KR102037844B1 - 초임계 유체를 이용하는 기판 처리 장치, 이를 포함하는 기판 처리 시스템, 및 기판 처리 방법 - Google Patents

초임계 유체를 이용하는 기판 처리 장치, 이를 포함하는 기판 처리 시스템, 및 기판 처리 방법 Download PDF

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KR102037844B1
KR102037844B1 KR1020130026254A KR20130026254A KR102037844B1 KR 102037844 B1 KR102037844 B1 KR 102037844B1 KR 1020130026254 A KR1020130026254 A KR 1020130026254A KR 20130026254 A KR20130026254 A KR 20130026254A KR 102037844 B1 KR102037844 B1 KR 102037844B1
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South Korea
Prior art keywords
supercritical
process region
presupercritical
region
supercritical fluid
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KR20140112638A (ko
Inventor
조용진
고용선
김경섭
김광수
김석훈
오정민
이근택
장원호
전용명
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삼성전자주식회사
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Priority to KR1020130026254A priority Critical patent/KR102037844B1/ko
Priority to US13/844,149 priority patent/US9027576B2/en
Priority to TW103104589A priority patent/TWI625156B/zh
Priority to EP14158323.7A priority patent/EP2779222B1/en
Priority to EP17177554.7A priority patent/EP3255661B1/en
Priority to JP2014048050A priority patent/JP6339826B2/ja
Priority to CN201410090605.4A priority patent/CN104051299B/zh
Priority to CN201811608953.0A priority patent/CN110060942B/zh
Publication of KR20140112638A publication Critical patent/KR20140112638A/ko
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Publication of KR102037844B1 publication Critical patent/KR102037844B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020130026254A 2013-03-12 2013-03-12 초임계 유체를 이용하는 기판 처리 장치, 이를 포함하는 기판 처리 시스템, 및 기판 처리 방법 Active KR102037844B1 (ko)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR1020130026254A KR102037844B1 (ko) 2013-03-12 2013-03-12 초임계 유체를 이용하는 기판 처리 장치, 이를 포함하는 기판 처리 시스템, 및 기판 처리 방법
US13/844,149 US9027576B2 (en) 2013-03-12 2013-03-15 Substrate treatment systems using supercritical fluid
TW103104589A TWI625156B (zh) 2013-03-12 2014-02-12 使用超臨界流體之基板處理系統
EP17177554.7A EP3255661B1 (en) 2013-03-12 2014-03-07 Substrate treatment method using supercritical fluid
EP14158323.7A EP2779222B1 (en) 2013-03-12 2014-03-07 Substrate treatment systems using supercritical fluid
JP2014048050A JP6339826B2 (ja) 2013-03-12 2014-03-11 超臨界流体を利用する基板処理装置、及びこれを含む基板処理システム
CN201410090605.4A CN104051299B (zh) 2013-03-12 2014-03-12 基板处理装置、基板处理系统以及处理基板的方法
CN201811608953.0A CN110060942B (zh) 2013-03-12 2014-03-12 基板处理装置、基板处理系统以及处理基板的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130026254A KR102037844B1 (ko) 2013-03-12 2013-03-12 초임계 유체를 이용하는 기판 처리 장치, 이를 포함하는 기판 처리 시스템, 및 기판 처리 방법

Publications (2)

Publication Number Publication Date
KR20140112638A KR20140112638A (ko) 2014-09-24
KR102037844B1 true KR102037844B1 (ko) 2019-11-27

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Country Status (5)

Country Link
US (1) US9027576B2 (enExample)
JP (1) JP6339826B2 (enExample)
KR (1) KR102037844B1 (enExample)
CN (1) CN110060942B (enExample)
TW (1) TWI625156B (enExample)

Cited By (4)

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US12110593B2 (en) 2020-11-03 2024-10-08 Samsung Electronics Co., Ltd. Apparatus for fabricating semiconductor device having upper and lower inlets for supplying supercritical fluids and method of fabricating semiconductor device using the same
US12119240B2 (en) 2021-12-15 2024-10-15 Samsung Electronics Co., Ltd. Substrate drying device and method of drying substrate using the same preliminary class
US12234555B2 (en) 2020-12-10 2025-02-25 Semes Co., Ltd. Substrate treating apparatus and filler member provided therein
US12347720B2 (en) 2021-10-25 2025-07-01 Semes Co., Ltd. Apparatus for treating substrate

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KR101874901B1 (ko) * 2011-12-07 2018-07-06 삼성전자주식회사 기판 건조 장치 및 방법
KR102411946B1 (ko) 2015-07-08 2022-06-22 삼성전자주식회사 초임계 유체를 이용한 기판 처리장치와 이를 포함하는 기판 처리 시스템 및 이를 이용한 기판처리 방법
JP6556945B2 (ja) * 2015-10-04 2019-08-07 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板支持とバッフルの装置
JP6804278B2 (ja) * 2016-12-06 2020-12-23 東京エレクトロン株式会社 超臨界流体製造装置および基板処理装置
KR102603528B1 (ko) 2016-12-29 2023-11-17 삼성전자주식회사 기판 처리 장치 및 이를 포함한 기판 처리 시스템
KR102358561B1 (ko) 2017-06-08 2022-02-04 삼성전자주식회사 기판 처리 장치 및 집적회로 소자 제조 장치
CN110998801B (zh) * 2017-08-10 2023-10-31 株式会社富士金 流体供给装置和流体供给方法
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CN110060942B (zh) 2023-06-27
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