KR102269697B1 - 기판 반송 로봇, 진공 처리 장치 - Google Patents
기판 반송 로봇, 진공 처리 장치 Download PDFInfo
- Publication number
- KR102269697B1 KR102269697B1 KR1020170093481A KR20170093481A KR102269697B1 KR 102269697 B1 KR102269697 B1 KR 102269697B1 KR 1020170093481 A KR1020170093481 A KR 1020170093481A KR 20170093481 A KR20170093481 A KR 20170093481A KR 102269697 B1 KR102269697 B1 KR 102269697B1
- Authority
- KR
- South Korea
- Prior art keywords
- support plate
- substrate
- quartz
- plate
- hand
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016149937A JP6742849B2 (ja) | 2016-07-29 | 2016-07-29 | 基板搬送ロボット、真空処理装置 |
JPJP-P-2016-149937 | 2016-07-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20180013737A KR20180013737A (ko) | 2018-02-07 |
KR102269697B1 true KR102269697B1 (ko) | 2021-06-25 |
Family
ID=61075966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020170093481A KR102269697B1 (ko) | 2016-07-29 | 2017-07-24 | 기판 반송 로봇, 진공 처리 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6742849B2 (ja) |
KR (1) | KR102269697B1 (ja) |
CN (1) | CN107665845B (ja) |
TW (1) | TWI721190B (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004018215A (ja) | 2002-06-18 | 2004-01-22 | Tokyo Electron Ltd | フラット・パネル・ディスプレイ用熱処理装置及び熱処理方法 |
JP2009111393A (ja) | 2007-10-31 | 2009-05-21 | Applied Materials Inc | 高温下での基板取り出しのための進化したfiブレード |
JP2013103331A (ja) | 2011-11-16 | 2013-05-30 | Nidec Sankyo Corp | 産業用ロボット |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0721458Y2 (ja) * | 1989-10-31 | 1995-05-17 | 大日本スクリーン製造株式会社 | ウエハ搬送アーム |
JPH03217041A (ja) * | 1990-01-22 | 1991-09-24 | Dainippon Screen Mfg Co Ltd | 基板搬送用アーム |
JPH0529431A (ja) * | 1991-07-25 | 1993-02-05 | Matsushita Electric Ind Co Ltd | 基板搬送用アーム |
JP3238432B2 (ja) * | 1991-08-27 | 2001-12-17 | 東芝機械株式会社 | マルチチャンバ型枚葉処理装置 |
JPH0722489A (ja) * | 1993-06-29 | 1995-01-24 | Toshiba Corp | ウェハーフォーク |
JPH08330385A (ja) * | 1995-05-31 | 1996-12-13 | Kokusai Electric Co Ltd | 基板搬送ツィーザ |
US5746460A (en) * | 1995-12-08 | 1998-05-05 | Applied Materials, Inc. | End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector |
JP2003045937A (ja) * | 2001-07-31 | 2003-02-14 | Ishikawajima Harima Heavy Ind Co Ltd | 高温炉用ハンド |
JP2003224173A (ja) * | 2002-01-29 | 2003-08-08 | Komatsu Electronic Metals Co Ltd | 半導体製造装置 |
US7073834B2 (en) * | 2004-06-25 | 2006-07-11 | Applied Materials, Inc. | Multiple section end effector assembly |
US8545165B2 (en) * | 2005-03-30 | 2013-10-01 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
JP2008227200A (ja) * | 2007-03-14 | 2008-09-25 | Ihi Corp | 基板容器用ロボットハンドと蓋付基板容器 |
US8057602B2 (en) * | 2007-05-09 | 2011-11-15 | Applied Materials, Inc. | Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber |
JP5548163B2 (ja) * | 2010-09-14 | 2014-07-16 | 株式会社日立国際電気 | 基板搬送機構、基板処理装置および半導体装置の製造方法 |
WO2012148568A1 (en) * | 2011-03-01 | 2012-11-01 | Applied Materials, Inc. | Method and apparatus for substrate transfer and radical confinement |
JP6256909B2 (ja) * | 2013-10-21 | 2018-01-10 | 株式会社アルバック | 基板搬送装置および基板処理装置 |
US9415519B2 (en) * | 2014-07-01 | 2016-08-16 | Varian Semiconductor Equipment Associates, Inc. | Composite end effector and method of making a composite end effector |
-
2016
- 2016-07-29 JP JP2016149937A patent/JP6742849B2/ja active Active
-
2017
- 2017-07-24 KR KR1020170093481A patent/KR102269697B1/ko active IP Right Grant
- 2017-07-28 CN CN201710629887.4A patent/CN107665845B/zh active Active
- 2017-07-31 TW TW106122561A patent/TWI721190B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004018215A (ja) | 2002-06-18 | 2004-01-22 | Tokyo Electron Ltd | フラット・パネル・ディスプレイ用熱処理装置及び熱処理方法 |
JP2009111393A (ja) | 2007-10-31 | 2009-05-21 | Applied Materials Inc | 高温下での基板取り出しのための進化したfiブレード |
JP2013103331A (ja) | 2011-11-16 | 2013-05-30 | Nidec Sankyo Corp | 産業用ロボット |
Also Published As
Publication number | Publication date |
---|---|
TW201807768A (zh) | 2018-03-01 |
JP2018019015A (ja) | 2018-02-01 |
TWI721190B (zh) | 2021-03-11 |
KR20180013737A (ko) | 2018-02-07 |
CN107665845B (zh) | 2023-04-14 |
JP6742849B2 (ja) | 2020-08-19 |
CN107665845A (zh) | 2018-02-06 |
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