JP2021013042A - チップ電子部品及びその実装基板 - Google Patents
チップ電子部品及びその実装基板 Download PDFInfo
- Publication number
- JP2021013042A JP2021013042A JP2020180972A JP2020180972A JP2021013042A JP 2021013042 A JP2021013042 A JP 2021013042A JP 2020180972 A JP2020180972 A JP 2020180972A JP 2020180972 A JP2020180972 A JP 2020180972A JP 2021013042 A JP2021013042 A JP 2021013042A
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- JP
- Japan
- Prior art keywords
- magnetic body
- internal coil
- metal layer
- length direction
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 67
- 239000002184 metal Substances 0.000 claims abstract description 67
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims 2
- 238000004804 winding Methods 0.000 description 13
- 229910000859 α-Fe Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 239000000696 magnetic material Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
- H01F2027/065—Mounting on printed circuit boards
Abstract
Description
以下では、本発明の一実施形態によるチップ電子部品を説明するにあたり、特に、巻線型インダクタを例に挙げて説明するが、本発明はこれに制限されない。
以下では、本発明の一実施形態によるチップ電子部品の製造方法について説明する。
図8は図1のチップ電子部品が印刷回路基板に実装された形状を示した斜視図である。
10 磁性体本体
20 内部コイル
21、22 引出部
31、32 外部電極
41、42、41'、42' 金属層
200 実装基板
210 印刷回路基板
221、222 第1及び第2電極パッド
230 はんだ
Claims (7)
- 磁性体本体と、
前記磁性体本体の内部に配置された内部コイルと、
前記内部コイルと接続され、前記磁性体本体の少なくとも一面に露出した引出部と、
前記引出部のうち、前記磁性体本体から露出した領域と接続された金属層と、
前記金属層を覆う外部電極と、を含み、
前記金属層は、前記磁性体本体から前記引出部が露出した面全体を覆い、
前記金属層は、めっきによって形成されためっき層である、インダクタ。 - 前記金属層は、前記磁性体本体から前記引出部が露出した面以外の面では、前記磁性体本体を覆わない、請求項1に記載のインダクタ。
- 前記外部電極は、前記磁性体本体から前記引出部が露出した面以外の面で前記磁性体本体を覆う、請求項2に記載のインダクタ。
- 前記金属層は、銅(Cu)及びニッケル(Ni)のいずれか一つ以上を含む、請求項1に記載のインダクタ。
- 前記金属層の厚さは、0.5〜30μmである、請求項1に記載のインダクタ。
- 前記外部電極は、銀−エポキシ(Ag−Epoxy)及び銅−エポキシ(Cu−Epoxy)のいずれか一つ以上を含む、請求項1に記載のインダクタ。
- 前記引出部と前記金属層の接続面積は、前記内部コイルの直径をr1とすると、0.020×r1(mm2)以上である、請求項1に記載のインダクタ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2014-0096351 | 2014-07-29 | ||
KR1020140096351A KR102143005B1 (ko) | 2014-07-29 | 2014-07-29 | 인덕터 및 그 실장 기판 |
Related Parent Applications (1)
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---|---|---|---|
JP2018191770A Division JP2019024113A (ja) | 2014-07-29 | 2018-10-10 | チップ電子部品及びその実装基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2021013042A true JP2021013042A (ja) | 2021-02-04 |
Family
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Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014216123A Pending JP2016032093A (ja) | 2014-07-29 | 2014-10-23 | チップ電子部品及びその実装基板 |
JP2018191770A Pending JP2019024113A (ja) | 2014-07-29 | 2018-10-10 | チップ電子部品及びその実装基板 |
JP2020180972A Pending JP2021013042A (ja) | 2014-07-29 | 2020-10-28 | チップ電子部品及びその実装基板 |
Family Applications Before (2)
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JP2014216123A Pending JP2016032093A (ja) | 2014-07-29 | 2014-10-23 | チップ電子部品及びその実装基板 |
JP2018191770A Pending JP2019024113A (ja) | 2014-07-29 | 2018-10-10 | チップ電子部品及びその実装基板 |
Country Status (2)
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JP (3) | JP2016032093A (ja) |
KR (1) | KR102143005B1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102143005B1 (ko) * | 2014-07-29 | 2020-08-11 | 삼성전기주식회사 | 인덕터 및 그 실장 기판 |
KR20180068149A (ko) * | 2016-12-13 | 2018-06-21 | 삼성전기주식회사 | 인덕터 |
KR101876878B1 (ko) * | 2017-03-16 | 2018-07-11 | 삼성전기주식회사 | 코일 부품 |
US10847308B2 (en) | 2017-06-01 | 2020-11-24 | Samsung Electro-Mechanics Co., Ltd. | Coil component |
KR101973437B1 (ko) * | 2017-06-01 | 2019-09-02 | 삼성전기주식회사 | 코일 부품 |
KR102484848B1 (ko) * | 2017-09-20 | 2023-01-05 | 삼성전기주식회사 | 박막형 칩 전자부품 |
KR102463330B1 (ko) * | 2017-10-17 | 2022-11-04 | 삼성전기주식회사 | 코일 전자 부품 |
JP7052380B2 (ja) * | 2018-01-29 | 2022-04-12 | Tdk株式会社 | コイル部品 |
KR102185057B1 (ko) * | 2018-07-04 | 2020-12-01 | 삼성전기주식회사 | 코일 부품 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH036005A (ja) * | 1989-06-02 | 1991-01-11 | Tdk Corp | チップ部品端子の低温構成方法 |
JPH0629144A (ja) * | 1992-07-08 | 1994-02-04 | Tdk Corp | セラミック電子部品 |
JP2003297646A (ja) * | 2002-04-03 | 2003-10-17 | Matsushita Electric Ind Co Ltd | チップ型電子部品 |
JP2006287063A (ja) * | 2005-04-01 | 2006-10-19 | Murata Mfg Co Ltd | 電子部品 |
JP2009009985A (ja) * | 2007-06-26 | 2009-01-15 | Sumida Corporation | コイル部品 |
JP2010186909A (ja) * | 2009-02-13 | 2010-08-26 | Toko Inc | モールドコイルの製造方法およびそのモールドコイル |
JP2012526389A (ja) * | 2009-05-04 | 2012-10-25 | クーパー テクノロジーズ カンパニー | 磁気構成要素組立体 |
JP5082002B1 (ja) * | 2011-08-26 | 2012-11-28 | 太陽誘電株式会社 | 磁性材料およびコイル部品 |
JP2013212642A (ja) * | 2012-04-02 | 2013-10-17 | Panasonic Corp | 軟磁性材製造用部材、軟磁性材、銅張積層板、プリント配線板、及びインダクタ |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5896710A (ja) * | 1981-12-04 | 1983-06-08 | Tdk Corp | 積層インダクタ |
JP3230932B2 (ja) * | 1994-08-12 | 2001-11-19 | 太陽誘電株式会社 | 積層型電子部品 |
JP3613004B2 (ja) * | 1998-05-26 | 2005-01-26 | 松下電器産業株式会社 | 積層セラミック電子部品 |
JP2002367833A (ja) * | 2001-06-13 | 2002-12-20 | Fdk Corp | 積層チップインダクタ |
JP2003037010A (ja) * | 2001-07-23 | 2003-02-07 | Matsushita Electric Ind Co Ltd | チップ積層型電子部品およびその製造方法 |
JP2006278479A (ja) | 2005-03-28 | 2006-10-12 | Tdk Corp | コイル部品 |
JP2007180428A (ja) * | 2005-12-28 | 2007-07-12 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
US7884695B2 (en) * | 2006-06-30 | 2011-02-08 | Intel Corporation | Low resistance inductors, methods of assembling same, and systems containing same |
JP5382064B2 (ja) * | 2011-05-26 | 2014-01-08 | Tdk株式会社 | コイル部品及びその製造方法 |
KR20130031581A (ko) * | 2011-09-21 | 2013-03-29 | 삼성전기주식회사 | 적층형 인덕터 |
JP6031671B2 (ja) * | 2012-04-12 | 2016-11-24 | パナソニックIpマネジメント株式会社 | コモンモードノイズフィルタ |
KR102143005B1 (ko) * | 2014-07-29 | 2020-08-11 | 삼성전기주식회사 | 인덕터 및 그 실장 기판 |
-
2014
- 2014-07-29 KR KR1020140096351A patent/KR102143005B1/ko active IP Right Grant
- 2014-10-23 JP JP2014216123A patent/JP2016032093A/ja active Pending
-
2018
- 2018-10-10 JP JP2018191770A patent/JP2019024113A/ja active Pending
-
2020
- 2020-10-28 JP JP2020180972A patent/JP2021013042A/ja active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH036005A (ja) * | 1989-06-02 | 1991-01-11 | Tdk Corp | チップ部品端子の低温構成方法 |
JPH0629144A (ja) * | 1992-07-08 | 1994-02-04 | Tdk Corp | セラミック電子部品 |
JP2003297646A (ja) * | 2002-04-03 | 2003-10-17 | Matsushita Electric Ind Co Ltd | チップ型電子部品 |
JP2006287063A (ja) * | 2005-04-01 | 2006-10-19 | Murata Mfg Co Ltd | 電子部品 |
JP2009009985A (ja) * | 2007-06-26 | 2009-01-15 | Sumida Corporation | コイル部品 |
JP2010186909A (ja) * | 2009-02-13 | 2010-08-26 | Toko Inc | モールドコイルの製造方法およびそのモールドコイル |
JP2012526389A (ja) * | 2009-05-04 | 2012-10-25 | クーパー テクノロジーズ カンパニー | 磁気構成要素組立体 |
JP5082002B1 (ja) * | 2011-08-26 | 2012-11-28 | 太陽誘電株式会社 | 磁性材料およびコイル部品 |
JP2013212642A (ja) * | 2012-04-02 | 2013-10-17 | Panasonic Corp | 軟磁性材製造用部材、軟磁性材、銅張積層板、プリント配線板、及びインダクタ |
Also Published As
Publication number | Publication date |
---|---|
JP2019024113A (ja) | 2019-02-14 |
KR20160014302A (ko) | 2016-02-11 |
JP2016032093A (ja) | 2016-03-07 |
KR102143005B1 (ko) | 2020-08-11 |
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