KR102241071B1 - 양두 평면 연삭법 - Google Patents

양두 평면 연삭법 Download PDF

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Publication number
KR102241071B1
KR102241071B1 KR1020150026513A KR20150026513A KR102241071B1 KR 102241071 B1 KR102241071 B1 KR 102241071B1 KR 1020150026513 A KR1020150026513 A KR 1020150026513A KR 20150026513 A KR20150026513 A KR 20150026513A KR 102241071 B1 KR102241071 B1 KR 102241071B1
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KR
South Korea
Prior art keywords
work
positive pressure
pressure pad
workpiece
static pressure
Prior art date
Application number
KR1020150026513A
Other languages
English (en)
Korean (ko)
Other versions
KR20150101421A (ko
Inventor
아츠시 시바나카
Original Assignee
고요 기카이 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고요 기카이 고교 가부시키가이샤 filed Critical 고요 기카이 고교 가부시키가이샤
Publication of KR20150101421A publication Critical patent/KR20150101421A/ko
Application granted granted Critical
Publication of KR102241071B1 publication Critical patent/KR102241071B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/03—Manufacturing methods
    • H01L2224/036—Manufacturing methods by patterning a pre-deposited material
    • H01L2224/03602—Mechanical treatment, e.g. polishing, grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
KR1020150026513A 2014-02-26 2015-02-25 양두 평면 연삭법 KR102241071B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014034825A JP6250435B2 (ja) 2014-02-26 2014-02-26 両頭平面研削法
JPJP-P-2014-034825 2014-02-26

Publications (2)

Publication Number Publication Date
KR20150101421A KR20150101421A (ko) 2015-09-03
KR102241071B1 true KR102241071B1 (ko) 2021-04-16

Family

ID=53905124

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150026513A KR102241071B1 (ko) 2014-02-26 2015-02-25 양두 평면 연삭법

Country Status (4)

Country Link
JP (1) JP6250435B2 (zh)
KR (1) KR102241071B1 (zh)
CN (1) CN104858736B (zh)
TW (1) TWI641449B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5969720B1 (ja) 2016-02-17 2016-08-17 日本精工株式会社 研削装置
CN106271980B (zh) * 2016-08-01 2018-10-26 湘潭大学 一种高静液压磨削设备及磨削方法
JP6814009B2 (ja) * 2016-10-04 2021-01-13 株式会社ディスコ 搬送パッド及びウエーハの搬送方法
CN109227667B (zh) * 2018-08-30 2020-12-29 重庆水利电力职业技术学院 装饰板施工用切割打磨装置
CN109352445B (zh) * 2018-12-05 2019-11-12 江苏博克斯科技股份有限公司 一种用于电子产品内部板件的打磨装置及其工作方法
CN110509134B (zh) * 2019-09-12 2021-04-09 西安奕斯伟硅片技术有限公司 一种晶圆研磨装置
CN114274041B (zh) * 2021-12-24 2023-03-14 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN114770366B (zh) * 2022-05-17 2023-11-17 西安奕斯伟材料科技股份有限公司 一种硅片双面研磨装置的静压板及硅片双面研磨装置
CN115256081A (zh) * 2022-10-08 2022-11-01 徐州晨晓精密机械制造有限公司 一种五金件打磨装置
CN116160356B (zh) * 2023-04-18 2023-08-22 西安奕斯伟材料科技股份有限公司 静压支撑件、双面研磨装置和双面研磨方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064073A (ja) * 2001-06-12 2002-02-28 Komatsu Electronic Metals Co Ltd 半導体ウェーハ剥し装置および半導体ウェーハの製造方法
JP2006114640A (ja) * 2004-10-14 2006-04-27 Lintec Corp 非接触型吸着保持装置
JP2013201196A (ja) * 2012-03-23 2013-10-03 Tokyo Electron Ltd 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2013215813A (ja) * 2012-04-05 2013-10-24 Koyo Mach Ind Co Ltd 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004005702A1 (de) * 2004-02-05 2005-09-01 Siltronic Ag Halbleiterscheibe, Vorrichtung und Verfahren zur Herstellung der Halbleiterscheibe
JP4752475B2 (ja) * 2005-12-08 2011-08-17 信越半導体株式会社 半導体ウェーハの両頭研削装置、静圧パッドおよびこれを用いた両頭研削方法
JP3136316U (ja) * 2007-07-03 2007-10-25 博 明石 ディスク非接触脱着器
JP4985451B2 (ja) * 2008-02-14 2012-07-25 信越半導体株式会社 ワークの両頭研削装置およびワークの両頭研削方法
JP5463570B2 (ja) * 2008-10-31 2014-04-09 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 ウェハ用両頭研削装置および両頭研削方法
JP5437680B2 (ja) * 2009-03-30 2014-03-12 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハの両面研削装置及び両面研削方法
JP5820329B2 (ja) * 2012-04-24 2015-11-24 光洋機械工業株式会社 両頭平面研削法及び両頭平面研削盤

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064073A (ja) * 2001-06-12 2002-02-28 Komatsu Electronic Metals Co Ltd 半導体ウェーハ剥し装置および半導体ウェーハの製造方法
JP2006114640A (ja) * 2004-10-14 2006-04-27 Lintec Corp 非接触型吸着保持装置
JP2013201196A (ja) * 2012-03-23 2013-10-03 Tokyo Electron Ltd 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2013215813A (ja) * 2012-04-05 2013-10-24 Koyo Mach Ind Co Ltd 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤

Also Published As

Publication number Publication date
TW201544246A (zh) 2015-12-01
CN104858736B (zh) 2019-04-23
CN104858736A (zh) 2015-08-26
TWI641449B (zh) 2018-11-21
KR20150101421A (ko) 2015-09-03
JP6250435B2 (ja) 2017-12-20
JP2015160250A (ja) 2015-09-07

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