KR101980497B1 - 임프린트 장치, 임프린트 방법 및 물품의 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법 및 물품의 제조 방법 Download PDF

Info

Publication number
KR101980497B1
KR101980497B1 KR1020187008576A KR20187008576A KR101980497B1 KR 101980497 B1 KR101980497 B1 KR 101980497B1 KR 1020187008576 A KR1020187008576 A KR 1020187008576A KR 20187008576 A KR20187008576 A KR 20187008576A KR 101980497 B1 KR101980497 B1 KR 101980497B1
Authority
KR
South Korea
Prior art keywords
mold
imprint material
unit
substrate
imprint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020187008576A
Other languages
English (en)
Korean (ko)
Other versions
KR20180044391A (ko
Inventor
요오스케 곤도
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20180044391A publication Critical patent/KR20180044391A/ko
Application granted granted Critical
Publication of KR101980497B1 publication Critical patent/KR101980497B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020187008576A 2015-09-04 2016-08-03 임프린트 장치, 임프린트 방법 및 물품의 제조 방법 Active KR101980497B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015174407A JP6541518B2 (ja) 2015-09-04 2015-09-04 インプリント装置、インプリント方法、および物品の製造方法
JPJP-P-2015-174407 2015-09-04
PCT/JP2016/003579 WO2017038007A1 (en) 2015-09-04 2016-08-03 Imprint apparatus, imprint method, and method of manufacturing article

Publications (2)

Publication Number Publication Date
KR20180044391A KR20180044391A (ko) 2018-05-02
KR101980497B1 true KR101980497B1 (ko) 2019-05-20

Family

ID=58186870

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187008576A Active KR101980497B1 (ko) 2015-09-04 2016-08-03 임프린트 장치, 임프린트 방법 및 물품의 제조 방법

Country Status (3)

Country Link
JP (1) JP6541518B2 (enrdf_load_stackoverflow)
KR (1) KR101980497B1 (enrdf_load_stackoverflow)
WO (1) WO2017038007A1 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6887279B2 (ja) * 2017-03-24 2021-06-16 キヤノン株式会社 インプリント装置および物品製造方法
JP7043199B2 (ja) * 2017-08-03 2022-03-29 キヤノン株式会社 インプリント方法、プログラム、インプリント装置及び物品の製造方法
JP2025034973A (ja) 2023-08-31 2025-03-13 キヤノン株式会社 異物検査方法、異物検査装置、成形方法、成型装置、及び物品の製造方法
JP7721736B1 (ja) * 2024-05-14 2025-08-12 キヤノン株式会社 平坦化装置、平坦化方法、および物品の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009212382A (ja) 2008-03-05 2009-09-17 Hitachi High-Technologies Corp プロキシミティ露光装置、プロキシミティ露光装置の基板移動方法、及び表示用パネル基板の製造方法
JP2010149469A (ja) 2008-12-26 2010-07-08 Showa Denko Kk インプリント装置およびモールドの汚染検出方法
US20150076724A1 (en) 2013-09-13 2015-03-19 Canon Kabushiki Kaisha Imprint apparatus, imprint method, detecting method, and method of manufacturing device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1070069A (ja) * 1996-08-28 1998-03-10 Canon Inc 半導体露光装置におけるごみ検出装置
JP5173944B2 (ja) * 2009-06-16 2013-04-03 キヤノン株式会社 インプリント装置及び物品の製造方法
US11133118B2 (en) * 2012-05-22 2021-09-28 University Of Massachusetts Patterned nanoparticle structures
JP2014103385A (ja) * 2012-10-26 2014-06-05 Canon Inc 検出装置、リソグラフィ装置、物品の製造方法及び検出方法
JP6331292B2 (ja) * 2013-08-30 2018-05-30 大日本印刷株式会社 インプリント方法およびインプリント装置
JP6313585B2 (ja) * 2013-12-10 2018-04-18 キヤノン株式会社 露光装置及び物品の製造方法
JP2016025230A (ja) * 2014-07-22 2016-02-08 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
JP6674218B2 (ja) * 2014-12-09 2020-04-01 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
US10747106B2 (en) * 2014-12-09 2020-08-18 Canon Kabushiki Kaisha Imprint apparatus
JP6403627B2 (ja) * 2015-04-14 2018-10-10 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009212382A (ja) 2008-03-05 2009-09-17 Hitachi High-Technologies Corp プロキシミティ露光装置、プロキシミティ露光装置の基板移動方法、及び表示用パネル基板の製造方法
JP2010149469A (ja) 2008-12-26 2010-07-08 Showa Denko Kk インプリント装置およびモールドの汚染検出方法
US20150076724A1 (en) 2013-09-13 2015-03-19 Canon Kabushiki Kaisha Imprint apparatus, imprint method, detecting method, and method of manufacturing device

Also Published As

Publication number Publication date
JP2017050482A (ja) 2017-03-09
JP6541518B2 (ja) 2019-07-10
KR20180044391A (ko) 2018-05-02
WO2017038007A1 (en) 2017-03-09

Similar Documents

Publication Publication Date Title
KR101980497B1 (ko) 임프린트 장치, 임프린트 방법 및 물품의 제조 방법
US8807978B2 (en) Template manufacturing method, template inspecting method and inspecting apparatus, nanoimprint apparatus, nanoimprint system, and device manufacturing method
US11721013B2 (en) Information processing apparatus, determination method, imprint apparatus, lithography system, article manufacturing method, and non-transitory computer-readable storage medium
KR102350286B1 (ko) 드롭 레시피를 결정하는 결정 방법, 임프린트 장치 및 물품 제조 방법
TWI392578B (zh) 即時壓印程序缺陷診斷技術
KR101879480B1 (ko) 임프린트 방법, 임프린트 장치, 물품 제조 방법, 및 프로그램
KR102771211B1 (ko) 임프린트 장치의 제어 방법, 임프린트 장치, 및 물품 제조방법
US11061335B2 (en) Information processing apparatus, storage medium, lithography apparatus, lithography system, and article manufacturing method
KR102292951B1 (ko) 임프린트 장치 및 물품의 제조 방법
KR20180064990A (ko) 임프린트 장치 및 물품 제조 방법
JP2015050217A (ja) インプリント方法およびインプリント装置
JP7175620B2 (ja) 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法
KR20190022385A (ko) 임프린트 장치, 임프린트 방법, 물품 제조 방법, 성형 장치 및 성형 방법
CN116075395A (zh) 平坦化处理、平坦化系统和制造物品的方法
JP2019062164A (ja) インプリント装置、インプリント方法、インプリント材の配置パターンの決定方法、および物品の製造方法
KR20180060992A (ko) 임프린트 장치, 임프린트 방법 및 물품의 제조 방법
US20230347391A1 (en) Foreign particle removing method, formation method, article manufacturing method, foreign particle removing apparatus, system, and template
US20230347390A1 (en) Foreign particle removing method, formation method, article manufacturing method, foreign particle removing apparatus, and system
JP6732475B2 (ja) インプリント装置、物品の製造方法、保持装置および露光装置
JP6413507B2 (ja) インプリント方法およびインプリント装置
JP2019021875A (ja) インプリント方法、インプリント装置、および物品の製造方法
JP2019201180A (ja) 付着物除去方法、成形装置、成形方法、および物品の製造方法
JP2019096697A (ja) インプリント装置および物品製造方法
US20250076213A1 (en) Foreign substance inspection method, foreign substance inspection apparatus, molding method, molding apparatus, and article manufacturing method
US20230149982A1 (en) Particle removal method, particle removal apparatus, and method for manufacturing article

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

Patent event date: 20180327

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination
PG1501 Laying open of application
E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20190227

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20190514

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20190514

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20220422

Start annual number: 4

End annual number: 4