KR102245859B1 - 지지체 분리 장치, 및 지지체 분리 방법 - Google Patents

지지체 분리 장치, 및 지지체 분리 방법 Download PDF

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Publication number
KR102245859B1
KR102245859B1 KR1020170069122A KR20170069122A KR102245859B1 KR 102245859 B1 KR102245859 B1 KR 102245859B1 KR 1020170069122 A KR1020170069122 A KR 1020170069122A KR 20170069122 A KR20170069122 A KR 20170069122A KR 102245859 B1 KR102245859 B1 KR 102245859B1
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KR
South Korea
Prior art keywords
support
laminate
light
holding
panel
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KR1020170069122A
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English (en)
Korean (ko)
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KR20180002499A (ko
Inventor
신고 이시다
Original Assignee
도오꾜오까고오교 가부시끼가이샤
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Publication of KR20180002499A publication Critical patent/KR20180002499A/ko
Application granted granted Critical
Publication of KR102245859B1 publication Critical patent/KR102245859B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laser Beam Processing (AREA)
KR1020170069122A 2016-06-29 2017-06-02 지지체 분리 장치, 및 지지체 분리 방법 KR102245859B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-129427 2016-06-29
JP2016129427A JP6622661B2 (ja) 2016-06-29 2016-06-29 支持体分離装置、及び支持体分離方法

Publications (2)

Publication Number Publication Date
KR20180002499A KR20180002499A (ko) 2018-01-08
KR102245859B1 true KR102245859B1 (ko) 2021-04-28

Family

ID=60946469

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170069122A KR102245859B1 (ko) 2016-06-29 2017-06-02 지지체 분리 장치, 및 지지체 분리 방법

Country Status (3)

Country Link
JP (1) JP6622661B2 (zh)
KR (1) KR102245859B1 (zh)
TW (1) TWI703670B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019220666A1 (ja) 2018-05-17 2019-11-21 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法
TWI799120B (zh) * 2020-11-13 2023-04-11 天虹科技股份有限公司 晶片預清潔機台
TWI747611B (zh) * 2020-11-13 2021-11-21 天虹科技股份有限公司 晶片預清潔機台
TWI761270B (zh) * 2020-11-13 2022-04-11 天虹科技股份有限公司 晶片預清潔機台

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067982A (ja) 2012-09-27 2014-04-17 Disco Abrasive Syst Ltd ウェーハの加工方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05136248A (ja) * 1991-11-15 1993-06-01 Hitachi Ltd 粘着テープの粘着力制御方法および装置
JPH05190414A (ja) 1992-01-17 1993-07-30 Nikon Corp 基板吸着装置
JP2003025174A (ja) 2001-07-11 2003-01-29 Nec Yamagata Ltd 基板吸着方法および基板吸着機構
JP5472616B2 (ja) * 2010-01-27 2014-04-16 ウシオ電機株式会社 光照射装置
KR101160158B1 (ko) * 2010-05-28 2012-06-27 주식회사 엘티에스 레이저 리프트 오프 공정의 기판 분리장치
JP5926700B2 (ja) 2013-04-30 2016-05-25 東京応化工業株式会社 支持体分離装置及び支持体分離方法
JP6298393B2 (ja) * 2014-10-30 2018-03-20 東京応化工業株式会社 支持体分離方法
JP6418932B2 (ja) * 2014-12-15 2018-11-07 東京応化工業株式会社 紫外線照射装置、紫外線照射方法、基板処理装置、及び基板処理装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014067982A (ja) 2012-09-27 2014-04-17 Disco Abrasive Syst Ltd ウェーハの加工方法

Also Published As

Publication number Publication date
KR20180002499A (ko) 2018-01-08
JP2018006488A (ja) 2018-01-11
TWI703670B (zh) 2020-09-01
JP6622661B2 (ja) 2019-12-18
TW201804563A (zh) 2018-02-01

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