KR102226229B1 - 유도 자기 조립 분야를 위한 규소 함유 블록 공중합체 - Google Patents

유도 자기 조립 분야를 위한 규소 함유 블록 공중합체 Download PDF

Info

Publication number
KR102226229B1
KR102226229B1 KR1020177014791A KR20177014791A KR102226229B1 KR 102226229 B1 KR102226229 B1 KR 102226229B1 KR 1020177014791 A KR1020177014791 A KR 1020177014791A KR 20177014791 A KR20177014791 A KR 20177014791A KR 102226229 B1 KR102226229 B1 KR 102226229B1
Authority
KR
South Korea
Prior art keywords
alkyl
block copolymer
hydrogen
repeating unit
self
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020177014791A
Other languages
English (en)
Korean (ko)
Other versions
KR20170081206A (ko
Inventor
헹펭 우
지안 인
관양 린
지훈 김
마가렛타 파우네스쿠
Original Assignee
리지필드 액퀴지션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 리지필드 액퀴지션 filed Critical 리지필드 액퀴지션
Publication of KR20170081206A publication Critical patent/KR20170081206A/ko
Application granted granted Critical
Publication of KR102226229B1 publication Critical patent/KR102226229B1/ko
Assigned to 메르크 파텐트 게엠베하 reassignment 메르크 파텐트 게엠베하 권리의 전부이전등록 Assignors: 에이제트 일렉트로닉 머터리얼스 게엠베하
Assigned to 에이제트 일렉트로닉 머터리얼스 게엠베하 reassignment 에이제트 일렉트로닉 머터리얼스 게엠베하 권리의 전부이전등록 Assignors: 리지필드 액퀴지션
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/42—Introducing metal atoms or metal-containing groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0209—Multistage baking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B05D3/141—Plasma treatment
    • B05D3/145—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F293/00—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule
    • C08F293/005—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule using free radical "living" or "controlled" polymerisation, e.g. using a complexing agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
    • C08F297/02—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/022—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations
    • C08F299/024—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polycondensates with side or terminal unsaturations the unsaturation being in acrylic or methacrylic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/04—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/005—Modified block copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D153/00—Coating compositions based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32366—Localised processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Graft Or Block Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
KR1020177014791A 2014-10-30 2015-10-28 유도 자기 조립 분야를 위한 규소 함유 블록 공중합체 Expired - Fee Related KR102226229B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/527,939 2014-10-30
US14/527,939 US9505945B2 (en) 2014-10-30 2014-10-30 Silicon containing block copolymers for direct self-assembly application
PCT/EP2015/074980 WO2016066684A1 (en) 2014-10-30 2015-10-28 Silicon containing block copolymers for direct self-assembly application

Publications (2)

Publication Number Publication Date
KR20170081206A KR20170081206A (ko) 2017-07-11
KR102226229B1 true KR102226229B1 (ko) 2021-03-10

Family

ID=54541022

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177014791A Expired - Fee Related KR102226229B1 (ko) 2014-10-30 2015-10-28 유도 자기 조립 분야를 위한 규소 함유 블록 공중합체

Country Status (9)

Country Link
US (1) US9505945B2 (https=)
EP (1) EP3212714B1 (https=)
JP (2) JP6782695B2 (https=)
KR (1) KR102226229B1 (https=)
CN (1) CN107075057B (https=)
IL (1) IL250995A0 (https=)
SG (1) SG11201701937RA (https=)
TW (1) TWI677526B (https=)
WO (1) WO2016066684A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9738765B2 (en) * 2015-02-19 2017-08-22 International Business Machines Corporation Hybrid topographical and chemical pre-patterns for directed self-assembly of block copolymers
US11155666B2 (en) * 2016-11-30 2021-10-26 Lg Chem, Ltd. Block copolymer
KR102096272B1 (ko) * 2016-11-30 2020-04-02 주식회사 엘지화학 블록 공중합체
JP6835969B2 (ja) 2016-12-21 2021-02-24 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ Ｇｅｓｅｌｌｓｃｈａｆｔ ｍｉｔ ｂｅｓｃｈｒａｅｎｋｔｅｒ Ｈａｆｔｕｎｇ ブロックコポリマーの自己組織化のための新規組成物及び方法
JP7076701B2 (ja) * 2018-03-05 2022-05-30 東京応化工業株式会社 ブロック共重合体及びその製造方法、ならびに相分離構造を含む構造体の製造方法
FR3089982A1 (fr) * 2018-12-12 2020-06-19 Arkema France Procédé de fabrication d’un copolymère à blocs contenant du silicium
US20240219829A1 (en) 2021-05-18 2024-07-04 Merck Patent Gmbh Hydrophobic crosslinkable pinning underlayers with improved dry etch capabilities for patterning directed self-assembly of ps-b-pmma type block copolymers

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040006191A1 (en) 2002-07-02 2004-01-08 Takanobu Takeda Silicon-containing polymer, resist composition and patterning process
US20130078576A1 (en) 2011-09-23 2013-03-28 Az Electronic Materials Usa Corp. Compositions of neutral layer for directed self assembly block copolymers and processes thereof
US20130209693A1 (en) 2012-02-10 2013-08-15 Rohm And Haas Electronic Materials Llc Block copolymer and methods relating thereto
JP2014152332A (ja) 2013-02-08 2014-08-25 Rohm & Haas Electronic Materials Llc 誘導自己組織化共重合組成物および関連方法
JP2014174428A (ja) 2013-03-12 2014-09-22 Shin Etsu Chem Co Ltd 珪素含有下層膜材料及びパターン形成方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3884188T2 (de) * 1987-05-21 1994-03-03 Hughes Aircraft Co Silikon enthaltenes negatives photoresistmaterial und dessen verwendung zum herstellen von gemusterten oberflächen.
US5985524A (en) * 1997-03-28 1999-11-16 International Business Machines Incorporated Process for using bilayer photoresist
US6210856B1 (en) * 1999-01-27 2001-04-03 International Business Machines Corporation Resist composition and process of forming a patterned resist layer on a substrate
JP3963623B2 (ja) * 1999-12-09 2007-08-22 富士フイルム株式会社 ポジ型フォトレジスト組成物
JP3858968B2 (ja) * 2000-01-06 2006-12-20 信越化学工業株式会社 トリス（トリメチルシリル）シリルエチルエステルの製造方法
TW583187B (en) * 2000-01-06 2004-04-11 Shinetsu Chemical Co Preparation of tris(trimethylsilyl) silylethyl esters
US6444408B1 (en) * 2000-02-28 2002-09-03 International Business Machines Corporation High silicon content monomers and polymers suitable for 193 nm bilayer resists
JP3781960B2 (ja) 2000-09-29 2006-06-07 信越化学工業株式会社 反射防止膜材料およびパターン形成方法
JP4040392B2 (ja) 2002-08-22 2008-01-30 富士フイルム株式会社 ポジ型フォトレジスト組成物
US8696918B2 (en) 2010-05-05 2014-04-15 Micron Technology, Inc. Methods of utilizing block copolymer to form patterns
US8710150B2 (en) 2012-02-10 2014-04-29 Rohm And Haas Electronic Materials Llc Blended block copolymer composition
US8961918B2 (en) 2012-02-10 2015-02-24 Rohm And Haas Electronic Materials Llc Thermal annealing process
JP5745439B2 (ja) * 2012-02-17 2015-07-08 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、並びに、これを用いたパターン形成方法、レジスト膜及び電子デバイスの製造方法
JP6070964B2 (ja) * 2012-03-27 2017-02-01 日産化学工業株式会社 自己組織化膜の下層膜形成組成物
WO2014003023A1 (ja) * 2012-06-29 2014-01-03 Jsr株式会社 パターン形成用組成物及びパターン形成方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040006191A1 (en) 2002-07-02 2004-01-08 Takanobu Takeda Silicon-containing polymer, resist composition and patterning process
US20130078576A1 (en) 2011-09-23 2013-03-28 Az Electronic Materials Usa Corp. Compositions of neutral layer for directed self assembly block copolymers and processes thereof
US20130209693A1 (en) 2012-02-10 2013-08-15 Rohm And Haas Electronic Materials Llc Block copolymer and methods relating thereto
JP2014152332A (ja) 2013-02-08 2014-08-25 Rohm & Haas Electronic Materials Llc 誘導自己組織化共重合組成物および関連方法
JP2014174428A (ja) 2013-03-12 2014-09-22 Shin Etsu Chem Co Ltd 珪素含有下層膜材料及びパターン形成方法

Also Published As

Publication number Publication date
EP3212714B1 (en) 2019-03-06
JP6782695B2 (ja) 2020-11-11
TWI677526B (zh) 2019-11-21
TW201619278A (zh) 2016-06-01
CN107075057B (zh) 2019-02-15
IL250995A0 (en) 2017-04-30
JP2018502936A (ja) 2018-02-01
CN107075057A (zh) 2017-08-18
EP3212714A1 (en) 2017-09-06
WO2016066684A1 (en) 2016-05-06
US20160122579A1 (en) 2016-05-05
JP6810782B2 (ja) 2021-01-06
SG11201701937RA (en) 2017-04-27
US9505945B2 (en) 2016-11-29
JP2020033566A (ja) 2020-03-05
KR20170081206A (ko) 2017-07-11

Similar Documents

Publication Publication Date Title
KR102226229B1 (ko) 유도 자기 조립 분야를 위한 규소 함유 블록 공중합체
KR102398438B1 (ko) 블록 공중합체의 자기 조립을 위한 조성물 및 방법
KR101829955B1 (ko) 블록 공중합체의 유도 자기조립을 위한 중성층의 조성물 및 이의 방법
JP2018503241A (ja) 誘導自己集合体パターン化のための欠陥低減方法および組成物
KR102409830B1 (ko) 자가-조립 적용을 위한 중합체 조성물
JP7835780B2 (ja) Ｐｓ－ｂ－ｐｍｍａタイプブロックコポリマーの誘導自己集合体をパターン化するための改善されたドライエッチング能を有する疎水性の架橋可能ピン止め下層
KR102267528B1 (ko) 블록 공중합체의 자기-조립을 위한 신규한 조성물 및 방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

A201 Request for examination
A302 Request for accelerated examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20250305

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

H13 Ip right lapsed

Free format text: ST27 STATUS EVENT CODE: N-4-6-H10-H13-OTH-PC1903 (AS PROVIDED BY THE NATIONAL OFFICE); TERMINATION CATEGORY : DEFAULT_OF_REGISTRATION_FEE

Effective date: 20250305

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20250305