KR102108776B1 - 보호막 형성용 필름 - Google Patents

보호막 형성용 필름 Download PDF

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Publication number
KR102108776B1
KR102108776B1 KR1020157014265A KR20157014265A KR102108776B1 KR 102108776 B1 KR102108776 B1 KR 102108776B1 KR 1020157014265 A KR1020157014265 A KR 1020157014265A KR 20157014265 A KR20157014265 A KR 20157014265A KR 102108776 B1 KR102108776 B1 KR 102108776B1
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KR
South Korea
Prior art keywords
protective film
film
forming
meth
acrylic polymer
Prior art date
Application number
KR1020157014265A
Other languages
English (en)
Korean (ko)
Other versions
KR20150092132A (ko
Inventor
겐 다까노
도모노리 시노다
유이찌로 아주마
Original Assignee
린텍 가부시키가이샤
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Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20150092132A publication Critical patent/KR20150092132A/ko
Application granted granted Critical
Publication of KR102108776B1 publication Critical patent/KR102108776B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
KR1020157014265A 2012-12-03 2013-11-29 보호막 형성용 필름 KR102108776B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-264578 2012-12-03
JP2012264578 2012-12-03
PCT/JP2013/082289 WO2014087947A1 (ja) 2012-12-03 2013-11-29 保護膜形成用フィルム

Publications (2)

Publication Number Publication Date
KR20150092132A KR20150092132A (ko) 2015-08-12
KR102108776B1 true KR102108776B1 (ko) 2020-05-11

Family

ID=50883365

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157014265A KR102108776B1 (ko) 2012-12-03 2013-11-29 보호막 형성용 필름

Country Status (6)

Country Link
JP (1) JP6302843B2 (zh)
KR (1) KR102108776B1 (zh)
CN (1) CN104838490B (zh)
PH (1) PH12015501225A1 (zh)
TW (1) TWI616507B (zh)
WO (1) WO2014087947A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6554738B2 (ja) 2014-03-24 2019-08-07 リンテック株式会社 保護膜形成フィルム、保護膜形成用シート、ワークまたは加工物の製造方法、検査方法、良品と判断されたワーク、および良品と判断された加工物
CN104592714A (zh) * 2015-01-13 2015-05-06 潮州三环（集团）股份有限公司 一种模塑料组合物及其制备方法
JP6237906B2 (ja) * 2015-03-31 2017-11-29 東レ株式会社 電子部品用樹脂シート、保護フィルム付電子部品用樹脂シートならびに半導体装置およびその製造方法
KR102364359B1 (ko) * 2015-08-21 2022-02-17 주식회사 케이씨씨 반도체 봉지용 에폭시 수지 조성물

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250970A (ja) * 2006-03-17 2007-09-27 Hitachi Chem Co Ltd 半導体素子裏面保護用フィルム及びそれを用いた半導体装置とその製造法
JP2012156474A (ja) * 2011-01-28 2012-08-16 Lintec Corp 半導体用接着剤組成物、半導体用接着シートおよび半導体装置の製造方法
JP2012158653A (ja) * 2011-01-31 2012-08-23 Lintec Corp チップ用保護膜形成用シート、半導体チップの製造方法および半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812859A (ja) * 1994-06-28 1996-01-16 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物
JP3441382B2 (ja) * 1998-10-14 2003-09-02 日本電信電話株式会社 半導体装置の製造方法
JP3601443B2 (ja) 1999-11-30 2004-12-15 日立化成工業株式会社 接着フィルムとその製造方法、半導体搭載用配線基板及び半導体装置
JP3604988B2 (ja) * 2000-02-14 2004-12-22 シャープ株式会社 半導体装置およびその製造方法
JP3544362B2 (ja) 2001-03-21 2004-07-21 リンテック株式会社 半導体チップの製造方法
JP4364508B2 (ja) * 2002-12-27 2009-11-18 リンテック株式会社 チップ裏面用保護膜形成用シートおよび保護膜付きチップの製造方法
JP2009130233A (ja) * 2007-11-27 2009-06-11 Furukawa Electric Co Ltd:The チップ保護用フィルム
JP2013256547A (ja) * 2010-10-05 2013-12-26 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物および半導体パッケージ
JPWO2012117822A1 (ja) * 2011-02-28 2014-07-07 横浜ゴム株式会社 加熱硬化性光半導体封止用シリコーン樹脂組成物およびこれを用いる光半導体パッケージ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250970A (ja) * 2006-03-17 2007-09-27 Hitachi Chem Co Ltd 半導体素子裏面保護用フィルム及びそれを用いた半導体装置とその製造法
JP2012156474A (ja) * 2011-01-28 2012-08-16 Lintec Corp 半導体用接着剤組成物、半導体用接着シートおよび半導体装置の製造方法
JP2012158653A (ja) * 2011-01-31 2012-08-23 Lintec Corp チップ用保護膜形成用シート、半導体チップの製造方法および半導体装置

Also Published As

Publication number Publication date
KR20150092132A (ko) 2015-08-12
CN104838490A (zh) 2015-08-12
TWI616507B (zh) 2018-03-01
WO2014087947A1 (ja) 2014-06-12
JP6302843B2 (ja) 2018-03-28
PH12015501225A1 (en) 2015-08-17
JPWO2014087947A1 (ja) 2017-01-05
CN104838490B (zh) 2018-09-25
TW201428078A (zh) 2014-07-16

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