KR102076479B1 - 배선 기판의 제조 방법 - Google Patents

배선 기판의 제조 방법 Download PDF

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Publication number
KR102076479B1
KR102076479B1 KR1020157030969A KR20157030969A KR102076479B1 KR 102076479 B1 KR102076479 B1 KR 102076479B1 KR 1020157030969 A KR1020157030969 A KR 1020157030969A KR 20157030969 A KR20157030969 A KR 20157030969A KR 102076479 B1 KR102076479 B1 KR 102076479B1
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KR
South Korea
Prior art keywords
resist layer
soldering resist
connection pad
connection
wiring board
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KR1020157030969A
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English (en)
Korean (ko)
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KR20160013007A (ko
Inventor
유지 도요다
노리히코 고칸
노리유키 가와이
구니히로 나카가와
Original Assignee
미쓰비시 세이시 가부시키가이샤
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Publication of KR20160013007A publication Critical patent/KR20160013007A/ko
Application granted granted Critical
Publication of KR102076479B1 publication Critical patent/KR102076479B1/ko
Assigned to 다이요 홀딩스 가부시키가이샤 reassignment 다이요 홀딩스 가부시키가이샤 권리의 전부이전등록 Assignors: 미쓰비시 세이시 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H01L21/4857—
    • H01L23/49822—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H01L2924/0002—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
KR1020157030969A 2013-05-22 2014-05-15 배선 기판의 제조 방법 Active KR102076479B1 (ko)

Applications Claiming Priority (21)

Application Number Priority Date Filing Date Title
JP2013107932 2013-05-22
JPJP-P-2013-107932 2013-05-22
JP2013125178 2013-06-14
JPJP-P-2013-125178 2013-06-14
JPJP-P-2013-131839 2013-06-24
JP2013131839 2013-06-24
JP2013139706 2013-07-03
JPJP-P-2013-139706 2013-07-03
JP2013142482 2013-07-08
JPJP-P-2013-142482 2013-07-08
JPJP-P-2013-147430 2013-07-16
JP2013147430 2013-07-16
JPJP-P-2013-150824 2013-07-19
JPJP-P-2013-150825 2013-07-19
JP2013150824 2013-07-19
JP2013150825 2013-07-19
JPJP-P-2014-086392 2014-04-18
JP2014086392 2014-04-18
JPJP-P-2014-090220 2014-04-24
JP2014090220 2014-04-24
PCT/JP2014/062928 WO2014188945A1 (ja) 2013-05-22 2014-05-15 配線基板の製造方法

Publications (2)

Publication Number Publication Date
KR20160013007A KR20160013007A (ko) 2016-02-03
KR102076479B1 true KR102076479B1 (ko) 2020-02-12

Family

ID=51933504

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157030969A Active KR102076479B1 (ko) 2013-05-22 2014-05-15 배선 기판의 제조 방법

Country Status (5)

Country Link
JP (3) JP6224520B2 (https=)
KR (1) KR102076479B1 (https=)
CN (4) CN107979919B (https=)
TW (1) TWI625996B (https=)
WO (1) WO2014188945A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022231015A1 (ko) * 2021-04-26 2022-11-03 엘지이노텍 주식회사 회로기판
US12456671B2 (en) 2022-06-27 2025-10-28 Samsung Electronics Co., Ltd. Semiconductor package

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JP6075643B2 (ja) * 2013-11-28 2017-02-08 京セラ株式会社 配線基板の製造方法
KR200491846Y1 (ko) 2014-12-10 2020-06-17 미쓰비시 세이시 가부시키가이샤 레지스트층의 박막화 장치
TWI675256B (zh) * 2015-03-13 2019-10-21 日商三菱製紙股份有限公司 阻焊劑圖型之形成方法
JP6656027B2 (ja) * 2015-03-13 2020-03-04 三菱製紙株式会社 ソルダーレジストパターンの形成方法
KR102814782B1 (ko) 2020-03-12 2025-05-30 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
KR102898765B1 (ko) * 2020-04-23 2025-12-12 엘지이노텍 주식회사 회로 기판
KR20210154450A (ko) 2020-06-12 2021-12-21 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
KR102909754B1 (ko) * 2020-06-12 2026-01-09 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
US11551939B2 (en) 2020-09-02 2023-01-10 Qualcomm Incorporated Substrate comprising interconnects embedded in a solder resist layer
CN113517202A (zh) * 2021-05-27 2021-10-19 日月光半导体(上海)有限公司 集成电路装置及其制造方法
CN113950193B (zh) * 2021-09-24 2024-09-10 上海富乐华半导体科技有限公司 Dbc覆铜陶瓷基板上圆形半腐蚀沉孔的设计方法

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JP2004140089A (ja) 2002-10-16 2004-05-13 Dainippon Printing Co Ltd 多層配線基板およびフリップチップ方式の半導体パッケージ

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Publication number Priority date Publication date Assignee Title
WO2022231015A1 (ko) * 2021-04-26 2022-11-03 엘지이노텍 주식회사 회로기판
US12550269B2 (en) 2021-04-26 2026-02-10 Lg Innotek Co., Ltd. Circuit board
US12456671B2 (en) 2022-06-27 2025-10-28 Samsung Electronics Co., Ltd. Semiconductor package

Also Published As

Publication number Publication date
JP6224520B2 (ja) 2017-11-01
CN107969077A (zh) 2018-04-27
CN105210460A (zh) 2015-12-30
JP6514807B2 (ja) 2019-05-15
JP2015216332A (ja) 2015-12-03
CN107969076B (zh) 2020-04-28
TW201509256A (zh) 2015-03-01
JP2018139318A (ja) 2018-09-06
CN107979919B (zh) 2020-07-10
JP6416323B2 (ja) 2018-10-31
WO2014188945A1 (ja) 2014-11-27
TWI625996B (zh) 2018-06-01
CN107969077B (zh) 2020-02-18
CN105210460B (zh) 2019-01-11
CN107979919A (zh) 2018-05-01
CN107969076A (zh) 2018-04-27
JP2017183744A (ja) 2017-10-05
KR20160013007A (ko) 2016-02-03

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