KR102233439B1 - 웨이퍼 가공용 테이프 - Google Patents

웨이퍼 가공용 테이프 Download PDF

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Publication number
KR102233439B1
KR102233439B1 KR1020187021158A KR20187021158A KR102233439B1 KR 102233439 B1 KR102233439 B1 KR 102233439B1 KR 1020187021158 A KR1020187021158 A KR 1020187021158A KR 20187021158 A KR20187021158 A KR 20187021158A KR 102233439 B1 KR102233439 B1 KR 102233439B1
Authority
KR
South Korea
Prior art keywords
wafer processing
film
support member
release film
processing tape
Prior art date
Application number
KR1020187021158A
Other languages
English (en)
Korean (ko)
Other versions
KR20180121487A (ko
Inventor
사또시 오따
아끼라 아꾸쯔
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20180121487A publication Critical patent/KR20180121487A/ko
Application granted granted Critical
Publication of KR102233439B1 publication Critical patent/KR102233439B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020187021158A 2016-03-02 2017-02-23 웨이퍼 가공용 테이프 KR102233439B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016040085 2016-03-02
JPJP-P-2016-040085 2016-03-02
PCT/JP2017/006810 WO2017150330A1 (ja) 2016-03-02 2017-02-23 ウエハ加工用テープ

Publications (2)

Publication Number Publication Date
KR20180121487A KR20180121487A (ko) 2018-11-07
KR102233439B1 true KR102233439B1 (ko) 2021-03-30

Family

ID=59742878

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187021158A KR102233439B1 (ko) 2016-03-02 2017-02-23 웨이퍼 가공용 테이프

Country Status (6)

Country Link
JP (1) JP6831831B2 (zh)
KR (1) KR102233439B1 (zh)
CN (1) CN108541338A (zh)
SG (1) SG11201804308YA (zh)
TW (1) TW201739870A (zh)
WO (1) WO2017150330A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7400263B2 (ja) * 2018-08-23 2023-12-19 東レ株式会社 フィルム、及びフィルムの製造方法
KR102332928B1 (ko) * 2019-08-07 2021-12-01 주식회사 아이센스 연속 혈당 측정 장치용 신체 부착 유닛의 보조 접착 패치
JP2021061325A (ja) * 2019-10-07 2021-04-15 倉敷紡績株式会社 ダイシングシートおよびダイシングシート用基材フィルム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013006929A (ja) 2011-06-23 2013-01-10 Hitachi Chemical Co Ltd 接着シート、接着シートの製造方法、接着シートロール、半導体装置の製造方法、及び半導体装置
JP2013165168A (ja) 2012-02-10 2013-08-22 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2014063802A (ja) * 2012-09-20 2014-04-10 Lintec Corp レーザーダイシングシート−剥離シート積層体、レーザーダイシングシートおよびチップ体の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002256239A (ja) * 2001-03-05 2002-09-11 Hitachi Chem Co Ltd 接着フィルム、それを用いた半導体装置の製造方法及び半導体装置
JP4876451B2 (ja) * 2005-06-27 2012-02-15 日立化成工業株式会社 接着シート
JP4762671B2 (ja) * 2005-10-26 2011-08-31 古河電気工業株式会社 ダイシングテープ、および半導体ウェハダイシング方法
EP2192611B9 (en) * 2007-09-14 2012-08-15 Furukawa Electric Co., Ltd. Wafer processing tape
JP4360653B2 (ja) * 2007-09-14 2009-11-11 古河電気工業株式会社 ウエハ加工用テープ
JP5090241B2 (ja) * 2008-04-17 2012-12-05 リンテック株式会社 ダイソート用シート
JP5391158B2 (ja) * 2010-06-30 2014-01-15 古河電気工業株式会社 ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法
WO2014046121A1 (ja) * 2012-09-20 2014-03-27 リンテック株式会社 レーザーダイシングシート－剥離シート積層体、レーザーダイシングシートおよびチップ体の製造方法
JP2014214157A (ja) * 2013-04-22 2014-11-17 日東電工株式会社 エネルギー線硬化型自発巻回性粘着テープ
SG11201609543VA (en) * 2014-05-23 2016-12-29 Lintec Corp Composite sheet for forming protective film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013006929A (ja) 2011-06-23 2013-01-10 Hitachi Chemical Co Ltd 接着シート、接着シートの製造方法、接着シートロール、半導体装置の製造方法、及び半導体装置
JP2013165168A (ja) 2012-02-10 2013-08-22 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2014063802A (ja) * 2012-09-20 2014-04-10 Lintec Corp レーザーダイシングシート−剥離シート積層体、レーザーダイシングシートおよびチップ体の製造方法

Also Published As

Publication number Publication date
JPWO2017150330A1 (ja) 2018-12-27
JP6831831B2 (ja) 2021-02-17
WO2017150330A1 (ja) 2017-09-08
CN108541338A (zh) 2018-09-14
TW201739870A (zh) 2017-11-16
KR20180121487A (ko) 2018-11-07
SG11201804308YA (en) 2018-06-28

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