KR102221567B1 - 주석 또는 주석 합금 도금액 - Google Patents

주석 또는 주석 합금 도금액 Download PDF

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Publication number
KR102221567B1
KR102221567B1 KR1020207011533A KR20207011533A KR102221567B1 KR 102221567 B1 KR102221567 B1 KR 102221567B1 KR 1020207011533 A KR1020207011533 A KR 1020207011533A KR 20207011533 A KR20207011533 A KR 20207011533A KR 102221567 B1 KR102221567 B1 KR 102221567B1
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KR
South Korea
Prior art keywords
tin
acid
surfactant
bump
salt
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KR1020207011533A
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English (en)
Korean (ko)
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KR20200047736A (ko
Inventor
마미 와타나베
교카 스스키
기요타카 나카야
Original Assignee
미쓰비시 마테리알 가부시키가이샤
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Priority claimed from PCT/JP2018/039333 external-priority patent/WO2019082885A1/ja
Publication of KR20200047736A publication Critical patent/KR20200047736A/ko
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Publication of KR102221567B1 publication Critical patent/KR102221567B1/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1020207011533A 2017-10-24 2018-10-23 주석 또는 주석 합금 도금액 Active KR102221567B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2017-205201 2017-10-24
JP2017205201 2017-10-24
JP2018197081A JP6620858B2 (ja) 2017-10-24 2018-10-19 錫又は錫合金めっき堆積層の形成方法
JPJP-P-2018-197081 2018-10-19
PCT/JP2018/039333 WO2019082885A1 (ja) 2017-10-24 2018-10-23 錫又は錫合金めっき液

Publications (2)

Publication Number Publication Date
KR20200047736A KR20200047736A (ko) 2020-05-07
KR102221567B1 true KR102221567B1 (ko) 2021-02-26

Family

ID=66627438

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207011533A Active KR102221567B1 (ko) 2017-10-24 2018-10-23 주석 또는 주석 합금 도금액

Country Status (5)

Country Link
EP (1) EP3715508A4 (https=)
JP (1) JP6620858B2 (https=)
KR (1) KR102221567B1 (https=)
CN (1) CN111356789B (https=)
TW (1) TWI707066B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100442607B1 (ko) * 1999-02-04 2004-08-02 삼성전자주식회사 이동통신시스템의 채널확산 장치 및 방법
KR100590364B1 (ko) * 2001-06-21 2006-06-15 엘지전자 주식회사 이동통신 시스템에서의 왈시코드 채널 관리 및 할당 방법
JP7276049B2 (ja) * 2019-09-27 2023-05-18 三菱マテリアル株式会社 めっき方法
CN112663092A (zh) * 2020-12-10 2021-04-16 广东臻鼎环境科技有限公司 一种甲基磺酸型剥锡废液的处理方法
WO2022129238A1 (en) * 2020-12-18 2022-06-23 Basf Se Composition for tin or tin alloy electroplating comprising leveling agent
JP2025139964A (ja) * 2024-03-13 2025-09-29 三菱マテリアル株式会社 めっき液用微粒化剤補給液、および、錫系めっき材の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005290505A (ja) * 2004-04-02 2005-10-20 Mitsubishi Materials Corp 鉛−スズ合金ハンダめっき液
JP2017031447A (ja) * 2015-07-29 2017-02-09 石原ケミカル株式会社 電気スズ及びスズ合金メッキ浴、当該メッキ浴を用いた電着物の形成方法並びに当該方法で製造した電子部品

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5651873A (en) * 1994-06-30 1997-07-29 Mitsubishi Materials Corporation Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface
JP3334421B2 (ja) * 1994-06-30 2002-10-15 三菱マテリアル株式会社 半導体ウエハ表面へのＰｂ−Ｓｎ合金突起電極形成用電気メッキ液
JP4359907B2 (ja) * 1999-08-11 2009-11-11 石原薬品株式会社 スズ−銅合金メッキ浴
JP4812365B2 (ja) * 2005-08-19 2011-11-09 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 錫電気めっき液および錫電気めっき方法
JP2008028336A (ja) * 2006-07-25 2008-02-07 Shinko Electric Ind Co Ltd 電子部品の製造方法
JP5337352B2 (ja) * 2007-04-24 2013-11-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 錫または錫合金電気めっき液
JP5583894B2 (ja) * 2008-06-12 2014-09-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気錫めっき液および電気錫めっき方法
CN101705482A (zh) * 2009-11-19 2010-05-12 广州电器科学研究院 一种烷基磺酸化学镀锡液及基于该化学镀锡液的镀锡工艺
JP6133056B2 (ja) 2012-12-27 2017-05-24 ローム・アンド・ハース電子材料株式会社 スズまたはスズ合金めっき液
JP6006683B2 (ja) 2013-06-26 2016-10-12 株式会社Ｊｃｕ スズまたはスズ合金用電気メッキ液およびその用途
JP2015193916A (ja) * 2014-03-18 2015-11-05 上村工業株式会社 錫または錫合金の電気めっき浴、およびバンプの製造方法
JP6442722B2 (ja) 2014-10-08 2018-12-26 石原ケミカル株式会社 電気メッキ式の突起電極形成方法
JP6834070B2 (ja) * 2016-06-13 2021-02-24 石原ケミカル株式会社 電気スズ及びスズ合金メッキ浴、当該メッキ浴を用いて電着物を形成した電子部品の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005290505A (ja) * 2004-04-02 2005-10-20 Mitsubishi Materials Corp 鉛−スズ合金ハンダめっき液
JP2017031447A (ja) * 2015-07-29 2017-02-09 石原ケミカル株式会社 電気スズ及びスズ合金メッキ浴、当該メッキ浴を用いた電着物の形成方法並びに当該方法で製造した電子部品

Also Published As

Publication number Publication date
EP3715508A4 (en) 2021-10-27
KR20200047736A (ko) 2020-05-07
CN111356789A (zh) 2020-06-30
JP6620858B2 (ja) 2019-12-18
EP3715508A1 (en) 2020-09-30
TWI707066B (zh) 2020-10-11
TW201925538A (zh) 2019-07-01
JP2019077948A (ja) 2019-05-23
CN111356789B (zh) 2021-04-16

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