Rohm & Haas Electronic Materials Llc 改善された金合金電解質
US20110147220A1 (en) * 2009-09-25 2011-06-23 Rohm And Haas Electronic Materials Llc Anti-displacement hard gold compositions

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004176171A (ja) * 2002-09-30 2004-06-24 Shinko Electric Ind Co Ltd 非シアン電解金めっき液
JP4868123B2 (ja) * 2005-02-04 2012-02-01 学校法人早稲田大学 金−ニッケル系アモルファス合金めっき皮膜、電気めっき液及び電気めっき方法
JP4868121B2 (ja) * 2005-12-21 2012-02-01 学校法人早稲田大学 アモルファス金−ニッケル系合金めっき皮膜形成用電気めっき液及び電気めっき方法
KR101079554B1 (ko) * 2008-06-11 2011-11-04 니혼 고쥰도가가쿠 가부시키가이샤 전해 금도금액 및 그것을 이용하여 얻어진 금피막
ITFI20120103A1 (it) * 2012-06-01 2013-12-02 Bluclad Srl Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni.

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006348383A (ja) * 2005-06-02 2006-12-28 Rohm & Haas Electronic Materials Llc 改善された金合金電解質
US20110147220A1 (en) * 2009-09-25 2011-06-23 Rohm And Haas Electronic Materials Llc Anti-displacement hard gold compositions

Also Published As

Publication number Publication date
US20170159195A1 (en) 2017-06-08
WO2016030290A1 (en) 2016-03-03
TWI669296B (zh) 2019-08-21
KR20170046651A (ko) 2017-05-02
JP6726173B2 (ja) 2020-07-22
EP3186413A1 (de) 2017-07-05
JP2017527700A (ja) 2017-09-21
EP2990507A1 (de) 2016-03-02
CN106661751A (zh) 2017-05-10
TW201615628A (zh) 2016-05-01
EP3186413B1 (de) 2019-02-06
SG11201700461VA (en) 2017-03-30
CN106661751B (zh) 2019-11-12

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