KR102143005B1 - 인덕터 및 그 실장 기판 - Google Patents
인덕터 및 그 실장 기판 Download PDFInfo
- Publication number
- KR102143005B1 KR102143005B1 KR1020140096351A KR20140096351A KR102143005B1 KR 102143005 B1 KR102143005 B1 KR 102143005B1 KR 1020140096351 A KR1020140096351 A KR 1020140096351A KR 20140096351 A KR20140096351 A KR 20140096351A KR 102143005 B1 KR102143005 B1 KR 102143005B1
- Authority
- KR
- South Korea
- Prior art keywords
- magnetic body
- metal layer
- inductor
- internal coil
- disposed
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 73
- 239000002184 metal Substances 0.000 claims abstract description 73
- 239000000758 substrate Substances 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 229910000859 α-Fe Inorganic materials 0.000 description 9
- 238000004804 winding Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
- H01F2027/065—Mounting on printed circuit boards
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140096351A KR102143005B1 (ko) | 2014-07-29 | 2014-07-29 | 인덕터 및 그 실장 기판 |
JP2014216123A JP2016032093A (ja) | 2014-07-29 | 2014-10-23 | チップ電子部品及びその実装基板 |
JP2018191770A JP2019024113A (ja) | 2014-07-29 | 2018-10-10 | チップ電子部品及びその実装基板 |
KR1020200097239A KR102300016B1 (ko) | 2014-07-29 | 2020-08-04 | 인덕터 |
JP2020180972A JP2021013042A (ja) | 2014-07-29 | 2020-10-28 | チップ電子部品及びその実装基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140096351A KR102143005B1 (ko) | 2014-07-29 | 2014-07-29 | 인덕터 및 그 실장 기판 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020200097239A Division KR102300016B1 (ko) | 2014-07-29 | 2020-08-04 | 인덕터 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20160014302A KR20160014302A (ko) | 2016-02-11 |
KR102143005B1 true KR102143005B1 (ko) | 2020-08-11 |
Family
ID=55351535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020140096351A KR102143005B1 (ko) | 2014-07-29 | 2014-07-29 | 인덕터 및 그 실장 기판 |
Country Status (2)
Country | Link |
---|---|
JP (3) | JP2016032093A (ja) |
KR (1) | KR102143005B1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102143005B1 (ko) * | 2014-07-29 | 2020-08-11 | 삼성전기주식회사 | 인덕터 및 그 실장 기판 |
KR20180068149A (ko) * | 2016-12-13 | 2018-06-21 | 삼성전기주식회사 | 인덕터 |
KR101876878B1 (ko) * | 2017-03-16 | 2018-07-11 | 삼성전기주식회사 | 코일 부품 |
KR101973437B1 (ko) * | 2017-06-01 | 2019-09-02 | 삼성전기주식회사 | 코일 부품 |
US10847308B2 (en) | 2017-06-01 | 2020-11-24 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
KR102484848B1 (ko) * | 2017-09-20 | 2023-01-05 | 삼성전기주식회사 | 박막형 칩 전자부품 |
KR102463330B1 (ko) * | 2017-10-17 | 2022-11-04 | 삼성전기주식회사 | 코일 전자 부품 |
JP7052380B2 (ja) * | 2018-01-29 | 2022-04-12 | Tdk株式会社 | コイル部品 |
KR102185057B1 (ko) * | 2018-07-04 | 2020-12-01 | 삼성전기주식회사 | 코일 부품 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003297646A (ja) * | 2002-04-03 | 2003-10-17 | Matsushita Electric Ind Co Ltd | チップ型電子部品 |
JP2006287063A (ja) * | 2005-04-01 | 2006-10-19 | Murata Mfg Co Ltd | 電子部品 |
JP2012248629A (ja) * | 2011-05-26 | 2012-12-13 | Tdk Corp | コイル部品及びその製造方法 |
JP2013219295A (ja) * | 2012-04-12 | 2013-10-24 | Panasonic Corp | コモンモードノイズフィルタ |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5896710A (ja) * | 1981-12-04 | 1983-06-08 | Tdk Corp | 積層インダクタ |
JPH036005A (ja) * | 1989-06-02 | 1991-01-11 | Tdk Corp | チップ部品端子の低温構成方法 |
JPH0629144A (ja) * | 1992-07-08 | 1994-02-04 | Tdk Corp | セラミック電子部品 |
JP3230932B2 (ja) * | 1994-08-12 | 2001-11-19 | 太陽誘電株式会社 | 積層型電子部品 |
JP3613004B2 (ja) * | 1998-05-26 | 2005-01-26 | 松下電器産業株式会社 | 積層セラミック電子部品 |
JP2002367833A (ja) * | 2001-06-13 | 2002-12-20 | Fdk Corp | 積層チップインダクタ |
JP2003037010A (ja) * | 2001-07-23 | 2003-02-07 | Matsushita Electric Ind Co Ltd | チップ積層型電子部品およびその製造方法 |
JP2006278479A (ja) | 2005-03-28 | 2006-10-12 | Tdk Corp | コイル部品 |
JP2007180428A (ja) * | 2005-12-28 | 2007-07-12 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
US7884695B2 (en) * | 2006-06-30 | 2011-02-08 | Intel Corporation | Low resistance inductors, methods of assembling same, and systems containing same |
JP5054445B2 (ja) * | 2007-06-26 | 2012-10-24 | スミダコーポレーション株式会社 | コイル部品 |
JP4961445B2 (ja) * | 2009-02-13 | 2012-06-27 | 東光株式会社 | モールドコイルの製造方法およびそのモールドコイル |
US20100277267A1 (en) * | 2009-05-04 | 2010-11-04 | Robert James Bogert | Magnetic components and methods of manufacturing the same |
JP5082002B1 (ja) * | 2011-08-26 | 2012-11-28 | 太陽誘電株式会社 | 磁性材料およびコイル部品 |
KR20130031581A (ko) * | 2011-09-21 | 2013-03-29 | 삼성전기주식회사 | 적층형 인덕터 |
JP2013212642A (ja) * | 2012-04-02 | 2013-10-17 | Panasonic Corp | 軟磁性材製造用部材、軟磁性材、銅張積層板、プリント配線板、及びインダクタ |
KR102143005B1 (ko) * | 2014-07-29 | 2020-08-11 | 삼성전기주식회사 | 인덕터 및 그 실장 기판 |
-
2014
- 2014-07-29 KR KR1020140096351A patent/KR102143005B1/ko active IP Right Grant
- 2014-10-23 JP JP2014216123A patent/JP2016032093A/ja active Pending
-
2018
- 2018-10-10 JP JP2018191770A patent/JP2019024113A/ja active Pending
-
2020
- 2020-10-28 JP JP2020180972A patent/JP2021013042A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003297646A (ja) * | 2002-04-03 | 2003-10-17 | Matsushita Electric Ind Co Ltd | チップ型電子部品 |
JP2006287063A (ja) * | 2005-04-01 | 2006-10-19 | Murata Mfg Co Ltd | 電子部品 |
JP2012248629A (ja) * | 2011-05-26 | 2012-12-13 | Tdk Corp | コイル部品及びその製造方法 |
JP2013219295A (ja) * | 2012-04-12 | 2013-10-24 | Panasonic Corp | コモンモードノイズフィルタ |
Also Published As
Publication number | Publication date |
---|---|
JP2021013042A (ja) | 2021-02-04 |
JP2016032093A (ja) | 2016-03-07 |
KR20160014302A (ko) | 2016-02-11 |
JP2019024113A (ja) | 2019-02-14 |
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