JP2016029186A5 - - Google Patents

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JP2016029186A5
JP2016029186A5 JP2015224959A JP2015224959A JP2016029186A5 JP 2016029186 A5 JP2016029186 A5 JP 2016029186A5 JP 2015224959 A JP2015224959 A JP 2015224959A JP 2015224959 A JP2015224959 A JP 2015224959A JP 2016029186 A5 JP2016029186 A5 JP 2016029186A5
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resin composition
moisture
curable resin
light
moisture curable
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JP2015224959A
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JP6427089B2 (en
JP2016029186A (en
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ラジカル重合性化合物と、湿気硬化型ウレタン樹脂と、光ラジカル重合開始剤と、疎水性表面処理がなされている充填剤とを含有することを特徴とする光湿気硬化型樹脂組成物。 A photo moisture curable resin composition comprising a radical polymerizable compound, a moisture curable urethane resin, a photo radical polymerization initiator, and a filler subjected to a hydrophobic surface treatment . ラジカル重合性化合物と湿気硬化型ウレタン樹脂との合計１００重量部に対して、湿気硬化型ウレタン樹脂の含有量が２０〜９０重量部であることを特徴とする請求項１記載の光湿気硬化型樹脂組成物。 The light moisture curable type according to claim 1, wherein the content of the moisture curable urethane resin is 20 to 90 parts by weight with respect to a total of 100 parts by weight of the radical polymerizable compound and the moisture curable urethane resin. Resin composition. 充填剤は、一次粒子径が１〜５０ｎｍであることを特徴とする請求項１又は２記載の光湿気硬化型樹脂組成物。 The optical moisture-curable resin composition according to claim 1 or 2, wherein the filler has a primary particle diameter of 1 to 50 nm. 充填剤は、無機充填剤を含有することを特徴とする請求項１、２又は３記載の光湿気硬化型樹脂組成物。 The optical moisture-curable resin composition according to claim 1, 2 or 3, wherein the filler contains an inorganic filler. 充填剤は、シリカを含有することを特徴とする請求項４記載の光湿気硬化型樹脂組成物。 The optical moisture curable resin composition according to claim 4, wherein the filler contains silica. ラジカル重合性化合物と湿気硬化型ウレタン樹脂との合計１００重量部に対して、充填剤の含有量が１〜２０重量部であることを特徴とする請求項１、２、３、４又は５記載の光湿気硬化型樹脂組成物。 The content of the filler is 1 to 20 parts by weight with respect to a total of 100 parts by weight of the radical polymerizable compound and the moisture curable urethane resin, 6. 1, 2, 3, 4 or 5 light moisture-curable resin composition. イソシアネート基、イソチオシアネート基、及び、カルボジイミド基からなる群より選択される少なくとも１種の基を有する化合物を含有することを特徴とする請求項１、２、３、４、５又は６記載の光湿気硬化型樹脂組成物。 7. The light according to claim 1, comprising a compound having at least one group selected from the group consisting of an isocyanate group, an isothiocyanate group, and a carbodiimide group. Moisture curable resin composition. 遮光剤を含有することを特徴とする請求項１、２、３、４、５、６又は７記載の光湿気硬化型樹脂組成物。 The light-moisture curable resin composition according to claim 1, further comprising a light-shielding agent. コーンプレート型粘度計を用いて２５℃、１ｒｐｍの条件で測定した粘度が５０〜５００Ｐａ・ｓであることを特徴とする請求項１、２、３、４、５、６、７又は８記載の光湿気硬化型樹脂組成物。 The viscosity measured at 25 ° C. and 1 rpm using a cone plate viscometer is 50 to 500 Pa · s, according to claim 1, 2, 3, 4, 5, 6, 7 or 8. Light moisture curable resin composition. チクソトロピックインデックスが１．３〜５．０であることを特徴とする請求項１、２、３、４、５、６、７、８又は９記載の光湿気硬化型樹脂組成物。 A thixotropic index is 1.3-5.0, The optical moisture hardening type resin composition of Claim 1, 2, 3, 4, 5, 6, 7, 8 or 9 characterized by the above-mentioned . 硬化物の２５℃における引張弾性率が０．５〜６ｋｇｆ／ｃｍ２であることを特徴とする請求項１、２、３、４、５、６、７、８、９又は１０記載の光湿気硬化型樹脂組成物。 The optical moisture according to claim 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10, wherein the cured product has a tensile elastic modulus at 25 ° C of 0.5 to 6 kgf / cm 2. A curable resin composition. 請求項１、２、３、４、５、６、７、８、９、１０又は１１記載の光湿気硬化型樹脂組成物を用いてなることを特徴とする電子部品用接着剤。 An adhesive for electronic parts, comprising the optical moisture-curable resin composition according to claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or 11 . 請求項１、２、３、４、５、６、７、８、９、１０又は１１記載の光湿気硬化型樹脂組成物を用いてなることを特徴とする表示素子用接着剤。

 12. An adhesive for a display element, characterized by using the optical moisture curable resin composition according to claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 or 11 .

JP2015224959A 2013-10-18 2015-11-17 Light moisture-curable resin composition, adhesive for electronic parts, and adhesive for display device Active JP6427089B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015224959A JP6427089B2 (en) 2013-10-18 2015-11-17 Light moisture-curable resin composition, adhesive for electronic parts, and adhesive for display device

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2013217644 2013-10-18
JP2013217644 2013-10-18
JP2014008733 2014-01-21
JP2014008734 2014-01-21
JP2014008733 2014-01-21
JP2014008734 2014-01-21
JP2014047830 2014-03-11
JP2014047830 2014-03-11
JP2015224959A JP6427089B2 (en) 2013-10-18 2015-11-17 Light moisture-curable resin composition, adhesive for electronic parts, and adhesive for display device

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JP2014551856A Division JP5845362B2 (en) 2013-10-18 2014-10-15 Adhesive for electronic parts and adhesive for display element

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JP2016029186A JP2016029186A (en) 2016-03-03
JP2016029186A5 true JP2016029186A5 (en) 2017-11-30
JP6427089B2 JP6427089B2 (en) 2018-11-21

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JP (2) JP5845362B2 (en)
KR (3) KR102323651B1 (en)
CN (1) CN105637001B (en)
TW (2) TWI659973B (en)
WO (1) WO2015056717A1 (en)

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