ES2636686T3 - Adhesivo de epoxi de dos partes controlable en el tiempo de gelificación - Google Patents

Adhesivo de epoxi de dos partes controlable en el tiempo de gelificación Download PDF

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Publication number
ES2636686T3
ES2636686T3 ES12839460.8T ES12839460T ES2636686T3 ES 2636686 T3 ES2636686 T3 ES 2636686T3 ES 12839460 T ES12839460 T ES 12839460T ES 2636686 T3 ES2636686 T3 ES 2636686T3
Authority
ES
Spain
Prior art keywords
epoxy
parts
weight
epoxy adhesive
peroxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES12839460.8T
Other languages
English (en)
Spanish (es)
Inventor
Haiping Wu
Jingfen Zhang
Rainer Schoenfeld
Nigel Fay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Application granted granted Critical
Publication of ES2636686T3 publication Critical patent/ES2636686T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66Mercaptans
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
ES12839460.8T 2011-10-11 2012-10-11 Adhesivo de epoxi de dos partes controlable en el tiempo de gelificación Active ES2636686T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
WOPCT/CN2011/080626 2011-10-11
PCT/CN2011/080626 WO2013053100A1 (en) 2011-10-11 2011-10-11 Gel time controllable two part epoxy adhesive
PCT/CN2012/082794 WO2013053328A1 (en) 2011-10-11 2012-10-11 Gel time controllable two part epoxy adhesive

Publications (1)

Publication Number Publication Date
ES2636686T3 true ES2636686T3 (es) 2017-10-06

Family

ID=48081345

Family Applications (1)

Application Number Title Priority Date Filing Date
ES12839460.8T Active ES2636686T3 (es) 2011-10-11 2012-10-11 Adhesivo de epoxi de dos partes controlable en el tiempo de gelificación

Country Status (7)

Country Link
US (1) US9371475B2 (https=)
EP (1) EP2766444B1 (https=)
JP (1) JP6095016B2 (https=)
KR (1) KR102049224B1 (https=)
ES (1) ES2636686T3 (https=)
IN (1) IN2014CN02625A (https=)
WO (2) WO2013053100A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101693605B1 (ko) 2015-02-10 2017-01-17 한국생산기술연구원 폴리티올 경화제를 포함하는 에폭시 접착제 조성물 및 이의 제조방법
US11230617B2 (en) 2017-10-31 2022-01-25 Namics Corporation Resin composition
EP3865519B1 (en) 2018-10-05 2023-04-19 Namics Corporation Resin composition
EP3865520B1 (en) 2018-10-09 2024-02-28 Namics Corporation Curing agent composition for curing 2-methylene-1,3-dicarbonyl compound
CN111171284A (zh) * 2020-01-07 2020-05-19 南宁珀源能源材料有限公司 一种环氧改性脂肪胺固化剂及其在硅锭切割固定胶的应用
CN112375209B (zh) * 2020-10-30 2022-07-22 山东益丰生化环保股份有限公司 一种凝胶时间可控的环氧树脂胶黏剂中的固化剂及其制备方法
KR102765200B1 (ko) * 2021-10-15 2025-02-07 주식회사 네패스 우수한 접착 및 속경화 특성을 가지는 에폭시 접착제 조성
EP4702072A1 (en) * 2023-04-24 2026-03-04 Medtronic, Inc. Implantable medical device with curable liquid feedthrough potting adhesive

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3727847A1 (de) * 1987-08-20 1989-03-02 Fuller H B Co Schmelzklebstoff und verfahren zu seiner herstellung und verarbeitung
JP3038777B2 (ja) * 1990-04-05 2000-05-08 大日本インキ化学工業株式会社 不飽和ポリエステル樹脂系塗床材の施工方法
JPH0676428B2 (ja) 1990-05-16 1994-09-28 第一工業製薬株式会社 ショ糖脂肪酸エステルの脱色方法
JP2500526B2 (ja) 1990-12-25 1996-05-29 凸版印刷株式会社 フォトマスクブランクおよびフォトマスク
JP3584537B2 (ja) 1995-03-31 2004-11-04 東レ・ファインケミカル株式会社 チオール基含有ポリエーテルポリマー及びその製造 方法
US6653371B1 (en) 1998-01-16 2003-11-25 Barry E. Burns One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid
CN1165592C (zh) * 1998-01-16 2004-09-08 洛克泰特(R&D)有限公司 可固化的环氧基组合物
US6495653B1 (en) 1998-04-17 2002-12-17 Sanyo Chemical Industries, Ltd. Curable composition and cured article thereof
JP3802253B2 (ja) * 1998-12-22 2006-07-26 化薬アクゾ株式会社 樹脂の硬化促進剤及び硬化方法
US6313257B1 (en) * 1999-03-23 2001-11-06 Lord Corporation Poly (mercaptopropylaryl) curatives
JP2003231736A (ja) * 2002-02-08 2003-08-19 Nagase Chemtex Corp 2液型リペアラブル組成物およびそれを用いたリペアラブル接着剤
DE10357355A1 (de) * 2003-12-09 2005-07-14 Henkel Kgaa 2 K Klebstoffe für den Fahrzeugbau
JP4707981B2 (ja) * 2004-08-06 2011-06-22 昭和電工株式会社 成形物の製造方法
CA2624381A1 (en) * 2005-10-07 2007-04-19 Dsm Ip Assets B.V. Method for chemical anchoring
JP5076691B2 (ja) 2007-07-11 2012-11-21 Jfeスチール株式会社 高強度冷延鋼板の製造方法
KR20150063590A (ko) * 2007-08-02 2015-06-09 다우 글로벌 테크놀로지스 엘엘씨 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제
KR101187948B1 (ko) 2007-12-13 2012-10-05 쇼와 덴코 가부시키가이샤 에폭시 수지 경화제 및 그 제조 방법 및 에폭시 수지 조성물
EP2229416B1 (en) * 2008-01-08 2018-04-04 Dow Global Technologies LLC High tg epoxy systems for composite application
JP5466368B2 (ja) * 2008-02-18 2014-04-09 積水化学工業株式会社 電子部品接合用接着剤
EP2268696A1 (en) * 2008-04-14 2011-01-05 Dow Global Technologies Inc. Use of filler that undergoes endothermic phase transition to lower the reaction exotherm of epoxy based compositions
CN101698787B (zh) * 2009-11-12 2013-01-09 镇江市电子化工材料工程研究中心有限公司 一种叶片修补用环氧树脂粘结剂及其制备方法
WO2011064360A1 (en) * 2009-11-30 2011-06-03 Dsm Ip Assets B.V. Resin suitable for construction purposes comprising norbornene functional groups and thiols

Also Published As

Publication number Publication date
IN2014CN02625A (https=) 2015-08-07
WO2013053328A1 (en) 2013-04-18
US9371475B2 (en) 2016-06-21
JP2014531505A (ja) 2014-11-27
US20140221532A1 (en) 2014-08-07
KR20140074933A (ko) 2014-06-18
EP2766444B1 (en) 2017-06-28
KR102049224B1 (ko) 2019-11-28
JP6095016B2 (ja) 2017-03-15
EP2766444A4 (en) 2015-06-17
WO2013053100A1 (en) 2013-04-18
EP2766444A1 (en) 2014-08-20

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