KR102049224B1 - 겔 타임 제어가능한 이액형 에폭시 접착제 - Google Patents
겔 타임 제어가능한 이액형 에폭시 접착제 Download PDFInfo
- Publication number
- KR102049224B1 KR102049224B1 KR1020147009425A KR20147009425A KR102049224B1 KR 102049224 B1 KR102049224 B1 KR 102049224B1 KR 1020147009425 A KR1020147009425 A KR 1020147009425A KR 20147009425 A KR20147009425 A KR 20147009425A KR 102049224 B1 KR102049224 B1 KR 102049224B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy
- weight
- parts
- epoxy adhesive
- peroxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNPCT/CN2011/080626 | 2011-10-11 | ||
| PCT/CN2011/080626 WO2013053100A1 (en) | 2011-10-11 | 2011-10-11 | Gel time controllable two part epoxy adhesive |
| PCT/CN2012/082794 WO2013053328A1 (en) | 2011-10-11 | 2012-10-11 | Gel time controllable two part epoxy adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140074933A KR20140074933A (ko) | 2014-06-18 |
| KR102049224B1 true KR102049224B1 (ko) | 2019-11-28 |
Family
ID=48081345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147009425A Expired - Fee Related KR102049224B1 (ko) | 2011-10-11 | 2012-10-11 | 겔 타임 제어가능한 이액형 에폭시 접착제 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9371475B2 (https=) |
| EP (1) | EP2766444B1 (https=) |
| JP (1) | JP6095016B2 (https=) |
| KR (1) | KR102049224B1 (https=) |
| ES (1) | ES2636686T3 (https=) |
| IN (1) | IN2014CN02625A (https=) |
| WO (2) | WO2013053100A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230054038A (ko) * | 2021-10-15 | 2023-04-24 | 주식회사 네패스 | 우수한 접착 및 속경화 특성을 가지는 에폭시 접착제 조성 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101693605B1 (ko) | 2015-02-10 | 2017-01-17 | 한국생산기술연구원 | 폴리티올 경화제를 포함하는 에폭시 접착제 조성물 및 이의 제조방법 |
| US11230617B2 (en) | 2017-10-31 | 2022-01-25 | Namics Corporation | Resin composition |
| EP3865519B1 (en) | 2018-10-05 | 2023-04-19 | Namics Corporation | Resin composition |
| EP3865520B1 (en) | 2018-10-09 | 2024-02-28 | Namics Corporation | Curing agent composition for curing 2-methylene-1,3-dicarbonyl compound |
| CN111171284A (zh) * | 2020-01-07 | 2020-05-19 | 南宁珀源能源材料有限公司 | 一种环氧改性脂肪胺固化剂及其在硅锭切割固定胶的应用 |
| CN112375209B (zh) * | 2020-10-30 | 2022-07-22 | 山东益丰生化环保股份有限公司 | 一种凝胶时间可控的环氧树脂胶黏剂中的固化剂及其制备方法 |
| EP4702072A1 (en) * | 2023-04-24 | 2026-03-04 | Medtronic, Inc. | Implantable medical device with curable liquid feedthrough potting adhesive |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3727847A1 (de) * | 1987-08-20 | 1989-03-02 | Fuller H B Co | Schmelzklebstoff und verfahren zu seiner herstellung und verarbeitung |
| JP3038777B2 (ja) * | 1990-04-05 | 2000-05-08 | 大日本インキ化学工業株式会社 | 不飽和ポリエステル樹脂系塗床材の施工方法 |
| JPH0676428B2 (ja) | 1990-05-16 | 1994-09-28 | 第一工業製薬株式会社 | ショ糖脂肪酸エステルの脱色方法 |
| JP2500526B2 (ja) | 1990-12-25 | 1996-05-29 | 凸版印刷株式会社 | フォトマスクブランクおよびフォトマスク |
| JP3584537B2 (ja) | 1995-03-31 | 2004-11-04 | 東レ・ファインケミカル株式会社 | チオール基含有ポリエーテルポリマー及びその製造 方法 |
| US6653371B1 (en) | 1998-01-16 | 2003-11-25 | Barry E. Burns | One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid |
| CN1165592C (zh) * | 1998-01-16 | 2004-09-08 | 洛克泰特(R&D)有限公司 | 可固化的环氧基组合物 |
| US6495653B1 (en) | 1998-04-17 | 2002-12-17 | Sanyo Chemical Industries, Ltd. | Curable composition and cured article thereof |
| JP3802253B2 (ja) * | 1998-12-22 | 2006-07-26 | 化薬アクゾ株式会社 | 樹脂の硬化促進剤及び硬化方法 |
| US6313257B1 (en) * | 1999-03-23 | 2001-11-06 | Lord Corporation | Poly (mercaptopropylaryl) curatives |
| JP2003231736A (ja) * | 2002-02-08 | 2003-08-19 | Nagase Chemtex Corp | 2液型リペアラブル組成物およびそれを用いたリペアラブル接着剤 |
| DE10357355A1 (de) * | 2003-12-09 | 2005-07-14 | Henkel Kgaa | 2 K Klebstoffe für den Fahrzeugbau |
| JP4707981B2 (ja) * | 2004-08-06 | 2011-06-22 | 昭和電工株式会社 | 成形物の製造方法 |
| CA2624381A1 (en) * | 2005-10-07 | 2007-04-19 | Dsm Ip Assets B.V. | Method for chemical anchoring |
| JP5076691B2 (ja) | 2007-07-11 | 2012-11-21 | Jfeスチール株式会社 | 高強度冷延鋼板の製造方法 |
| KR20150063590A (ko) * | 2007-08-02 | 2015-06-09 | 다우 글로벌 테크놀로지스 엘엘씨 | 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제 |
| KR101187948B1 (ko) | 2007-12-13 | 2012-10-05 | 쇼와 덴코 가부시키가이샤 | 에폭시 수지 경화제 및 그 제조 방법 및 에폭시 수지 조성물 |
| EP2229416B1 (en) * | 2008-01-08 | 2018-04-04 | Dow Global Technologies LLC | High tg epoxy systems for composite application |
| JP5466368B2 (ja) * | 2008-02-18 | 2014-04-09 | 積水化学工業株式会社 | 電子部品接合用接着剤 |
| EP2268696A1 (en) * | 2008-04-14 | 2011-01-05 | Dow Global Technologies Inc. | Use of filler that undergoes endothermic phase transition to lower the reaction exotherm of epoxy based compositions |
| CN101698787B (zh) * | 2009-11-12 | 2013-01-09 | 镇江市电子化工材料工程研究中心有限公司 | 一种叶片修补用环氧树脂粘结剂及其制备方法 |
| WO2011064360A1 (en) * | 2009-11-30 | 2011-06-03 | Dsm Ip Assets B.V. | Resin suitable for construction purposes comprising norbornene functional groups and thiols |
-
2011
- 2011-10-11 WO PCT/CN2011/080626 patent/WO2013053100A1/en not_active Ceased
-
2012
- 2012-10-11 ES ES12839460.8T patent/ES2636686T3/es active Active
- 2012-10-11 WO PCT/CN2012/082794 patent/WO2013053328A1/en not_active Ceased
- 2012-10-11 JP JP2014534933A patent/JP6095016B2/ja not_active Expired - Fee Related
- 2012-10-11 EP EP12839460.8A patent/EP2766444B1/en not_active Not-in-force
- 2012-10-11 KR KR1020147009425A patent/KR102049224B1/ko not_active Expired - Fee Related
- 2012-10-11 IN IN2625CHN2014 patent/IN2014CN02625A/en unknown
-
2014
- 2014-04-11 US US14/251,234 patent/US9371475B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230054038A (ko) * | 2021-10-15 | 2023-04-24 | 주식회사 네패스 | 우수한 접착 및 속경화 특성을 가지는 에폭시 접착제 조성 |
| KR102765200B1 (ko) | 2021-10-15 | 2025-02-07 | 주식회사 네패스 | 우수한 접착 및 속경화 특성을 가지는 에폭시 접착제 조성 |
Also Published As
| Publication number | Publication date |
|---|---|
| IN2014CN02625A (https=) | 2015-08-07 |
| WO2013053328A1 (en) | 2013-04-18 |
| US9371475B2 (en) | 2016-06-21 |
| JP2014531505A (ja) | 2014-11-27 |
| ES2636686T3 (es) | 2017-10-06 |
| US20140221532A1 (en) | 2014-08-07 |
| KR20140074933A (ko) | 2014-06-18 |
| EP2766444B1 (en) | 2017-06-28 |
| JP6095016B2 (ja) | 2017-03-15 |
| EP2766444A4 (en) | 2015-06-17 |
| WO2013053100A1 (en) | 2013-04-18 |
| EP2766444A1 (en) | 2014-08-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| N231 | Notification of change of applicant | ||
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
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| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
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| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
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| PG1601 | Publication of registration |
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| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20221122 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
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St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20221122 |