TWI707066B - 錫或錫合金鍍敷堆積層之形成方法 - Google Patents

錫或錫合金鍍敷堆積層之形成方法 Download PDF

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Publication number
TWI707066B
TWI707066B TW107137360A TW107137360A TWI707066B TW I707066 B TWI707066 B TW I707066B TW 107137360 A TW107137360 A TW 107137360A TW 107137360 A TW107137360 A TW 107137360A TW I707066 B TWI707066 B TW I707066B
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TW
Taiwan
Prior art keywords
tin
acid
salt
leveling agent
plating
Prior art date
Application number
TW107137360A
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English (en)
Chinese (zh)
Other versions
TW201925538A (zh
Inventor
渡邉眞美
薄京佳
中矢清
Original Assignee
日商三菱綜合材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商三菱綜合材料股份有限公司 filed Critical 日商三菱綜合材料股份有限公司
Publication of TW201925538A publication Critical patent/TW201925538A/zh
Application granted granted Critical
Publication of TWI707066B publication Critical patent/TWI707066B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW107137360A 2017-10-24 2018-10-23 錫或錫合金鍍敷堆積層之形成方法 TWI707066B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-205201 2017-10-24
JP2017205201 2017-10-24
JP2018-197081 2018-10-19
JP2018197081A JP6620858B2 (ja) 2017-10-24 2018-10-19 錫又は錫合金めっき堆積層の形成方法

Publications (2)

Publication Number Publication Date
TW201925538A TW201925538A (zh) 2019-07-01
TWI707066B true TWI707066B (zh) 2020-10-11

Family

ID=66627438

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107137360A TWI707066B (zh) 2017-10-24 2018-10-23 錫或錫合金鍍敷堆積層之形成方法

Country Status (5)

Country Link
EP (1) EP3715508A4 (https=)
JP (1) JP6620858B2 (https=)
KR (1) KR102221567B1 (https=)
CN (1) CN111356789B (https=)
TW (1) TWI707066B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100442607B1 (ko) * 1999-02-04 2004-08-02 삼성전자주식회사 이동통신시스템의 채널확산 장치 및 방법
KR100590364B1 (ko) * 2001-06-21 2006-06-15 엘지전자 주식회사 이동통신 시스템에서의 왈시코드 채널 관리 및 할당 방법
JP7276049B2 (ja) * 2019-09-27 2023-05-18 三菱マテリアル株式会社 めっき方法
CN112663092A (zh) * 2020-12-10 2021-04-16 广东臻鼎环境科技有限公司 一种甲基磺酸型剥锡废液的处理方法
WO2022129238A1 (en) * 2020-12-18 2022-06-23 Basf Se Composition for tin or tin alloy electroplating comprising leveling agent
JP2025139964A (ja) * 2024-03-13 2025-09-29 三菱マテリアル株式会社 めっき液用微粒化剤補給液、および、錫系めっき材の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001049486A (ja) * 1999-08-11 2001-02-20 Ishihara Chem Co Ltd スズ−銅合金メッキ浴
JP2005290505A (ja) * 2004-04-02 2005-10-20 Mitsubishi Materials Corp 鉛−スズ合金ハンダめっき液
TW201542886A (zh) * 2014-03-18 2015-11-16 上村工業股份有限公司 錫或錫合金之電鍍浴及凸塊之製造方法
TW201816194A (zh) * 2016-06-13 2018-05-01 石原化學股份有限公司 錫和錫合金電鍍浴、使用該電鍍浴形成電沉積物的電子元件

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US5651873A (en) * 1994-06-30 1997-07-29 Mitsubishi Materials Corporation Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface
JP3334421B2 (ja) * 1994-06-30 2002-10-15 三菱マテリアル株式会社 半導体ウエハ表面へのＰｂ−Ｓｎ合金突起電極形成用電気メッキ液
JP4812365B2 (ja) * 2005-08-19 2011-11-09 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 錫電気めっき液および錫電気めっき方法
JP2008028336A (ja) * 2006-07-25 2008-02-07 Shinko Electric Ind Co Ltd 電子部品の製造方法
JP5337352B2 (ja) * 2007-04-24 2013-11-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 錫または錫合金電気めっき液
JP5583894B2 (ja) * 2008-06-12 2014-09-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気錫めっき液および電気錫めっき方法
CN101705482A (zh) * 2009-11-19 2010-05-12 广州电器科学研究院 一种烷基磺酸化学镀锡液及基于该化学镀锡液的镀锡工艺
JP6133056B2 (ja) 2012-12-27 2017-05-24 ローム・アンド・ハース電子材料株式会社 スズまたはスズ合金めっき液
JP6006683B2 (ja) 2013-06-26 2016-10-12 株式会社Ｊｃｕ スズまたはスズ合金用電気メッキ液およびその用途
JP6442722B2 (ja) 2014-10-08 2018-12-26 石原ケミカル株式会社 電気メッキ式の突起電極形成方法
JP7009679B2 (ja) * 2015-07-29 2022-01-26 石原ケミカル株式会社 電気スズ及び電気スズ合金メッキ浴、当該メッキ浴を用いた電着物の形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001049486A (ja) * 1999-08-11 2001-02-20 Ishihara Chem Co Ltd スズ−銅合金メッキ浴
JP2005290505A (ja) * 2004-04-02 2005-10-20 Mitsubishi Materials Corp 鉛−スズ合金ハンダめっき液
TW201542886A (zh) * 2014-03-18 2015-11-16 上村工業股份有限公司 錫或錫合金之電鍍浴及凸塊之製造方法
TW201816194A (zh) * 2016-06-13 2018-05-01 石原化學股份有限公司 錫和錫合金電鍍浴、使用該電鍍浴形成電沉積物的電子元件

Also Published As

Publication number Publication date
KR102221567B1 (ko) 2021-02-26
EP3715508A4 (en) 2021-10-27
KR20200047736A (ko) 2020-05-07
CN111356789A (zh) 2020-06-30
JP6620858B2 (ja) 2019-12-18
EP3715508A1 (en) 2020-09-30
TW201925538A (zh) 2019-07-01
JP2019077948A (ja) 2019-05-23
CN111356789B (zh) 2021-04-16

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