PH12015501225A1 - Protective-membrane-forming film - Google Patents

Protective-membrane-forming film

Info

Publication number
PH12015501225A1
PH12015501225A1 PH12015501225A PH12015501225A PH12015501225A1 PH 12015501225 A1 PH12015501225 A1 PH 12015501225A1 PH 12015501225 A PH12015501225 A PH 12015501225A PH 12015501225 A PH12015501225 A PH 12015501225A PH 12015501225 A1 PH12015501225 A1 PH 12015501225A1
Authority
PH
Philippines
Prior art keywords
acrylic polymer
membrane
protective
forming film
monomers
Prior art date
Application number
PH12015501225A
Inventor
Takano Ken
Shinoda Tomonori
Azuma Yuichiro
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12015501225A1 publication Critical patent/PH12015501225A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

This protective-membrane-forming film, which is used to form a protective membrane that protects a semiconductor chip, contains an acrylic polymer (A), a curable epoxy component (B), a filler (C), and a silane coupling agent (D1). Either the monomers that constitute said acrylic polymer (A) do not include any epoxy-group-containing monomers or epoxy-group-containing monomers constitute no more than 8 pcnt of the total mass of the monomers constituting the acrylic polymer (A). The glass transition temperature of the acrylic polymer (A) is greater than or equal to -3oC, and the molecular weight of the silane coupling agent (D1) is greater than or equal to 300.
PH12015501225A 2012-12-03 2015-06-01 Protective-membrane-forming film PH12015501225A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012264578 2012-12-03
PCT/JP2013/082289 WO2014087947A1 (en) 2012-12-03 2013-11-29 Protective-membrane-forming film

Publications (1)

Publication Number Publication Date
PH12015501225A1 true PH12015501225A1 (en) 2015-08-17

Family

ID=50883365

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015501225A PH12015501225A1 (en) 2012-12-03 2015-06-01 Protective-membrane-forming film

Country Status (6)

Country Link
JP (1) JP6302843B2 (en)
KR (1) KR102108776B1 (en)
CN (1) CN104838490B (en)
PH (1) PH12015501225A1 (en)
TW (1) TWI616507B (en)
WO (1) WO2014087947A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106104760B (en) * 2014-03-24 2019-11-01 琳得科株式会社 Protective film forms film and piece is used in protective film formation
CN104592714A (en) * 2015-01-13 2015-05-06 潮州三环（集团）股份有限公司 Molding compound composition and preparation method thereof
SG11201706433WA (en) * 2015-03-31 2017-09-28 Toray Industries Resin film for electronic component, resin film for electronic component provided with protective film, and semiconductor device and method for manufacturing same
KR102364359B1 (en) * 2015-08-21 2022-02-17 주식회사 케이씨씨 Epoxy Resin Composition for Sealing Semiconductor

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812859A (en) * 1994-06-28 1996-01-16 Matsushita Electric Works Ltd Epoxy resin composition for sealing
JP3441382B2 (en) * 1998-10-14 2003-09-02 日本電信電話株式会社 Method for manufacturing semiconductor device
JP3601443B2 (en) 1999-11-30 2004-12-15 日立化成工業株式会社 Adhesive film, method of manufacturing the same, wiring board for mounting semiconductor, and semiconductor device
JP3604988B2 (en) * 2000-02-14 2004-12-22 シャープ株式会社 Semiconductor device and manufacturing method thereof
JP3544362B2 (en) 2001-03-21 2004-07-21 リンテック株式会社 Method for manufacturing semiconductor chip
JP4364508B2 (en) * 2002-12-27 2009-11-18 リンテック株式会社 Protective film forming sheet for chip back surface and manufacturing method of chip with protective film
JP2007250970A (en) * 2006-03-17 2007-09-27 Hitachi Chem Co Ltd Film for protecting rear face of semiconductor element, semiconductor device using the same and manufacturing method thereof
JP2009130233A (en) * 2007-11-27 2009-06-11 Furukawa Electric Co Ltd:The Film for chip protection
JP2013256547A (en) * 2010-10-05 2013-12-26 Sumitomo Bakelite Co Ltd Liquid sealing resin composition and semiconductor package
JP5774322B2 (en) * 2011-01-28 2015-09-09 リンテック株式会社 Adhesive composition for semiconductor, adhesive sheet for semiconductor, and method for manufacturing semiconductor device
JP5893250B2 (en) * 2011-01-31 2016-03-23 リンテック株式会社 Chip protective film forming sheet, semiconductor chip manufacturing method, and semiconductor device
JPWO2012117822A1 (en) * 2011-02-28 2014-07-07 横浜ゴム株式会社 Heat-curable silicone resin composition for encapsulating optical semiconductor and optical semiconductor package using the same

Also Published As

Publication number Publication date
JPWO2014087947A1 (en) 2017-01-05
TWI616507B (en) 2018-03-01
TW201428078A (en) 2014-07-16
WO2014087947A1 (en) 2014-06-12
CN104838490B (en) 2018-09-25
CN104838490A (en) 2015-08-12
KR102108776B1 (en) 2020-05-11
JP6302843B2 (en) 2018-03-28
KR20150092132A (en) 2015-08-12

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