KR102114718B1 - 전자 부품 실장 장치 및 실장 부품 검사 방법 - Google Patents

전자 부품 실장 장치 및 실장 부품 검사 방법 Download PDF

Info

Publication number
KR102114718B1
KR102114718B1 KR1020130125850A KR20130125850A KR102114718B1 KR 102114718 B1 KR102114718 B1 KR 102114718B1 KR 1020130125850 A KR1020130125850 A KR 1020130125850A KR 20130125850 A KR20130125850 A KR 20130125850A KR 102114718 B1 KR102114718 B1 KR 102114718B1
Authority
KR
South Korea
Prior art keywords
electronic component
substrate
mounting
inspection frame
height
Prior art date
Application number
KR1020130125850A
Other languages
English (en)
Korean (ko)
Other versions
KR20140057155A (ko
Inventor
토모타카 아베
Original Assignee
쥬키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쥬키 가부시키가이샤 filed Critical 쥬키 가부시키가이샤
Publication of KR20140057155A publication Critical patent/KR20140057155A/ko
Application granted granted Critical
Publication of KR102114718B1 publication Critical patent/KR102114718B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Operations Research (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020130125850A 2012-11-02 2013-10-22 전자 부품 실장 장치 및 실장 부품 검사 방법 KR102114718B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012242446A JP6108770B2 (ja) 2012-11-02 2012-11-02 電子部品実装装置及び実装部品検査方法
JPJP-P-2012-242446 2012-11-02

Publications (2)

Publication Number Publication Date
KR20140057155A KR20140057155A (ko) 2014-05-12
KR102114718B1 true KR102114718B1 (ko) 2020-05-25

Family

ID=50709715

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130125850A KR102114718B1 (ko) 2012-11-02 2013-10-22 전자 부품 실장 장치 및 실장 부품 검사 방법

Country Status (3)

Country Link
JP (1) JP6108770B2 (zh)
KR (1) KR102114718B1 (zh)
CN (1) CN103813705B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6389651B2 (ja) * 2013-09-10 2018-09-12 Juki株式会社 検査方法、実装方法、及び実装装置
JP6536111B2 (ja) * 2015-03-23 2019-07-03 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP6652787B2 (ja) * 2015-05-21 2020-02-26 株式会社Ｆｕｊｉ 実装装置及びその制御方法
CN107615913B (zh) 2015-06-19 2020-01-07 雅马哈发动机株式会社 元件安装装置及元件安装装置中的元件安装判定方法
DE112015006636T5 (de) 2015-06-19 2018-03-01 Yamaha Hatsudoki Kabushiki Kaisha Bauteilmontagevorrichtung und Verfahren zur Bauteilmontage
JP6411663B2 (ja) * 2015-08-17 2018-10-24 ヤマハ発動機株式会社 部品実装装置
US11134597B2 (en) 2015-10-14 2021-09-28 Yamaha Hatsudoki Kabushiki Kaisha Component mounting device
DE112015006798B4 (de) 2015-10-14 2024-05-16 Yamaha Hatsudoki Kabushiki Kaisha Bauteilmontagevorrichtung
US10888041B2 (en) 2015-10-14 2021-01-05 Yamaha Hatsudoki Kabushiki Kaisha Substrate working system and component mounter
WO2017064786A1 (ja) 2015-10-15 2017-04-20 ヤマハ発動機株式会社 部品実装装置
US10893639B2 (en) * 2017-01-12 2021-01-12 Panasonic Intellectual Property Management Co., Ltd. Component mounting using feedback correction
WO2018146766A1 (ja) * 2017-02-09 2018-08-16 株式会社Ｆｕｊｉ 実装機およびエラー報知方法
JP6507206B2 (ja) * 2017-09-07 2019-04-24 ヤマハ発動機株式会社 部品実装装置および部品実装方法
JP6912993B2 (ja) * 2017-10-17 2021-08-04 ヤマハ発動機株式会社 部品実装装置
JP6774532B2 (ja) * 2019-05-20 2020-10-28 ヤマハ発動機株式会社 部品実装装置および部品実装方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349499A (ja) * 1999-06-02 2000-12-15 Yamaha Motor Co Ltd 装着部品検査装置
JP2003075115A (ja) 2001-09-03 2003-03-12 Shibaura Mechatronics Corp 基板検査装置および基板検査方法
JP2006003263A (ja) 2004-06-18 2006-01-05 Hitachi Ltd 視覚情報処理装置および適用システム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62272107A (ja) * 1986-05-20 1987-11-26 Fujitsu Ltd 実装部品検査方法
JP2726603B2 (ja) * 1992-12-04 1998-03-11 いわき電子株式会社 検査エリア補正方法
WO2004012491A1 (en) * 2002-07-25 2004-02-05 Matsushita Electric Industrial Co., Ltd. Apparatus and method for insepecting cream solder printed on a substrate
JP4865496B2 (ja) 2006-10-17 2012-02-01 Ｊｕｋｉ株式会社 撮像装置及び撮像方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349499A (ja) * 1999-06-02 2000-12-15 Yamaha Motor Co Ltd 装着部品検査装置
JP2003075115A (ja) 2001-09-03 2003-03-12 Shibaura Mechatronics Corp 基板検査装置および基板検査方法
JP2006003263A (ja) 2004-06-18 2006-01-05 Hitachi Ltd 視覚情報処理装置および適用システム

Also Published As

Publication number Publication date
KR20140057155A (ko) 2014-05-12
JP2014093390A (ja) 2014-05-19
JP6108770B2 (ja) 2017-04-05
CN103813705B (zh) 2018-03-09
CN103813705A (zh) 2014-05-21

Similar Documents

Publication Publication Date Title
KR102114718B1 (ko) 전자 부품 실장 장치 및 실장 부품 검사 방법
KR101897088B1 (ko) 본딩 장치 및 본딩 방법
KR101110066B1 (ko) 자동차 몰딩류 표면 불량을 검사하기 위한 영상 계측 시스템
JP4845032B2 (ja) 画像処理機能付き撮像装置及び検査システム
JP6154143B2 (ja) 電子部品実装装置および電子部品実装方法
KR101697216B1 (ko) 판유리의 검사 유닛 및 제조 설비
WO2014080525A1 (ja) 装着位置ずれ原因究明方法および電子回路部品装着装置
JP2006329714A (ja) レンズ検査装置
KR101747852B1 (ko) 인쇄회로기판 코팅 검사장치 및 그 검사방법
US20160192552A1 (en) Electronic component mounting machine and transfer confirmation method
KR20120031872A (ko) 글래스 기판 결함 검사 장치 및 글래스 기판 결함 검사 방법
JP5095164B2 (ja) 撮像装置の光軸ずれ検出方法、部品位置補正方法及び部品位置補正装置
KR101397116B1 (ko) 전조등 검사장치
KR101470424B1 (ko) 렌즈 검사 장치
JP4331054B2 (ja) 吸着状態検査装置、表面実装機、及び、部品試験装置
CN111474598A (zh) 电子部件装载状态检测装置
KR20120133976A (ko) 전자 부품 실장 장치 및 전자 부품 촬상 방법
JP2007311711A (ja) 基板バックアップ装置、該装置を備えた印刷半田検査装置及び方法
JP2017116401A (ja) 基板位置調整装置および基板位置調整方法
JP2012253059A (ja) 電子部品実装装置
KR102227473B1 (ko) 박막 증착 장치 및 이를 이용한 박막 형성 방법
CN216717292U (zh) 载具及检测装置
KR102350924B1 (ko) 부품 실장기용 조명광 측정 장치 및 방법
JP6231397B2 (ja) 部品認識装置、部品移載装置および部品実装装置
JP7395950B2 (ja) 外観検査装置及び外観検査方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant