KR102248994B1 - 고내열 폴리아믹산 용액 및 폴리이미드 필름 - Google Patents
고내열 폴리아믹산 용액 및 폴리이미드 필름 Download PDFInfo
- Publication number
- KR102248994B1 KR102248994B1 KR1020150091870A KR20150091870A KR102248994B1 KR 102248994 B1 KR102248994 B1 KR 102248994B1 KR 1020150091870 A KR1020150091870 A KR 1020150091870A KR 20150091870 A KR20150091870 A KR 20150091870A KR 102248994 B1 KR102248994 B1 KR 102248994B1
- Authority
- KR
- South Korea
- Prior art keywords
- polyamic acid
- acid solution
- dianhydride
- diamine compound
- cte
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104121001A TWI535760B (zh) | 2014-06-30 | 2015-06-29 | 高耐熱聚醯胺酸溶液及聚醯亞胺薄膜 |
| CN201580035000.8A CN106536597A (zh) | 2014-06-30 | 2015-06-30 | 高耐热聚酰胺酸溶液和聚酰亚胺膜 |
| US15/322,957 US10538665B2 (en) | 2014-06-30 | 2015-06-30 | High heat-resistant polyamic acid solution and polyimide film |
| PCT/KR2015/006666 WO2016003146A1 (ko) | 2014-06-30 | 2015-06-30 | 고내열 폴리아믹산 용액 및 폴리이미드 필름 |
| EP15815907.9A EP3162838A4 (en) | 2014-06-30 | 2015-06-30 | High heat-resistant polyamic acid solution and polyimide film |
| JP2016575755A JP6715406B2 (ja) | 2014-06-30 | 2015-06-30 | 高耐熱ポリイミドフィルム |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20140081403 | 2014-06-30 | ||
| KR1020140081403 | 2014-06-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160002386A KR20160002386A (ko) | 2016-01-07 |
| KR102248994B1 true KR102248994B1 (ko) | 2021-05-07 |
Family
ID=55169022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150091870A Active KR102248994B1 (ko) | 2014-06-30 | 2015-06-29 | 고내열 폴리아믹산 용액 및 폴리이미드 필름 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10538665B2 (https=) |
| EP (1) | EP3162838A4 (https=) |
| JP (1) | JP6715406B2 (https=) |
| KR (1) | KR102248994B1 (https=) |
| CN (1) | CN106536597A (https=) |
| TW (1) | TWI535760B (https=) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018023205A (ja) * | 2016-08-02 | 2018-02-08 | 株式会社デンソー | 絶縁電線、コイル、および回転電機 |
| WO2018025600A1 (ja) | 2016-08-05 | 2018-02-08 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム複合シート |
| KR102758843B1 (ko) | 2017-02-10 | 2025-01-24 | 삼성디스플레이 주식회사 | 폴리아믹산, 폴리이미드 필름 및 폴리이미드 필름의 제조 방법 |
| CN107034541B (zh) * | 2017-04-13 | 2019-04-26 | 江苏先诺新材料科技有限公司 | 一种无卤阻燃耐烧蚀纤维材料及其制备方法和应用 |
| KR101899098B1 (ko) * | 2017-04-28 | 2018-09-14 | 지에스칼텍스 주식회사 | 폴리이미드 필름의 제조방법 및 이에 의해 제조된 폴리이미드 필름 |
| JP7109176B2 (ja) * | 2017-10-18 | 2022-07-29 | 東レ・デュポン株式会社 | ポリイミドフィルム |
| KR102175851B1 (ko) * | 2017-11-10 | 2020-11-06 | 피아이첨단소재 주식회사 | 도체 피복용 폴리아믹산 조성물 |
| KR102055630B1 (ko) * | 2017-12-28 | 2019-12-16 | 에스케이씨코오롱피아이 주식회사 | 연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판 |
| KR102272716B1 (ko) * | 2019-04-12 | 2021-07-05 | 피아이첨단소재 주식회사 | 치수안정성 및 접착력이 우수한 다층 폴리이미드 필름 및 이의 제조방법 |
| WO2020209555A1 (ko) * | 2019-04-12 | 2020-10-15 | 피아이첨단소재 주식회사 | 치수안정성 및 접착력이 우수한 다층 폴리이미드 필름 및 이의 제조방법 |
| CN111825864A (zh) * | 2019-04-18 | 2020-10-27 | 北京化工大学 | 超耐高温聚酰亚胺薄膜及其制备方法与应用 |
| DE102019206559A1 (de) * | 2019-05-07 | 2020-11-26 | Aktiebolaget Skf | Imidzusammensetzung und Schutzmittelzusammensetzung mit der Imidzusammensetzung |
| KR102362385B1 (ko) * | 2019-11-13 | 2022-02-15 | 피아이첨단소재 주식회사 | 고탄성 및 고내열 폴리이미드 필름 및 그 제조방법 |
| CN111116913A (zh) * | 2019-12-31 | 2020-05-08 | 阜阳欣奕华材料科技有限公司 | 一种聚酰胺酸溶液、聚酰亚胺薄膜及其应用 |
| CN111072964B (zh) * | 2019-12-31 | 2022-07-12 | 北京欣奕华科技有限公司 | 一种聚酰亚胺前体组合物及其制备方法和应用 |
| KR102166032B1 (ko) * | 2020-06-17 | 2020-10-15 | 에스케이이노베이션 주식회사 | 폴리이미드계 필름 및 이를 포함하는 플렉서블 디스플레이 패널 |
| KR102286213B1 (ko) | 2020-07-30 | 2021-08-06 | 에스케이이노베이션 주식회사 | 폴리이미드계 필름 및 이를 포함하는 플렉서블 디스플레이 패널 |
| KR102456932B1 (ko) * | 2020-11-25 | 2022-10-21 | 피아이첨단소재 주식회사 | 폴리이미드 필름 및 이를 포함한 광학 장치 |
| CN116003789B (zh) * | 2021-10-22 | 2026-04-21 | 中国石油化工股份有限公司 | 聚酰胺酸溶液、聚酰亚胺、聚酰亚胺膜及其制备方法和应用 |
| CN115819760B (zh) * | 2022-01-17 | 2024-07-23 | 上海市塑料研究所有限公司 | 耐高温聚酰胺酸浆料及其制备方法和应用 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070003773A1 (en) * | 2005-06-29 | 2007-01-04 | Kenji Uhara | Multi-layer polyimide films and flexible circuit substrates therefrom |
| CN101327409A (zh) * | 2008-08-01 | 2008-12-24 | 天津大学 | 聚酰亚胺渗透汽化膜及制备方法及用途 |
| US20130046057A1 (en) | 2010-04-12 | 2013-02-21 | National University Of Singapore | Polyimide membranes and their preparation |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61111359A (ja) * | 1984-11-06 | 1986-05-29 | Ube Ind Ltd | ポリイミド膜 |
| JP3089195B2 (ja) | 1995-10-12 | 2000-09-18 | 大日本塗料株式会社 | 電着用ポリイミド組成物 |
| US6790930B1 (en) | 1999-10-06 | 2004-09-14 | Kaneka Corporation | Process for producing polyimide resin |
| WO2004094499A1 (ja) * | 2003-04-18 | 2004-11-04 | Kaneka Corporation | 熱硬化性樹脂組成物、それを用いてなる積層体、回路基板 |
| JP2005054172A (ja) | 2003-07-24 | 2005-03-03 | Du Pont Toray Co Ltd | ポリアミック酸、それからなるポリイミドフィルム、その製造方法およびフレキシブル回路基板 |
| US20060009615A1 (en) | 2004-07-09 | 2006-01-12 | Kenji Uhara | Polyamic acids, polyimide films and polymide-metal laminates and methods for making same |
| JP5110242B2 (ja) | 2004-12-03 | 2012-12-26 | 宇部興産株式会社 | ポリイミド、ポリイミドフィルム及び積層体 |
| JP4780548B2 (ja) | 2004-12-21 | 2011-09-28 | 東レ・デュポン株式会社 | ポリイミドフィルム、その製造方法およびフレキシブル回路基板 |
| JP4974068B2 (ja) | 2005-08-02 | 2012-07-11 | 東レ・デュポン株式会社 | ポリイミドフィルム、その製造方法およびフレキシブル回路基板 |
| JP2008248067A (ja) | 2007-03-30 | 2008-10-16 | Du Pont Toray Co Ltd | ポリイミドフィルムおよびフレキシブル回路基板 |
| DE112007003428B4 (de) * | 2007-04-03 | 2015-07-23 | Solpit Industries Ltd. | Lösungsmittel-lösliche Polyimid-Copolymere sowie Verfahren zu deren Herstellung |
| KR101558621B1 (ko) * | 2010-12-16 | 2015-10-08 | 에스케이씨코오롱피아이 주식회사 | 폴리이미드 필름 |
| JP2013174860A (ja) | 2012-01-24 | 2013-09-05 | Jsr Corp | 光配向用液晶配向剤、液晶配向膜の形成方法、液晶配向膜及び液晶表示素子 |
-
2015
- 2015-06-29 KR KR1020150091870A patent/KR102248994B1/ko active Active
- 2015-06-29 TW TW104121001A patent/TWI535760B/zh active
- 2015-06-30 JP JP2016575755A patent/JP6715406B2/ja active Active
- 2015-06-30 CN CN201580035000.8A patent/CN106536597A/zh active Pending
- 2015-06-30 EP EP15815907.9A patent/EP3162838A4/en not_active Withdrawn
- 2015-06-30 US US15/322,957 patent/US10538665B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070003773A1 (en) * | 2005-06-29 | 2007-01-04 | Kenji Uhara | Multi-layer polyimide films and flexible circuit substrates therefrom |
| CN101327409A (zh) * | 2008-08-01 | 2008-12-24 | 天津大学 | 聚酰亚胺渗透汽化膜及制备方法及用途 |
| US20130046057A1 (en) | 2010-04-12 | 2013-02-21 | National University Of Singapore | Polyimide membranes and their preparation |
Also Published As
| Publication number | Publication date |
|---|---|
| US20170233575A1 (en) | 2017-08-17 |
| KR20160002386A (ko) | 2016-01-07 |
| TW201602168A (zh) | 2016-01-16 |
| EP3162838A1 (en) | 2017-05-03 |
| EP3162838A4 (en) | 2018-04-25 |
| US10538665B2 (en) | 2020-01-21 |
| JP2017519884A (ja) | 2017-07-20 |
| JP6715406B2 (ja) | 2020-07-01 |
| TWI535760B (zh) | 2016-06-01 |
| CN106536597A (zh) | 2017-03-22 |
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