KR101962009B1 - 기판 반송 장치, 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 반송 장치, 기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR101962009B1
KR101962009B1 KR1020170039109A KR20170039109A KR101962009B1 KR 101962009 B1 KR101962009 B1 KR 101962009B1 KR 1020170039109 A KR1020170039109 A KR 1020170039109A KR 20170039109 A KR20170039109 A KR 20170039109A KR 101962009 B1 KR101962009 B1 KR 101962009B1
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South Korea
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substrate
gripping
plate
claw
grip
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KR1020170039109A
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Korean (ko)
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KR20170113317A (ko
Inventor
마사아키 후루야
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시바우라 메카트로닉스 가부시끼가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H01L21/67742—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
    • B60K35/20—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor
    • B60K35/28—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor characterised by the type of the output information, e.g. video entertainment or vehicle dynamics information; characterised by the purpose of the output information, e.g. for attracting the attention of the driver
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K35/00—Instruments specially adapted for vehicles; Arrangement of instruments in or on vehicles
    • B60K35/20—Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor
    • B60K35/29—Instruments characterised by the way in which information is handled, e.g. showing information on plural displays or prioritising information according to driving conditions
    • H01L21/67751—
    • H01L21/67757—
    • H01L21/67766—
    • H01L21/68707—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3312—Vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K2360/00—Indexing scheme associated with groups B60K35/00 or B60K37/00 relating to details of instruments or dashboards
    • B60K2360/16—Type of output information
    • B60K2360/167—Vehicle dynamics information
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K2360/00—Indexing scheme associated with groups B60K35/00 or B60K37/00 relating to details of instruments or dashboards
    • B60K2360/18—Information management
    • B60K2360/182—Distributing information between displays

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manipulator (AREA)
KR1020170039109A 2016-03-31 2017-03-28 기판 반송 장치, 기판 처리 장치 및 기판 처리 방법 Active KR101962009B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016073092A JP2017183665A (ja) 2016-03-31 2016-03-31 基板搬送装置、基板処理装置及び基板処理方法
JPJP-P-2016-073092 2016-03-31

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020190030394A Division KR102227108B1 (ko) 2016-03-31 2019-03-18 기판 반송 장치, 기판 처리 장치 및 기판 처리 방법

Publications (2)

Publication Number Publication Date
KR20170113317A KR20170113317A (ko) 2017-10-12
KR101962009B1 true KR101962009B1 (ko) 2019-03-25

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ID=59961904

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KR1020170039109A Active KR101962009B1 (ko) 2016-03-31 2017-03-28 기판 반송 장치, 기판 처리 장치 및 기판 처리 방법
KR1020190030394A Active KR102227108B1 (ko) 2016-03-31 2019-03-18 기판 반송 장치, 기판 처리 장치 및 기판 처리 방법

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KR1020190030394A Active KR102227108B1 (ko) 2016-03-31 2019-03-18 기판 반송 장치, 기판 처리 장치 및 기판 처리 방법

Country Status (5)

Country Link
US (1) US10483151B2 (https=)
JP (1) JP2017183665A (https=)
KR (2) KR101962009B1 (https=)
CN (2) CN112951750B (https=)
TW (2) TWI685051B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7023094B2 (ja) * 2017-12-05 2022-02-21 日本電産サンキョー株式会社 ロボット
CN111348427B (zh) * 2020-03-13 2022-04-22 北京北方华创微电子装备有限公司 机械手
JP7287332B2 (ja) * 2020-04-06 2023-06-06 信越半導体株式会社 ロボットハンド
CN115676352A (zh) * 2021-11-04 2023-02-03 广东聚华印刷显示技术有限公司 基板传输装置及传输方法
KR102803302B1 (ko) 2022-12-29 2025-05-07 세메스 주식회사 기판 반송 로봇 및 기판 처리 장치
CN117690858B (zh) * 2024-02-02 2024-05-03 深圳市森美协尔科技有限公司 机械手组件及探针台

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US20020071756A1 (en) * 2000-12-13 2002-06-13 Gonzalez Jose R. Dual wafer edge gripping end effector and method therefor
US20060008342A1 (en) 2002-10-16 2006-01-12 Sez Ag Device and method for transporting wafer-shaped articles
JP2006313865A (ja) 2005-05-09 2006-11-16 Tatsumo Kk 基板保持装置
US20080199284A1 (en) * 2007-02-15 2008-08-21 Ichiro Mitsuyoshi Substrate processing apparatus

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JPS5852615B2 (ja) 1981-08-05 1983-11-24 レオン自動機株式会社 生地の帯状連続吐出装置
JPH0193736U (https=) * 1987-12-12 1989-06-20
JPH0637906Y2 (ja) * 1988-10-31 1994-10-05 富士通株式会社 板状物体搬送装置
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
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JP3958613B2 (ja) * 2002-03-28 2007-08-15 大日本スクリーン製造株式会社 基板搬送方法、基板搬送装置および基板搬送アーム
JP2006041423A (ja) * 2004-07-30 2006-02-09 Hitachi Naka Electronics Co Ltd 精密薄板材の搬送装置
CN1895974A (zh) * 2005-07-15 2007-01-17 日本电产三协株式会社 基板搬出搬入方法及基板搬出搬入系统
JP4999487B2 (ja) * 2007-02-15 2012-08-15 大日本スクリーン製造株式会社 基板処理装置
JP5157460B2 (ja) * 2008-01-10 2013-03-06 株式会社安川電機 エンドエフェクタ及びそれを備えた搬送装置
JP5548430B2 (ja) * 2008-11-26 2014-07-16 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
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KR101311616B1 (ko) * 2011-08-12 2013-09-26 시바우라 메카트로닉스 가부시끼가이샤 처리 시스템 및 처리 방법
JP5582152B2 (ja) * 2012-02-03 2014-09-03 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及び記憶媒体
JP5993625B2 (ja) * 2012-06-15 2016-09-14 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置、および、基板処理装置
JP6091867B2 (ja) * 2012-12-04 2017-03-08 株式会社ディスコ 搬送機構
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KR102066044B1 (ko) * 2016-06-30 2020-02-11 세메스 주식회사 기판 처리 장치, 인덱스 로봇 및 기판 이송 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020071756A1 (en) * 2000-12-13 2002-06-13 Gonzalez Jose R. Dual wafer edge gripping end effector and method therefor
US20060008342A1 (en) 2002-10-16 2006-01-12 Sez Ag Device and method for transporting wafer-shaped articles
JP2006313865A (ja) 2005-05-09 2006-11-16 Tatsumo Kk 基板保持装置
US20080199284A1 (en) * 2007-02-15 2008-08-21 Ichiro Mitsuyoshi Substrate processing apparatus

Also Published As

Publication number Publication date
KR20170113317A (ko) 2017-10-12
US20170287767A1 (en) 2017-10-05
TW201738995A (zh) 2017-11-01
TWI796544B (zh) 2023-03-21
CN112951750A (zh) 2021-06-11
CN112951750B (zh) 2024-02-27
TW202022976A (zh) 2020-06-16
CN107275270A (zh) 2017-10-20
TWI685051B (zh) 2020-02-11
US10483151B2 (en) 2019-11-19
KR102227108B1 (ko) 2021-03-15
CN107275270B (zh) 2021-03-09
KR20190031462A (ko) 2019-03-26
JP2017183665A (ja) 2017-10-05

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