KR102207123B1 - 에지 클램프 반송 기구 - Google Patents

에지 클램프 반송 기구 Download PDF

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Publication number
KR102207123B1
KR102207123B1 KR1020150103889A KR20150103889A KR102207123B1 KR 102207123 B1 KR102207123 B1 KR 102207123B1 KR 1020150103889 A KR1020150103889 A KR 1020150103889A KR 20150103889 A KR20150103889 A KR 20150103889A KR 102207123 B1 KR102207123 B1 KR 102207123B1
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KR
South Korea
Prior art keywords
disk
holding
holding claw
shaped
wafer
Prior art date
Application number
KR1020150103889A
Other languages
English (en)
Korean (ko)
Other versions
KR20160022244A (ko
Inventor
데츠오 구보
유지 고시오카
다이치 이토
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20160022244A publication Critical patent/KR20160022244A/ko
Application granted granted Critical
Publication of KR102207123B1 publication Critical patent/KR102207123B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Robotics (AREA)
KR1020150103889A 2014-08-19 2015-07-22 에지 클램프 반송 기구 KR102207123B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014166531A JP6294793B2 (ja) 2014-08-19 2014-08-19 エッジクランプ搬送機構
JPJP-P-2014-166531 2014-08-19

Publications (2)

Publication Number Publication Date
KR20160022244A KR20160022244A (ko) 2016-02-29
KR102207123B1 true KR102207123B1 (ko) 2021-01-22

Family

ID=55448442

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150103889A KR102207123B1 (ko) 2014-08-19 2015-07-22 에지 클램프 반송 기구

Country Status (2)

Country Link
JP (1) JP6294793B2 (ja)
KR (1) KR102207123B1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017017207A (ja) * 2015-07-02 2017-01-19 株式会社ディスコ ウェーハ保持装置
JP6810585B2 (ja) * 2016-11-30 2021-01-06 タツモ株式会社 チャック装置及び貼合装置
JP7148374B2 (ja) * 2018-11-20 2022-10-05 株式会社東京精密 ウエハ受け渡し装置
CN113013082B (zh) * 2021-03-01 2022-09-13 深圳市容微精密电子有限公司 一种晶圆检测的夹具机构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231679A (ja) 2001-01-31 2002-08-16 Hitachi Plant Eng & Constr Co Ltd 基板洗浄装置
JP2002313874A (ja) 2001-04-17 2002-10-25 Dainippon Screen Mfg Co Ltd 基板支持部材、ならびにそれを用いた基板保持機構、基板搬送装置、基板搬送方法、基板処理装置および基板処理方法
JP2007258450A (ja) 2006-03-23 2007-10-04 Disco Abrasive Syst Ltd ウエーハの保持機構

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4634950Y1 (ja) 1967-12-16 1971-12-02
JPS53111391A (en) 1978-03-06 1978-09-28 Mitsui Petrochem Ind Ltd Preparation of modified wax
JP3437250B2 (ja) * 1994-04-06 2003-08-18 Ｎｋｅ株式会社 把持装置
JP3604242B2 (ja) * 1996-11-19 2004-12-22 大日本スクリーン製造株式会社 基板保持機構
US6964419B2 (en) * 2003-04-02 2005-11-15 Taiwan Seminconductor Manufacturing Co., Ltd. Chuck rollers and pins for substrate cleaning and drying system
JP4663362B2 (ja) 2005-03-18 2011-04-06 株式会社ディスコ ウエーハの平坦加工方法
KR20080023863A (ko) * 2006-09-12 2008-03-17 세메스 주식회사 기판을 척킹하는 척킹부재 및 방법
JP5606471B2 (ja) * 2012-02-20 2014-10-15 株式会社東芝 基板回転保持装置および基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231679A (ja) 2001-01-31 2002-08-16 Hitachi Plant Eng & Constr Co Ltd 基板洗浄装置
JP2002313874A (ja) 2001-04-17 2002-10-25 Dainippon Screen Mfg Co Ltd 基板支持部材、ならびにそれを用いた基板保持機構、基板搬送装置、基板搬送方法、基板処理装置および基板処理方法
JP2007258450A (ja) 2006-03-23 2007-10-04 Disco Abrasive Syst Ltd ウエーハの保持機構

Also Published As

Publication number Publication date
JP6294793B2 (ja) 2018-03-14
KR20160022244A (ko) 2016-02-29
JP2016042556A (ja) 2016-03-31

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