KR101955869B1 - 레벨링제를 포함하는 금속 전기도금용 조성물 - Google Patents

레벨링제를 포함하는 금속 전기도금용 조성물 Download PDF

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KR101955869B1
KR101955869B1 KR1020187023375A KR20187023375A KR101955869B1 KR 101955869 B1 KR101955869 B1 KR 101955869B1 KR 1020187023375 A KR1020187023375 A KR 1020187023375A KR 20187023375 A KR20187023375 A KR 20187023375A KR 101955869 B1 KR101955869 B1 KR 101955869B1
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composition
compound
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metal
group
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KR20180094140A (ko
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미카엘 지머
코넬리아 뢰거-괴페르트
니콜 마이어
로만 베네딕트 라에터
마르코 아놀트
샤를롯 엠넷
디터 마이어
알렉산더 플뤼겔
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바스프 에스이
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0605Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0616Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • C25D3/32Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/58Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020187023375A 2010-06-01 2011-05-31 레벨링제를 포함하는 금속 전기도금용 조성물 Active KR101955869B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US35004510P 2010-06-01 2010-06-01
US61/350,045 2010-06-01
PCT/IB2011/052385 WO2011151785A1 (en) 2010-06-01 2011-05-31 Composition for metal electroplating comprising leveling agent

Related Parent Applications (1)

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KR1020187004069A Division KR101891473B1 (ko) 2010-06-01 2011-05-31 레벨링제를 포함하는 금속 전기도금용 조성물

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Publication Number Publication Date
KR20180094140A KR20180094140A (ko) 2018-08-22
KR101955869B1 true KR101955869B1 (ko) 2019-03-07

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KR1020187023375A Active KR101955869B1 (ko) 2010-06-01 2011-05-31 레벨링제를 포함하는 금속 전기도금용 조성물
KR1020187004069A Active KR101891473B1 (ko) 2010-06-01 2011-05-31 레벨링제를 포함하는 금속 전기도금용 조성물
KR1020137000075A Active KR101829866B1 (ko) 2010-06-01 2011-05-31 레벨링제를 포함하는 금속 전기도금용 조성물

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KR1020137000075A Active KR101829866B1 (ko) 2010-06-01 2011-05-31 레벨링제를 포함하는 금속 전기도금용 조성물

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US (1) US9683302B2 (https=)
EP (1) EP2576696B1 (https=)
JP (1) JP5933532B2 (https=)
KR (3) KR101955869B1 (https=)
CN (1) CN102939339B (https=)
IL (1) IL223183B (https=)
MY (1) MY164464A (https=)
RU (1) RU2603675C2 (https=)
SG (2) SG10201504251WA (https=)
TW (1) TWI539036B (https=)
WO (1) WO2011151785A1 (https=)

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EP3781728B1 (en) * 2018-04-19 2026-05-06 Basf Se Composition for cobalt or cobalt alloy electroplating
KR102662397B1 (ko) * 2018-10-23 2024-05-02 솔브레인 주식회사 전기도금 조성물 및 전기도금 방법
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KR20220164496A (ko) 2020-04-03 2022-12-13 바스프 에스이 폴리아미노아미드 유형 레벨링제를 포함하는 구리 범프 전착용 조성물
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Also Published As

Publication number Publication date
WO2011151785A1 (en) 2011-12-08
IL223183A0 (en) 2013-02-03
IL223183B (en) 2018-03-29
TWI539036B (zh) 2016-06-21
SG185736A1 (en) 2012-12-28
KR20180017244A (ko) 2018-02-20
EP2576696A1 (en) 2013-04-10
RU2603675C2 (ru) 2016-11-27
SG10201504251WA (en) 2015-07-30
MY164464A (en) 2017-12-15
US9683302B2 (en) 2017-06-20
EP2576696A4 (en) 2014-07-16
JP5933532B2 (ja) 2016-06-15
KR101891473B1 (ko) 2018-08-27
KR20180094140A (ko) 2018-08-22
KR101829866B1 (ko) 2018-02-20
TW201211321A (en) 2012-03-16
EP2576696B1 (en) 2017-10-04
JP2013527325A (ja) 2013-06-27
US20130068626A1 (en) 2013-03-21
RU2012157535A (ru) 2014-07-20
CN102939339B (zh) 2016-02-17
KR20130112018A (ko) 2013-10-11
CN102939339A (zh) 2013-02-20

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