KR102004606B1 - 전자 부품 실장 장치 - Google Patents

전자 부품 실장 장치 Download PDF

Info

Publication number
KR102004606B1
KR102004606B1 KR1020170095224A KR20170095224A KR102004606B1 KR 102004606 B1 KR102004606 B1 KR 102004606B1 KR 1020170095224 A KR1020170095224 A KR 1020170095224A KR 20170095224 A KR20170095224 A KR 20170095224A KR 102004606 B1 KR102004606 B1 KR 102004606B1
Authority
KR
South Korea
Prior art keywords
substrate
pressing
electronic component
holding
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020170095224A
Other languages
English (en)
Korean (ko)
Other versions
KR20180019480A (ko
Inventor
히로히사 간베
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20180019480A publication Critical patent/KR20180019480A/ko
Application granted granted Critical
Publication of KR102004606B1 publication Critical patent/KR102004606B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H01L21/67092—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H01L21/67098—
    • H01L23/15—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020170095224A 2016-08-16 2017-07-27 전자 부품 실장 장치 Active KR102004606B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2016-159645 2016-08-16
JP2016159645 2016-08-16
JP2017137420A JP6675356B2 (ja) 2016-08-16 2017-07-13 電子部品実装装置
JPJP-P-2017-137420 2017-07-13

Publications (2)

Publication Number Publication Date
KR20180019480A KR20180019480A (ko) 2018-02-26
KR102004606B1 true KR102004606B1 (ko) 2019-07-26

Family

ID=61249130

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170095224A Active KR102004606B1 (ko) 2016-08-16 2017-07-27 전자 부품 실장 장치

Country Status (4)

Country Link
JP (1) JP6675356B2 (https=)
KR (1) KR102004606B1 (https=)
CN (1) CN107770970B (https=)
TW (1) TWI642337B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11528807B2 (en) 2020-03-12 2022-12-13 Samsung Display Co., Ltd. Bonding device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112566485B (zh) * 2019-09-25 2022-05-13 芝浦机械电子装置株式会社 电子零件的安装装置
WO2021243545A1 (zh) * 2020-06-02 2021-12-09 南京溧水高新创业投资管理有限公司 一种电子零件安装装置
KR102510422B1 (ko) * 2021-01-18 2023-03-15 주식회사 제이스텍 표시장치를 제조하는 장치 및 이를 이용한 표시장치의 제조 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003140179A (ja) * 2001-10-31 2003-05-14 Optrex Corp 液晶表示パネルへの回路部品接続装置
JP2008084952A (ja) * 2006-09-26 2008-04-10 Fujifilm Corp 配線板接続方法
JP2009010062A (ja) 2007-06-27 2009-01-15 Panasonic Corp 電極接合ユニット、電極接合方法、及び電極接合構造体
JP2009272457A (ja) 2008-05-08 2009-11-19 Sharp Corp 基板実装構造及び液晶表示装置、並びに基板実装構造の製造方法
JP2011047984A (ja) * 2009-08-25 2011-03-10 Hitachi High-Technologies Corp Ｆｐｄモジュール実装装置およびその実装方法
JP2011054815A (ja) 2009-09-03 2011-03-17 Hitachi High-Technologies Corp 実装処理作業装置及び実装処理作業方法並びに表示基板モジュール組立ライン

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2971180B2 (ja) 1991-05-30 1999-11-02 株式会社東芝 アウタリードボンディング装置
JP2004273688A (ja) * 2003-03-07 2004-09-30 Seiko Epson Corp 圧着方法、圧着装置、電気光学装置の製造方法及び製造装置
JP4664366B2 (ja) * 2005-08-24 2011-04-06 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5574401B2 (ja) * 2007-01-10 2014-08-20 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003140179A (ja) * 2001-10-31 2003-05-14 Optrex Corp 液晶表示パネルへの回路部品接続装置
JP2008084952A (ja) * 2006-09-26 2008-04-10 Fujifilm Corp 配線板接続方法
JP2009010062A (ja) 2007-06-27 2009-01-15 Panasonic Corp 電極接合ユニット、電極接合方法、及び電極接合構造体
JP2009272457A (ja) 2008-05-08 2009-11-19 Sharp Corp 基板実装構造及び液晶表示装置、並びに基板実装構造の製造方法
JP2011047984A (ja) * 2009-08-25 2011-03-10 Hitachi High-Technologies Corp Ｆｐｄモジュール実装装置およびその実装方法
JP2011054815A (ja) 2009-09-03 2011-03-17 Hitachi High-Technologies Corp 実装処理作業装置及び実装処理作業方法並びに表示基板モジュール組立ライン

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11528807B2 (en) 2020-03-12 2022-12-13 Samsung Display Co., Ltd. Bonding device

Also Published As

Publication number Publication date
JP2018029171A (ja) 2018-02-22
TWI642337B (zh) 2018-11-21
CN107770970A (zh) 2018-03-06
CN107770970B (zh) 2020-06-30
TW201808084A (zh) 2018-03-01
KR20180019480A (ko) 2018-02-26
JP6675356B2 (ja) 2020-04-01

Similar Documents

Publication Publication Date Title
JP6675357B2 (ja) 圧着装置
KR102004606B1 (ko) 전자 부품 실장 장치
KR20200051608A (ko) 압착 헤드 및 실장 장치
JP6234277B2 (ja) 圧着ヘッド、それを用いた実装装置および実装方法
KR102720412B1 (ko) 전자 부품 실장 장치
KR102744026B1 (ko) 전자 부품 실장 장치
JP5159259B2 (ja) 圧着装置及びフラットパネルディスプレイの製造装置
JP4404198B2 (ja) 液晶セルのｔａｂ搭載装置及びその方法
JPH1167839A (ja) 電子装置の製造方法
JP2009010123A (ja) 電子部品の実装装置及び電子部品の製造方法
JP2011097095A (ja) 圧着装置及びフラットパネルディスプレイの製造装置
JP2006024797A (ja) 部品実装装置
JP6461822B2 (ja) 半導体装置の実装方法および実装装置
JP6726012B2 (ja) 電子部品実装装置および電子部品実装方法
CN104914595B (zh) 基板压制机构
CN111987032B (zh) 粘接装置以及粘接方法
JP2011232473A (ja) 搭載装置，加熱圧着装置および表示パネルモジュール組立装置
KR20100059259A (ko) 탭 본딩 방법 및 장치
JP2004259917A (ja) ボンディング方法および装置
JP2002026593A (ja) 部品実装装置及び部品実装方法
WO2025205618A1 (ja) 圧着装置及び表示用パネルの製造方法
JP5373331B2 (ja) 基板処理装置
JP2012203304A (ja) Ｆｐｄモジュールの組立装置
JP2009182342A (ja) 液晶セルのｔａｂ搭載装置

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000